PCB knowledge

Lolomiina Komiti Faatino Circuie (PCB) e puʻupuʻu mo Lolomi matagaluega Komiti Faatino. E masani lava i mea faʻaʻesega, e tusa ai ma le faʻavae fuafuaina, faia i lomia lomia, lolomiina vaega poʻo se tuʻufaʻatasia o uma conductive ata valaauina lomia matagaluega. O le conductive kalafi o le eletise fesoʻotaʻiga i le va o vaega saunia i luga o le insulated substrate ua taʻua lolomi matagaluega. I lenei auala, o le lolomiga matagaluega poʻo lolomi laina o le maeʻa laupapa ua taʻua o lolomi laupapa laupapa, e taʻua foi o le lolomi laupapa poʻo le lolomi laupapa laupapa.

PCB is indispensable for almost all electronic equipment we can see, from electronic watches, calculators and general computers to computers, communication electronic equipment and military weapon systems. As long as there are no electronic components such as integrated circuits, PCB is used for the electrical interconnection between them. It provides mechanical support for fixed assembly of various electronic components such as integrated circuits, realizes wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provides required electrical characteristics, such as characteristic impedance, etc. At the same time to provide automatic solder blocking graph; Provide identification characters and graphics for component installation, inspection and maintenance.

How are PCBS made? When we open the thumb drive of a general-purpose computer, we can see a soft film (flexible insulating substrate) printed with silver-white (silver paste) conductive graphics and potential graphics. Because of the universal screen printing method to get this graph, so we call this printed circuit board flexible silver paste printed circuit board. Different from the motherboards, graphics cards, network cards, modems, sound cards and printed circuit boards on home appliances we see in Computer City. The base material used is made of paper base (usually used for single side) or glass cloth base (often used for double-sided and multi-layer), pre-impregnated phenolic or epoxy resin, one or both sides of the surface glued with copper book and then laminated curing. This kind of circuit board covers copper book board, we call it rigid board. Then we make a printed circuit board, we call it a rigid printed circuit board. A printed circuit board with printed circuit graphics on one side is called a single-sided printed circuit board, and a printed circuit board with printed circuit graphics on both sides is interconnected on both sides through the metallization of holes, and we call it a double-panel. If using a double lining, two one-way for outer layer or two double lining, two blocks of single outer layer of the printed circuit board, through the positioning system and alternate insulation adhesive materials and conductive graphics interconnection according to design requirement of printed circuit board becomes four, six layer printed circuit board, also known as multilayer printed circuit board. There are now more than 100 layers of practical printed circuit boards.

O le gaosiga gaioiga o PCB is relatively complex, which involves a wide range of processes, from simple mechanical processing to complex mechanical processing, including common chemical reactions, photochemistry, electrochemistry, thermochemistry and other processes, computer-aided design (CAM) and other knowledge. And in the process of production process problems and will always meet new problems and some problems in didn’t find out the reason disappears, because its production process is a kind of continuous line form, any link wrong would caused production across the board or the consequences of a large number of scrap, printed circuit board if there is no recycling scrap, Process engineers can be stressful, so many engineers leave the industry to work in sales and technical services for PCB equipment or materials companies.

Ina ia mafai ona malamalama atili i le PCB, e tatau ona malamalama i le gaosiga gaioiga masani masani tasi-itu, lua-itu lolomi laupapa matagaluega ma masani multilayer laupapa, e faʻalolotoina ai le malamalamaaga o ia.

Lisi itu itu malo lolomi laupapa: – tasi apamemea ofu – blanking i olo, mago), viliina po o le tuʻiina -> lau lolomi laina vaneina mamanu poʻo le faʻaaogaina o ata tifaga teteʻe atu i le faʻamamaina siaki faʻamaonia ipu, apamemea etching ma mago e teteʻe lolomi mea, e fufulu, mago, faʻasologa lolomilo teteʻe teteʻe ata (masani ona faʻaaogaina le suauʻu lanumeamata), UV faʻamalolo e faʻailogaina le kalafi kalafi lolomiina, UV faʻamaloloina, preheating, punching, ma le foliga – eletise matala ma puʻega matagaluega suʻega – olo, faʻamago → muai ufiufi ueloina aneti-oxidant (mago) pe apa-spraying vevela vevela faalaugatasia → asiasiga afifi → maeʻa oloa falegaosimea.

Lua itu itu malo lolomi laupapa: – lua-itu laupapa-apa laupapa – avanoaina – laminated – nc viliina pu pu – asiasiga, deburring scrub – vailaʻau plating (taiala pu puʻamea) – manifinifi apamemea plating (laupapa atoa) – asiasiga scrub -> ata lolomi le lelei matagaluega ata, faʻamalolo (matutu ata / susu ata, faʻaaliga ma atinaʻe) – asiasiga ma lipea le ipu – laina ata plating ma electroplating apa (pala pala tetee o nickel / auro) -> e lolomi mea (ufiufi) – vaneina apamemea – (faʻapipiʻi apa) e fufulu mama, masani ona faʻaaogaina ata faʻasolosolo tetee tetee uelo vevela faʻamalolo suauʻu lanumeamata (ata matala ata tifaga poʻo susu ata, faʻaaliga, atinaʻe ma vevela faʻamalolo, masani vevela faʻamaloloina photosensitive suauʻu lanumeamata) ma mago faamamaina, e vaʻai faʻailoga lolomi amio ata, faʻamaloloina, (apa poʻo uamea puipuia ufiufi ata tifaga) e fausia gaosi, faʻamamaina, faʻamago i eletise on-ese suʻega, afifiina ma maeʻa oloa.
E ala i pu metallization metotia o le gaosiaina o le multilayer gaioiga tafe i le pito i totonu vaega ‘apamemea ofu faʻalua-itu tipiina, olo e faʻavasega tulaga pu, pipiʻi i le mago-ufiufi poʻo le ufiufi e teteʻe atu ai i le faʻaalialia, atinaʻe ma etching ma ata tifaga – totonu totonu coarsening ma oxidation – siaki i totonu – (laina fafo gaosia o le tasi itu itu apamemea ofu laminates, B – fusi pepa, ipu faʻamaopoopo pepa asiasiga, viliina pu pu tulaga) e laminate, tele pulea viliina -> Luga ma siaki i luma o togafitiga ma vailaʻau apamemea plating – laupapa atoa ma manifinifi apamemea plating apamemea asiasiga – pipii i le teteʻe i matutu plating ata tifaga po o ufiufi i plating sooupu e peleue lalo faalauiloaina, atinae ma lipea le ipu – laina ata electroplating – poʻo limasene / auro plating ma electroplating apa taʻitaʻi uʻamea filogia i ata tifaga ma le etching – siaki – laupepa lolomi teteʻe uʻamea faʻamalama poʻo malamalama faʻatosina teteʻe tetee uʻamea – lolomiina faʻailoga ata – (vevela ea faʻalaugatasia poʻo meaolapuipuia ata tifaga ufiufi) ma numera pulea fufulu foliga → faʻamamaina, faʻamago → eletise fesoʻotaʻiga mauaina → maeʻa oloa asiasiga → teuina falegaosimea.

E mafai ona vaʻaia mai le siata faʻagasologa alualu i luma o le multilayer gaioiga e atiaʻe mai le lua-foliga metallization faʻagasologa. I le faʻaopopoga i le lua-itu gaioiga, o loʻo i ai ni tulaga tulaga ese mataupu: metallized pu totonu fesoʻotaʻiga, viliina ma epoxy decontamination, tulaga faʻatulagaina, lamination, ma faʻapitoa mea.

O la matou komipiuta komiti komiti o le masani lava epoxy tioata ie lua-itu lomia laupapa matagaluega lolomi, lea e tasi le itu ua faʻaofi vaega ma le isi itu o le vaega vae uʻamea luga, mafai ona vaʻaia o le soʻoga soʻoga e masani lava, o le vae vae vaevae faʻapitoa. luga o nei solder sooga tatou taʻua o le pad. Aisea e le i ai isi apa uaea apamemea i latou? Aua i le faʻaopopoina i le solder ipu ma isi vaega o le manaʻoga mo soldering, o le vaega o totoe o le pito i luga o loʻo i ai le vaega o galu tetee maopoopo ata tifaga. O lona lauʻeleʻele solder ata tifaga e tele lanumeamata, ma ni nai faʻaaogaina samasama, uliuli, lanumoana, ma isi, o lea o le solder suauu e masani ona taʻua o le lanumeamata lanumeamata i le PCB pisinisi. O lana gaioiga o le puipuia o galu fauina alalaupapa foliga vaaia, faʻaleleia le faʻalelei uʻamea ma sefe solder ma isi. O se tumau puipuia vaega o le lolomi laupapa, mafai ona taʻalo i le matafaioi o le susu, palapala, agamalu ma masini abrasion. Mai fafo, o le pito i luga e lamolemole ma susulu lanumeamata poloka poloka, lea e malamalama i le ata tifaga ipu ma le vevela faʻamalolo suauʻu lanumeamata. E le gata o le foliga mai e sili atu, e taua foʻi o le pad sao e maualuga, ina ia faʻaleleia atili ai le faʻatuatuaina o le soʻoga soʻoga.

E pei ona mafai ona tatou vaʻai mai le laupapa komipiuta, o vaega ua faʻapipiʻiina i auala e tolu. O se plug-in faapipiiina gaioiga mo le auina atu lea o se eletise vaega ua tuu i totonu o se ala-pu i luga o se lolomi laupapa matagaluega. E faigofie ona iloa o le lua-itu lomia laupapa matagaluega lolomi ala i pu e pei ona taʻua i lalo: tasi o se faigofie vaega faʻaaogaina pu; O le lona lua o le vaega faʻaofiina ma faʻalua-itu fesoʻotaʻiga ala i pu; Tolu o se faigofie faʻalua-itu i le pu; Fa o le pito i lalo ipu faapipiiina ma tulaga pu. O isi metotia faʻapipiʻi e lua o le faʻapipiʻi luga ma faʻamau faʻamau saʻo. O le mea moni, malamala faʻapipiʻi faʻapipiʻi tekonolosi mafai ona mafaufauina o se paranesi o luga faʻavasegaina tekonolosi, o le malamala tuʻu faʻapipiʻiina i le lolomi laupapa, ona fesoʻotaʻi lea i le lolomi laupapa e ala uaea metotia metotia poʻo fusi utaina metotia, seevae auala, utupoto taʻimua metotia ma isi afifiina tekonolosi. O le uelo luga o luga o le vaega luga.

Luga tiʻetiʻe tekinolosi maua le taua lelei:

1) Ona o le lolomi laupapa tele faʻateʻaina le lapoʻa ala i le pu po o le tanu pu fesoʻotaʻiga tekonolosi, faʻaleleia le uaea density luga o le lolomi laupapa, faʻaititia le lolomi laupapa eria (masani tasi le tasi vaetolu o le plug-in faʻapipiʻiina), ma mafai foi faʻaititia le numera o vaega faʻavae ma tau o le lolomi laupapa.

2) Faʻaititia le mamafa, faʻaleleia seismic faatinoga, o le faʻaaogaina o colloidal solder ma fou uʻamea tekonolosi, faʻaleleia le lelei oloa ma faʻatuatuaina.

3) Ona o le faʻateleina o uaea density ma le faʻapuupuuina o le umi taitai, o le parasite capacitance ma parasite inductance ua faʻaititia, lea e sili atu agavaʻa i le faʻaleleia o le eletise tapulaʻa o le lolomi laupapa.

4) E faigofie atu ona iloa le otometi nai lo le plug-in faʻapipiʻiina, faʻalelei le faʻapipiʻiina o le saoasaoa ma le galueaina o tagata faigaluega, ma faʻaititia le faʻaputuputuina o le tau e tusa ai.

As can be seen from the above surface safety technology, the improvement of circuit board technology is improved with the improvement of chip packaging technology and surface mounting technology. The computer board that we see now card its surface stick installs rate to rise ceaselessly. In fact, this kind of circuit board reuse transmission screen printing line graphics is unable to meet the technical requirements. Therefore, the ordinary high precision circuit board, its line graphics and welding graphics are basically sensitive circuit and sensitive green oil gaosiga faʻagasologa.

Faatasi ai ma le atinae tulaga o maualuga maualuga laupapa matagaluega, o le gaosiga manaʻoga o matagaluega laupapa ua avea maualuga ma maualuga. Faʻateleina ma sili atu fou tekonolosi o loʻo faʻaaogaina i le gaosiaina o matagaluega laupapa, pei o leisa tekinolosi, photosensitive resin ma isi. O loʻo taua i luga ua na o se papaʻu folasaga o le laualuga, e tele mea i le gaosiga o matagaluega laupapa ona o avanoa avanoa, e pei o le tauaso pu, faamaapeina laupapa, teflon laupapa, photolithography ma isi. Afai e te manaʻo e suʻesuʻe loloto, e tatau ona e galue malosi.