PCB knowledge

Bosilgan Circuie Board (PCB) bosilgan elektron karta uchun qisqacha. Odatda izolyatsiyalash materialida, oldindan belgilangan dizaynga ko’ra, bosilgan sxemadan, bosilgan komponentlardan yoki bosilgan elektron deb ataladigan o’tkazgichli grafikaning kombinatsiyasidan qilingan. Izolyatsiya qiluvchi substratda joylashgan komponentlar orasidagi elektr aloqasining o’tkazuvchan grafigi bosilgan elektron deb ataladi. Shu tarzda, tayyor plataning bosilgan sxemasi yoki bosilgan chizig’i bosilgan elektron karta deb ataladi, uni bosma taxta yoki bosilgan elektron karta deb ham atashadi.

PCB is indispensable for almost all electronic equipment we can see, from electronic watches, calculators and general computers to computers, communication electronic equipment and military weapon systems. As long as there are no electronic components such as integrated circuits, PCB is used for the electrical interconnection between them. It provides mechanical support for fixed assembly of various electronic components such as integrated circuits, realizes wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provides required electrical characteristics, such as characteristic impedance, etc. At the same time to provide automatic solder blocking graph; Provide identification characters and graphics for component installation, inspection and maintenance.

How are PCBS made? When we open the thumb drive of a general-purpose computer, we can see a soft film (flexible insulating substrate) printed with silver-white (silver paste) conductive graphics and potential graphics. Because of the universal screen printing method to get this graph, so we call this printed circuit board flexible silver paste printed circuit board. Different from the motherboards, graphics cards, network cards, modems, sound cards and printed circuit boards on home appliances we see in Computer City. The base material used is made of paper base (usually used for single side) or glass cloth base (often used for double-sided and multi-layer), pre-impregnated phenolic or epoxy resin, one or both sides of the surface glued with copper book and then laminated curing. This kind of circuit board covers copper book board, we call it rigid board. Then we make a printed circuit board, we call it a rigid printed circuit board. A printed circuit board with printed circuit graphics on one side is called a single-sided printed circuit board, and a printed circuit board with printed circuit graphics on both sides is interconnected on both sides through the metallization of holes, and we call it a double-panel. If using a double lining, two one-way for outer layer or two double lining, two blocks of single outer layer of the printed circuit board, through the positioning system and alternate insulation adhesive materials and conductive graphics interconnection according to design requirement of printed circuit board becomes four, six layer printed circuit board, also known as multilayer printed circuit board. There are now more than 100 layers of practical printed circuit boards.

Ning ishlab chiqarish jarayoni PCB is relatively complex, which involves a wide range of processes, from simple mechanical processing to complex mechanical processing, including common chemical reactions, photochemistry, electrochemistry, thermochemistry and other processes, computer-aided design (CAM) and other knowledge. And in the process of production process problems and will always meet new problems and some problems in didn’t find out the reason disappears, because its production process is a kind of continuous line form, any link wrong would caused production across the board or the consequences of a large number of scrap, printed circuit board if there is no recycling scrap, Process engineers can be stressful, so many engineers leave the industry to work in sales and technical services for PCB equipment or materials companies.

PCBni yanada yaxshiroq tushunish uchun, odatda, bir tomonlama, ikki tomonlama bosilgan elektron karta va oddiy ko’p qatlamli kartani ishlab chiqarish jarayonini tushunish, uni chuqurroq tushunish kerak.

Bir tomonlama qattiq bosilgan taxta:-bitta mis qoplamali-tozalash, quritish uchun bo’shliq), burg’ulash yoki zımbalama-> naqshli naqshli yoki quruq plyonka qarshiligidan foydalanib, matkapga qarshilik ko’rsatish uchun mis qotishma va quritishni tekshiring. Skrab, quruq, ekranli bosishga chidamli payvandlash grafigi (tez-tez ishlatiladigan yashil yog ‘), UV belgisining belgi belgisiga qadar ekranni bosib chiqarish, UV bilan ishlov berish, oldindan qizdirish, urish va shakli-ochiq va qisqa tutashuvli elektr sinovlari-tozalash, quritish → oldindan qoplama antioksidant (quruq) yoki qalay bilan püskürtülen issiq havoni tekislash → tekshirish qadoqlash → tayyor mahsulotlar zavodi.

Ikki tomonlama qattiq bosilgan taxta:-ikki tomonlama mis qoplamali taxtalar-qoplama-laminatlangan-burg’ulash uchun qo’llanma teshigi-tekshirish, chig’anoqlarni tozalash-kimyoviy qoplama (hidoyat teshigining metallizatsiyasi)-ingichka mis qoplama (to’liq taxta)-tekshirish uchun skrab-> manfiy elektron grafika ekranini bosib chiqarish, quritish (quruq plyonka/nam plyonka, ta’sir qilish va rivojlanish) – plastinka plitalarini tekshirish va ta’mirlash – qalay qoplama va elektrokaplama (nikel/oltinning korroziyaga chidamliligi) -> bosma materialga (qoplama) – (qalayni yumshatish) toza, tez -tez ishlatib turadigan grafikali ekranli bosish qarshiligi bilan payvandlash, issiqlik bilan ishlov beradigan yashil moy (fotosensitiv quruq plyonka yoki ho’l plyonka, ta’sir qilish, ishlab chiqish va issiqlik bilan ishlov berish, ko’pincha issiqlikka chidamli fotosensitiv yashil moy) va quruq tozalash, bosib chiqarish belgisiga. ishlov berish, tozalash, quritish, elektrni o’chirish sinovlari, qadoqlash va tayyor mahsulotlarni shakllantirish uchun belgilar grafikasi, qotish, (qalay yoki organik himoyalangan payvandlash plyonkasi).
Ichki qatlamga mis qoplamali ikki tomonlama kesish, teshikni burg’ilash uchun tozalash, quruq qoplamaga yopishtirish, ta’sir qilish, ishlab chiqish, qirib tashlash va plyonka-ichki qo’pollash va oksidlanish. -ichki tekshirish-(bir tomonlama mis qoplamali laminatlarning tashqi chiziqli ishlab chiqarilishi, B-biriktiruvchi varaq, plastinka yopishtiruvchi varaqning tekshiruvi, burg’ulashni aniqlash teshigi) laminatga, bir nechta nazorat burg’ulash-> Teshik va ishlov berishdan oldin va kimyoviy mis qoplamasi-to’liq taxta va ingichka mis qoplamali qoplama tekshiruvi – quruq plyonkali qoplamaga yoki qoplamali qoplamaga chidamliligiga yopishib turing, taglikning ta’sirini qoplang, plastinka chizig’ini elektrokaplang – nikel/oltin qoplama va qalay qo’rg’oshinli qotishma qotishmasini plyonka va gravitatsiyaga mahkamlang. Tekshirish – ekranli bosishga chidamli payvandlash grafikasi yoki yorug’lik bilan induktsiya qilingan qarshilik payvandlash grafikasi – bosilgan belgi grafikasi (issiq havoni tekislash yoki organikhimoyalangan payvandlash plyonkasi) va raqamli nazorat Yuvish shakli → tozalash, quritish → elektr aloqasini aniqlash → tayyor mahsulotni tekshirish → qadoqlash fabrikasi.

Jarayonlar sxemasidan ko’rinib turibdiki, ko’p qatlamli jarayon ikki yuzli metallizatsiya jarayonidan ishlab chiqilgan. Ikki tomonlama jarayonga qo’shimcha ravishda, u bir nechta o’ziga xos tarkibga ega: metalllashtirilgan teshikli ichki o’zaro bog’lanish, burg’ulash va epoksi zararsizlantirish, joylashishni aniqlash tizimi, laminatsiya va maxsus materiallar.

Bizning umumiy kompyuter karta kartamiz, asosan, epoksi shisha mato, ikki tomonlama bosilgan elektron karta bo’lib, uning bir tomoni komponentlar kiritilgan, boshqa tomoni esa oyoq payvandlash yuzasi, lehim bo’g’inlari juda muntazam ekanligini, oyoq diskret payvandlash komponenti bu lehim bo’g’inlarining yuzasi biz uni pad deb ataymiz. Nima uchun boshqa mis simlarda qalay yo’q? Chunki lehim plitasi va lehimga bo’lgan ehtiyojning boshqa qismlari bilan bir qatorda, sirtning qolgan qismida to’lqinlarga chidamli payvandlovchi plyonka qatlami mavjud. Uning sirt lehim plyonkasi asosan yashil rangga ega, bir nechtasi sariq, qora, ko’k va boshqalarni ishlatadi, shuning uchun lehim yog’i ko’pincha PCB sanoatida yashil moy deb ataladi. Uning vazifasi – to’lqinli payvandlash ko’prigi hodisasini oldini olish, payvandlash sifatini yaxshilash va lehimni tejash va boshqalar. Bu shuningdek, bosilgan taxtaning doimiy himoya qatlami bo’lib, namlik, korroziya, chiriyotgan va mexanik aşınma rolini o’ynashi mumkin. Tashqi tomondan, sirt silliq va porloq yashil blokirovka qiluvchi plyonka bo’lib, u kino plastinkasiga va issiqlik bilan ishlov beradigan yashil moyga sezgir. Lehim birikmasining ishonchliligini oshirish uchun nafaqat tashqi ko’rinishi, balki yostiqning aniqligi ham muhim.

Kompyuter platasidan ko’rib turganimizdek, komponentalar uchta usulda o’rnatiladi. Elektron komponentning bosilgan elektron kartadagi teshikka joylashtirilishi uchun uzatishni o’rnatish jarayoni. Teshiklar orqali ikki tomonlama bosilgan elektron karta quyidagicha ekanligini ko’rish oson: biri oddiy komponentli kiritish teshigi; Ikkinchisi-komponentni kiritish va teshik orqali ikki tomonlama o’zaro bog’lanish; Uch-bu oddiy ikki tomonlama teshik; To’rt – bu taglik plitasini o’rnatish va joylashtirish teshigi. Boshqa ikkita o’rnatish usuli – sirtni o’rnatish va chipni to’g’ridan -to’g’ri o’rnatish. Aslida, chipni to’g’ridan -to’g’ri o’rnatish texnologiyasi sirtni o’rnatish texnologiyasining bir tarmog’i deb hisoblanishi mumkin, bu to’g’ridan -to’g’ri bosilgan taxtaga yopishtirilgan chip, so’ngra bosilgan taxtaga simli payvandlash usuli yoki kamarga o’rnatish usuli, burilish usuli, nurli qo’rg’oshin usuli va boshqa qadoqlash texnologiyasi. Payvandlash yuzasi komponentlar yuzasida.

Yuzaki o’rnatish texnologiyasi quyidagi afzalliklarga ega:

1) Chop etilgan taxta katta teshik yoki ko’milgan teshiklarni bir-biriga ulash texnologiyasini katta darajada yo’q qilganligi sababli, bosilgan taxtadagi simi zichligini yaxshilaydi, bosilgan taxta maydonini kamaytiradi (umuman, plagin o’rnatilishining uchdan bir qismi) va sonini kamaytirishi mumkin. dizayn qatlamlari va bosma taxtaning narxi.

2) vaznning kamayishi, seysmik ko’rsatkichlarning yaxshilanishi, kolloid lehim va payvandlashning yangi texnologiyasidan foydalanish, mahsulot sifati va ishonchliligini oshirish.

3) simlar zichligi oshishi va qo’rg’oshin uzunligining qisqarishi tufayli, parazit sig’imi va parazitar indüktans kamayadi, bu bosilgan taxtaning elektr parametrlarini yaxshilash uchun qulayroqdir.

4) Plug-in o’rnatishdan ko’ra avtomatlashtirishni amalga oshirish, o’rnatish tezligi va mehnat unumdorligini oshirish va shunga mos ravishda yig’ish narxini pasaytirish osonroq.

As can be seen from the above surface safety technology, the improvement of circuit board technology is improved with the improvement of chip packaging technology and surface mounting technology. The computer board that we see now card its surface stick installs rate to rise ceaselessly. In fact, this kind of circuit board reuse transmission screen printing line graphics is unable to meet the technical requirements. Therefore, the ordinary high precision circuit board, its line graphics and welding graphics are basically sensitive circuit and sensitive green oil ishlab chiqarish jarayoni.

Yuqori zichlikdagi elektron kartochkaning rivojlanish tendentsiyasi bilan elektron plataning ishlab chiqarish talablari tobora ortib bormoqda. Elektron platalar ishlab chiqarishda tobora ko’proq yangi texnologiyalar qo’llanilmoqda, masalan, lazer texnologiyasi, fotosensitiv qatronlar va boshqalar. Yuqorida aytilganlar yuzaning yuzaki ko’rinishi bo’lib, bo’shliq cheklovlari tufayli elektron platalar ishlab chiqarishda ko’p narsa bor, masalan, ko’r teshik, o’rash taxtasi, teflon taxta, fotolitografiya va boshqalar. Agar siz chuqur o’rganmoqchi bo’lsangiz, ko’p harakat qilishingiz kerak.