Ngokuthuthuka okusheshayo kwemboni yezogesi, izintambo ze-PCB ziya ngokuya ziba yinkimbinkimbi. Iningi PCB abakhiqizi basebenzisa ifilimu eyomile ukuze baqedele ukudluliswa kwehluzo, futhi ukusetshenziswa kwefilimu eyomile kuya ngokuya kuthandwa kakhulu. Nokho, ngisahlangabezana nezinkinga eziningi enqubweni yesevisi yangemva kokuthengisa. Amakhasimende anokungaqondi okuningi lapho esebenzisa ifilimu eyomile, efingqiwe lapha ukuze isetshenziswe.

Indlela yokuthuthukisa izinkinga zefilimu eyomile ye-PCB

1. Kunezimbobo kumaski efilimu eyomile
Amakhasimende amaningi akholelwa ukuthi ngemva kokuvela kwembobo, izinga lokushisa nokucindezela kwefilimu kufanele kunyuswe ukuze kuthuthukiswe amandla ayo okubopha. Eqinisweni, lo mbono awulungile, ngoba i-solvent yengqimba yokumelana izokhuphuka ngokweqile ngemva kokuba izinga lokushisa nokucindezela kuphezulu kakhulu, okuzobangela ukoma. Ifilimu iba yi-brittle futhi ibe mncane, futhi izimbobo ziphuka kalula ngesikhathi sokuthuthukiswa. Kufanele ngaso sonke isikhathi silondoloze ukuqina kwefilimu eyomile. Ngakho-ke, ngemuva kokuvela kwezimbobo, singenza ukuthuthukiswa kusuka kumaphuzu alandelayo:

1. Yehlisa izinga lokushisa nokucindezela kwefilimu

2. Thuthukisa ukubhoboza nokubhoboza

3. Khulisa amandla okuchayeka

4. Yehlisa ukukhula kwengcindezi

5. Ngemuva kokunamathisela ifilimu, isikhathi sokupaka akufanele sibe side kakhulu, ukuze singabangeli ifilimu yezidakamizwa ze-semi-fluid ekhoneni ukuthi isakazeke futhi ibe mncane ngaphansi kwesenzo sokucindezela.

6. Musa ukwelula ifilimu eyomile ngokuqinile ngesikhathi sokunamathisela

Okwesibili, ukufakwa kwe-seepage kwenzeka ngesikhathi sefilimu eyomile ye-electroplating
Isizathu se-permeation ukuthi ifilimu eyomile kanye nebhodi eliboshwe ngethusi alibophekile ngokuqinile, ukuze isisombululo se-plating sijulile, futhi ingxenye “yesigaba esibi” yokugqoka iba mkhulu. Ukungena kwabakhiqizi abaningi be-PCB kubangelwa amaphuzu alandelayo:

1. Amandla okuvezwa aphezulu kakhulu noma aphansi

Ngaphansi kokukhanya kwe-ultraviolet, i-photoinitiator emunce amandla okukhanya iboliswa ibe ama-radicals mahhala ukuze iqalise ukusabela kwe-photopolymerization ukuze yakhe i-molecule emise umzimba engancibiliki kusixazululo se-alkali esincibilikayo. Uma ukuchayeka kunganele, ngenxa ye-polymerization engaphelele, ifilimu iyakhukhumala futhi iba thambile ngesikhathi senqubo yokuthuthukiswa, okuholela emigqeni engacacile noma ngisho nokucwecwa kwefilimu, okuholela ekuxhumaneni okubi phakathi kwefilimu nethusi; uma ukuchayeka kuvezwe ngokweqile, kuzodala ubunzima bokuthuthukiswa kanye nangesikhathi senqubo ye-electroplating. Ukungqubuzana nokuxebuka kwenzeka ngesikhathi senqubo, kwakha ucwecwe lokungena. Ngakho-ke, kubaluleke kakhulu ukulawula amandla okuchayeka.

2. Izinga lokushisa lefilimu liphezulu kakhulu noma liphansi

Uma izinga lokushisa lefilimu liphansi kakhulu, ifilimu yokumelana ayikwazi ukuthambisa ngokwanele futhi igeleze kahle, okuholela ekubambeni okungalungile phakathi kwefilimu eyomile kanye nobuso be-laminate ye-copper clad; uma izinga lokushisa liphezulu kakhulu, i-solvent kanye nokunye okuguquguqukayo ekuphikisaneni Ukuguquguquka okusheshayo kwento kukhiqiza ama-bubbles, futhi ifilimu eyomile iba yi-brittle, ibangele i-warping kanye ne-peeling ngesikhathi se-electroplating shock kagesi, okuholela ekungeneni.

3. Ingcindezi yefilimu iphezulu kakhulu noma iphansi

Uma ingcindezi yefilimu iphansi kakhulu, ingabangela indawo yefilimu engalingani noma izikhala phakathi kwefilimu eyomile nepuleti lethusi futhi yehluleke ukuhlangabezana nezidingo zamandla okubopha; uma ukucindezela kwefilimu kuphezulu kakhulu, izingxenye ezincibilikayo neziguquguqukayo zesendlalelo sokumelana zizoshintshashintsha kakhulu, okubangela Ifilimu eyomile iba brittle futhi izophakanyiswa futhi ihlutshiwe ngemva kwe-electroplating electric shock.