Ngophuhliso olukhawulezayo lweshishini lombane, iintambo zePCB ziya zisiba nobuchule ngakumbi. Uninzi PCB abavelisi basebenzisa ifilimu eyomileyo ukugqiba ukuhanjiswa kwemizobo, kwaye ukusetyenziswa kwefilimu eyomileyo kuya kuthandwa kakhulu. Nangona kunjalo, ndisadibana neengxaki ezininzi kwinkqubo yenkonzo emva kokuthengisa. Abathengi banokungaqondi kakuhle xa besebenzisa ifilimu eyomileyo, eshwankathelwa apha ukuze ibhekiselele.

Indlela yokuphucula iingxaki zefilimu eyomileyo yePCB

1. Kukho imingxuma kwimaski eyomileyo yefilimu
Abathengi abaninzi bakholelwa ukuba emva kokuba umngxuma wenzekile, ubushushu kunye noxinzelelo lwefilimu kufuneka lwandiswe ukuze kuphuculwe amandla okudibanisa. Enyanisweni, lo mbono awuchanekanga, kuba i-solvent ye-resistance layer iya kunyuka ngokugqithisileyo emva kokuba iqondo lokushisa kunye noxinzelelo luphezulu kakhulu, oluya kubangela ukoma. Ifilimu iba yi-brittle kwaye iyancipha, kwaye imingxuma iyaphuka ngokulula ngexesha lophuhliso. Kufuneka sihlale sigcina ukuqina kwefilimu eyomileyo. Ke ngoko, emva kokuvela kwemingxuma, sinokwenza uphuculo kula manqaku alandelayo:

1. Ukunciphisa ukushisa kunye noxinzelelo lwefilimu

2. Ukuphucula ukugrumba nokugqobhoza

3. Ukwandisa amandla okuvezwa

4. Nciphisa ukuphuhlisa uxinzelelo

5. Emva kokubamba ifilimu, ixesha lokupaka akufanele libe lide kakhulu, ukwenzela ukuba lingabangeli ifilimu yeziyobisi ye-semi-fluid ekhoneni ukuba isasazeke kwaye incinci phantsi kwesenzo soxinzelelo.

6. Musa ukwelula ifilimu eyomileyo ngokukhawuleza ngexesha lenkqubo yokuncamathisela

Okwesibini, i-seepage plating yenzeke ngexesha lefilimu eyomileyo ye-electroplating
Isizathu sokutyhutyha kukuba ifilimu eyomileyo kunye nebhodi yobhedu yobhedu ayibopheleli ngokuqinileyo, ukwenzela ukuba isisombululo se-plating sinzulu, kwaye inxalenye “yesigaba esibi” yengubo iya kuba nzima. Ukungena kuninzi lwabavelisi bePCB kubangelwa zezi ngongoma zilandelayo:

1. Amandla okuvezwa aphezulu kakhulu okanye aphantsi

Ngaphantsi kokukhanya kwe-ultraviolet irradiation, i-photoinitiator eye yathatha amandla okukhanya iyachithwa ibe yi-radicals yamahhala ukuze iqalise ukusabela kwe-photopolymerization ukwenza i-molecule enomzimba ongenakunyibilika kwisisombululo se-alkali edibeneyo. Xa ukubonakaliswa kunganelanga, ngenxa ye-polymerization engaphelelanga, ifilimu iyancipha kwaye ithambile ngexesha lenkqubo yophuhliso, okubangelwa imigca engacacanga okanye ifilimu yokukhupha ifilimu, okubangelwa ukudibanisa kakubi phakathi kwefilimu kunye nobhedu; ukuba i-exposure is overexposed, iya kubangela ubunzima bophuhliso kunye nexesha lenkqubo ye-electroplating. I-Warping kunye nokuxobulwa kwenzeka ngexesha lenkqubo, ukwenza i-penetration plating. Ngoko ke, kubaluleke kakhulu ukulawula amandla okuvezwa.

2. Ubushushu befilimu buphezulu kakhulu okanye buphantsi

Ukuba ubushushu befilimu buphantsi kakhulu, ifilimu echasayo ayinakuthambisa ngokwaneleyo kwaye ihambe ngokufanelekileyo, okubangela ukunamathela okungahambi kakuhle phakathi kwefilimu eyomileyo kunye nomphezulu we-laminate yobhedu; ukuba iqondo lobushushu liphezulu kakhulu, i-solvent kunye nezinye izinto eziguquguqukayo ekuchaseni Ukuguquguquka okukhawulezileyo kwezinto kuvelisa amaqamza, kwaye ifilimu eyomileyo iba yi-brittle, ibangele i-warping kunye ne-peeling ngexesha lokutshatyalaliswa kombane we-electroplating, okukhokelela ekungeneni.

3. Uxinzelelo lwefilimu luphezulu kakhulu okanye luphantsi

Xa uxinzelelo lwefilimu luphantsi kakhulu, lunokubangela ukungalingani kwefilimu okanye izikhewu phakathi kwefilimu eyomileyo kunye neplate yethusi kwaye ingaphumeleli ukuhlangabezana neemfuno zamandla okubambisana; ukuba uxinzelelo lwefilimu luphezulu kakhulu, i-solvent kunye ne-voltative components ye-resistance layer iya kunyuka kakhulu, ibangele Ifilimu eyomileyo iba yi-brittle kwaye iya kuphakanyiswa kwaye ihlulwe emva kwe-electroplating shock electric shock.