Ukushisela ibhuloho:

Ibhuloho le-solder lixhuma ngephutha ngogesi phakathi kwabaqhubi elingadingeki ngenxa yocezu oluncane lwe-solder. Ziyaziwa nangokuthi “ama-circuits amafushane” ku PCB isigama. Kunzima ukuthola amabhuloho ashiselwe uma izingxenye zokunweba ezincane zibandakanyekile. Uma ingaxazululwa, ingadala umonakalo kwezinye izinto namabhodi wesifunda. Isigaxa sokushisela (okungukuthi, ungqimba oluncane lwepolymer lusetshenziswa ekulandeleni kwethusi ebhodini lesifunda eliphrintiwe ukulivikela ekwakheni uketshezi futhi kugweme ukwakheka kwebhuloho le-solder phakathi kwamapayipi. Le maski yokushisela iyadingeka ekukhiqizweni ngobuningi kwama-PCBS, kepha ayisebenzi kangako esimweni sezinto ze-PCB ezishiselwe ngesandla. Ukuze amabhodi wesifunda athengiswe nge-othomathikhi, ukugeza kwe-solder namasu wokufaka kabusha we-soldering ahamba phambili kakhulu. Ukugwema ukufakwa kwamabhuloho ngesikhathi somhlangano we-PCB, okokuqala kudingeka ukuthi kunqunywe uhlobo olufanele lwesifihla sokushisela esizosetshenziswa ngesikhathi somhlangano we-PCB. Lokhu kungaba ukucatshangelwa okubucayi lapho uthola ukwakheka okufanele kwe-PCB nohlobo lwe-PCB lwephrojekthi yakho.

Abakhiqizi be-elekthronikhi kufanele baphenye kahle ubuhle nobubi bohlobo ngalunye lwefilimu ye-solder ngaphambi kokuthatha isinqumo sokuthi bakhethe i-epoxy liquid, ifilmage photoimage solder film (LPSM) noma ifilimu eyomile ye-photoimage solder film (DFSM). Bangasiza ngisho nabakhiqizi be-PCB ukuthi babonisane futhi bafune umhlangano ophelele we-PCB ngenqubo ecacile yokukhiqiza yobuchwepheshe ne-PCB. Kubo bonke abakhiqizi be-elekthronikhi, ukuvimbela amaBhuloho ashiselwe kungabandakanya ukutshalwa kwemali okwengeziwe kwesikhathi nemali, kepha kungakusiza ukuthi uzuze izinzuzo ezibalulekile zesikhathi eside.

Izizathu zokushisela ibhuloho:

Imbangela yebhuloho le-weld ukwakheka kwe-PCB okungafanele. Usayizi wephakheji wezinto zalo nomqondo wokusetshenziswa ngokwanele kwezinto ezihlanganisiwe zikhuphukile ngenxa yesidingo sokwethula ubuchwepheshe obumbene nobushesha kakhudlwana. Le yinselelo enkulu kuma-oem, edinga ukwakheka kwe-PCB ephelele futhi efanele. Imvamisa bagcina beyekethise kuzakhiwo ze-PCB ukuze balethe imikhiqizo emisha emakethe.

Ezinye izimbangela zokuvaleka zibandakanya ukungabikho kokumelana nokushisela phakathi kwamapayipi ebhodini lesifunda.Izendlalelo ze-polymer ezinganele emigqeni ye-COPPER trace ye-PCB, evame ukubizwa ngokuthi yi-weld mask, nayo idala izinkinga ngebhuloho le-weld. Lapho isikhala sedivayisi singu-0.5mm noma ngaphansi, isilinganiso esingalungile sokususwa kwephedi nakho kungaba yimbangela yebhuloho. Ukucaciswa okungalungile kwethempulethi kungaholela ekunciphiseni kwe-solder okweqile, okungaholela kumabhuloho. Ngenxa yokufakwa uphawu okungafanele phakathi kwe-PCB ne-solder plate, ubukhulu be-template, amaphutha ekubekweni kwezinto ezingaphezulu komhlaba noma uma kuqhathaniswa ne-PCB, ukubhaliswa okungalungile kwe-solder, ukusatshalaliswa okungalingani kokunamathisela kwe-solder, lezi yizinkinga ezijwayelekile eziholela ebhulohweni le-solder ngesikhathi se-PCB inhlangano.

Izindlela zokuvimbela:

Qinisekisa ukuthi ucingo ngalunye lufakwe ukumelana kokugeleza phakathi kwabo futhi alusebenziseki ngenxa yokubekezelelana okuqinile, bese luchaza ushintsho lomklamo oluzungeze leyo ngxenye ethile. Ithempulethi yokushisela ejiyile engu-0.127 mm, ithempulethi yensimbi engagqwali enokusikwa kwe-laser nayo ilungele isikhala sedivayisi esingu-0.5 mm. Lezi yizinyathelo zokuphepha zokugwema amabhuloho ashiselwe futhi uthole isixazululo somhlangano ophelele we-PCB.