Ephrintiwe wesifunda ibhodi ungumnikezeli wokuxhumana kukagesi ezingxenyeni ze-elekthronikhi. Ukuthuthuka kwayo kunomlando weminyaka engaphezu kwekhulu; umklamo wayo ngokuyinhloko uwumklamo wesakhiwo; inzuzo eyinhloko yokusebenzisa amabhodi wesifunda ukunciphisa kakhulu amaphutha ezintambo kanye nomhlangano, futhi kuthuthukiswe izinga lokuzenzekelayo kanye nezinga lomsebenzi wokukhiqiza. Ngokwenombolo yamabhodi wesifunda, ingahlukaniswa ngamabhodi anezinhlangothi ezimbili, amabhodi anezinhlangothi ezimbili, amabhodi anezingqimba ezine, amabhodi anezingqimba eziyisithupha namanye amabhodi esekethe amaningi.

Njengoba ibhodi lesifunda eliphrintiwe lingewona umkhiqizo wokugcina ojwayelekile, incazelo yegama idida kancane. Isibonelo, i-motherboard yamakhompiyutha omuntu siqu ibizwa ngokuthi ibhodi elikhulu, futhi ayikwazi ukubizwa ngokuqondile ngokuthi ibhodi lesifunda. Nakuba kukhona amabhodi wesifunda ebhodini lomama, awafani, ngakho-ke lapho kuhlolwa imboni, lezi zimbili zihlobene kodwa azikwazi ukusho ukuthi ziyefana. Esinye isibonelo: ngenxa yokuthi kunezingxenye zesifunda ezihlanganisiwe ezifakwe ebhodini lesifunda, imidiya yezindaba ibiza ngokuthi ibhodi le-IC, kodwa empeleni ayifani nebhodi lesifunda eliphrintiwe. Sivame ukusho ukuthi ibhodi lesifunda eliphrintiwe libhekisela ebhodini elingenalutho-okungukuthi, ibhodi lesifunda elingenazo izingxenye eziphezulu. Enqubweni yokuklama ibhodi le-PCB nokukhiqizwa kwebhodi lesifunda, onjiniyela abadingi nje kuphela ukuvimbela izingozi kunqubo yokukhiqiza ibhodi le-PCB, kodwa futhi kudingeka bagweme amaphutha okuklama.

Inkinga 1: Ibhodi lesifunda i-short circuit: Kulolu hlobo lwenkinga, ingenye yamaphutha avamile azobangela ngokuqondile ukuthi ibhodi lesifunda lingasebenzi. Isizathu esikhulu kunazo zonke sesekethe yebhodi le-PCB ukuklama kwephedi ye-solder engafanele. Ngalesi sikhathi, ungashintsha i-solder pad eyindilinga ibe yi-oval. Shape, khulisa ibanga phakathi kwamaphoyinti ukuvimbela izifunda ezimfushane. Idizayini engalungile yesiqondisindlela sezingxenye zokuqinisekisa ze-PCB izophinde ibangele ibhodi ukuthi lifinyezeke futhi lihluleke ukusebenza. Isibonelo, uma iphinikhodi ye-SOIC ihambisana negagasi likathayela, kulula ukubangela ingozi ye-short-circuit. Ngalesi sikhathi, isiqondiso sengxenye singashintshwa ngokufanele ukuze siyenze ibe yi-perpendicular to wave tin. Kukhona elinye ithuba elizobangela ukwehluleka kwesifunda esifushane se-PCB, okungukuthi, unyawo olugobile lwe-plug-in. Njengoba i-IPC ibeka ukuthi ubude bephini bungaphansi kuka-2mm futhi kukhona ukukhathazeka ukuthi izingxenye zizowa lapho i-angle yomlenze ogobile inkulu kakhulu, kulula ukubangela isifunda esifushane, futhi i-solder joint kufanele ibe ngaphezulu. ngaphezu kuka-2mm kude nesekethe.

Inkinga 2: Amalunga e-PCB solder aba phuzi ngokusagolide: Ngokuvamile, i-solder kumabhodi esekethe e-PCB inombala osiliva ompunga, kodwa ngezinye izikhathi kuba khona amalunga egolide. Isizathu esiyinhloko sale nkinga ukuthi izinga lokushisa liphezulu kakhulu. Ngalesi sikhathi, udinga kuphela ukwehlisa izinga lokushisa lesithando somlilo.

Inkinga 3: Okuthintana okunombala omnyama kanye ne-granular kuvela ebhodini lesekhethi: Okuxhunyanwa nabo abanombala omnyama noma abancane bavela ku-PCB. Iningi lezinkinga libangelwa ukungcoliswa kwe-solder kanye nama-oxide amaningi axutshwe ethini elincibilikisiwe, okwenza isakhiwo esihlangene solder. crisp. Qaphela ukuthi ungayiphambanisi nombala omnyama obangelwa ukusetshenziswa kwe-solder enokuqukethwe okuphansi kwe-tin. Esinye isizathu sale nkinga ukuthi ukubunjwa kwe-solder esetshenziselwa inqubo yokukhiqiza kushintshile, futhi okuqukethwe kokungcola kuphezulu kakhulu. Kuyadingeka ukwengeza ithini elihlanzekile noma esikhundleni se-solder. Ingilazi enemibala idala izinguquko ezibonakalayo ekwakhekeni kwefayibha, njengokuhlukana phakathi kwezingqimba. Kodwa lesi simo asibangelwa amalunga ampofu e-solder. Isizathu siwukuthi i-substrate ishisa kakhulu, ngakho-ke kuyadingeka ukunciphisa ukushisa kwangaphambi kokushisa nokushisa noma ukwandisa isivinini se-substrate.

Inkinga yesi-4: Izingxenye ze-PCB ezixegayo noma ezilahlekile: Phakathi nenqubo yokuphinda kufakwe i-solder, izingxenye ezincane zingantanta ku-solder encibilikisiwe futhi ekugcineni zishiye i-solder eqondiwe. Izizathu ezingaba khona zokufuduka noma ukutsheka zihlanganisa ukudlidliza noma ukugxuma kwezingxenye ebhodini le-PCB elidayisiwe ngenxa yokusekelwa okwanele kwebhodi lesifunda, izilungiselelo ze-oven reflow, izinkinga zokunamathisela i-solder, kanye nephutha lomuntu.

Inkinga yesi-5: Isekhethi evulekile yebhodi lesifunda: Uma umkhondo uphukile, noma i-solder iphezu kwephedi hhayi ku-lead lead, isifunda esivulekile sizokwenzeka. Kulokhu, akukho ukunamathela noma ukuxhumana phakathi kwengxenye ne-PCB. Njengamasekhethi amafushane, lokhu kungenzeka futhi ngesikhathi senqubo yokukhiqiza noma phakathi nenqubo yokushisela neminye imisebenzi. Ukudlidliza noma ukwelula ibhodi lesifunda, ukuwayeka noma ezinye izici ze-deformation zomshini kuzobhubhisa iminonjana noma amalunga e-solder. Ngokufanayo, amakhemikhali noma umswakama kungabangela i-solder noma izingxenye zensimbi zokugqoka, ezingabangela ingxenye eholela ekuphukeni.

Inkinga yesi-6: Izinkinga zokushisela: Lokhu okulandelayo ezinye zezinkinga ezibangelwa imikhuba yokushisela engalungile: Amalunga aphazamisayo e-solder: Ngenxa yokuphazamiseka kwangaphandle, i-solder iyahamba ngaphambi kokuqina. Lokhu kufana namajoyini e-solder abandayo, kodwa isizathu sihlukile. Ingalungiswa ngokushisa kabusha, futhi amalunga e-solder awaphazanyiswa ngaphandle lapho epholile. I-Cold Welding: Lesi simo senzeka lapho i-solder ingakwazi ukuncibilika ngendlela efanele, okuholela ezindaweni ezimbi kanye nokuxhumana okungathembeki. Njengoba i-solder ngokweqile ivimbela ukuncibilika okuphelele, amalunga abandayo e-solder angase avele. Ikhambi liwukushisa kabusha i-joint futhi ususe i-solder eyeqile. Ibhuloho le-Solder: Lokhu kwenzeka lapho i-solder iwela futhi ixhuma ngokomzimba imikhondo emibili ndawonye. Lokhu kungase kwakhe ukuxhumana okungalindelekile namasekhethi amafushane, okungabangela izingxenye ukuthi zishise noma zishise imikhondo uma i-current iphezulu kakhulu. Ukumanzisa okunganele kwamaphedi, amaphini, noma umkhondo. I-solder eningi kakhulu noma encane kakhulu. Amaphedi aphakanyisiwe ngenxa yokushisa ngokweqile noma i-soldering embi.

Inkinga yesi-7: Ububi bebhodi le-pcb buphinde buthinteke emvelweni: ngenxa yesakhiwo se-PCB ngokwayo, lapho endaweni engathandeki, kulula ukubangela umonakalo ebhodini lesifunda. Ukushintshashintsha kwezinga lokushisa okudlulele noma izinga lokushisa, umswakama owedlulele, ukudlidliza okunamandla amakhulu nezinye izimo zonke izici ezenza ukusebenza kwebhodi kwehle noma kuhlakazeke. Isibonelo, izinguquko ekushiseni kwe-ambient kuzodala ukuguqulwa kwebhodi. Ngakho-ke, amalunga e-solder azobhujiswa, isimo sebhodi sizogoba, noma imikhondo yethusi ebhodini ingase iphulwe. Ngakolunye uhlangothi, umswakama osemoyeni ungabangela i-oxidation, ukugqwala nokugqwala endaweni yensimbi, njengeminonjana yethusi eveziwe, amalunga e-solder, ama-pads, kanye nomkhondo wezingxenye. Ukunqwabelana kokungcola, uthuli noma imfucumfucu ebusweni bezingxenye namabhodi esekethe kunganciphisa futhi ukugeleza komoya nokupholisa kwezingxenye, kubangele ukushisa ngokweqile kwe-PCB kanye nokonakala kokusebenza. Ukudlidliza, ukuwa, ukushaya noma ukugoba i-PCB kuzoyikhubaza futhi kubangele ukuqhekeka kuvele, kuyilapho ukuphakama okuphezulu noma ukugcwala ngokweqile kuzobangela ukuba i-PCB iphuke noma kubangele ukuguga okusheshayo kwezingxenye nezindlela.

Umbuzo 8: Iphutha lomuntu: Iningi lamaphutha ekwenziweni kwe-PCB kudalwa iphutha lomuntu. Ezimweni eziningi, inqubo yokukhiqiza engalungile, ukubekwa okungalungile kwezingxenye kanye nezicaciso zokukhiqiza ezingenamsebenzi kungabangela kufikela ku-64% ukugwema Ukuvela kwamaphutha omkhiqizo.