I-substrate ye-PCB ngokwayo yenziwe ngesixhobo esigqunyiweyo nesinganyangekiyo nokugoba. Izinto ezincinci zesekethe ezinokuthi zibonwe phezu komhlaba ziyi-foil yobhedu. Ekuqaleni, ifoyile yobhedu igqunyelelwe kuyo yonke ibhodi yePCB, kodwa indawo ephakathi ixhonywe kwinkqubo yokwenziwa kwemveliso, kwaye inxalenye eseleyo iba luthungelwano lweesekethe ezincinci.

Uyenza njani ifayile ye- IBhodi yePCB

Le migca ibizwa ngokuba zii-conductor okanye ii-wiring kwaye zisetyenziselwa ukubonelela ngokudibana kombane phakathi kweendawo ezikwi-PCB. Ngokuqhelekileyo umbala webhodi ye-PCB uluhlaza okanye umdaka, umbala wepeyinti yokumelana ne-solder. Umaleko okhuselayo wokhuselo olukhusela ucingo lobhedu kunye nokuthintela iindawo ukuba zingadityaniswa kwindawo engafanelekanga.

Ukuveliswa kwePCB kuqala nge “substrate” eyenziwe ngeGlasi Epoxy okanye izinto ezifanayo. Isinyathelo sokuqala kukufota ukufota iintambo phakathi kweendawo ngokuthi “uprinte” imigca emibi yebhodi ye-PCB eyenziweyo kumqhubi wesinyithi ngogqithiso lokuhambisa.

Ubuqhetseba kukusasaza umaleko omncinci wobhedu wobhedu ngaphezulu kobuso bonke kwaye ususe nakuphi na ukugqitha. Ukuba wenza iPCB yeepaneli ezimbini, ifoyile yobhedu iya kugubungela omabini amacala e-substrate. Kwaye ndifuna ukwenza ibhodi ye-multilayer ukuze ndikwazi ukwenza ipleyiti yobuso obuphindwe kabini ngomsonto onamathelayo “cofa ukuvala” ukunyuka kuye.

Emva koko, ukubhola kunye nesingxobo esifunekayo sokuplahla izinto kunokwenziwa kwibhodi ye-PCB. Emva kokugrunjwa ngumatshini njengoko kufuneka, imingxuma kufuneka iPlated ngaphakathi (Plated through-hole Technology, PTH). Emva kokwenza unyango lwesinyithi ngaphakathi komngxuma, imigca yangaphakathi yoluhlu ngalunye inokudityaniswa komnye nomnye.

Imingxuma kufuneka icocwe inkunkuma phambi kokuba kuqaliswe ukucwenga. Kungenxa yokuba i-resin epoxy iya kuvelisa utshintsho lweekhemikhali emva kokufudumeza, kwaye iya kugubungela ungqimba lwangaphakathi lwePCB, ke kufuneka isuswe kuqala. Ukucoca kunye nesingxobo kwenziwa kwinkqubo yemichiza. Okulandelayo, kuya kufuneka ugqume i-wiring engaphandle ngepeyinti ye-solder (i-inki ye-solder) ukuze i-wiring ingachukumisi indawo yesingxobo.

Iilebhile zamacandelo ahlukeneyo zishicilelwa kwibhodi yesekethe ukubonisa indawo elikuyo icandelo ngalinye. Akufanele igqunywe kuyo nayiphi na intambo okanye umnwe wegolide, kungenjalo inokunciphisa ukuthengiswa okanye ukuzinza koqhagamshelo lwangoku. Ukongeza, ukuba kukho uqhagamshelo lwentsimbi, icandelo “lomnwe” lihlala lifakwe igolide ukuqinisekisa unxibelelwano oluphezulu lwangoku xa ufakwa kwisakhiwo sokwandisa.

Ekugqibeleni, kukho uvavanyo. Ukuvavanya i-PCB yesekethe emfutshane okanye isekethe evulekileyo, uvavanyo lwe-optical okanye lwe-elektroniki lunokusetyenziswa. Uvavanyo lwe-Optical lusebenzisa ukuskena ukufumana iziphene kumaleya, ngelixa iimvavanyo zekhompyuter zisebenzisa i-flyprobe ukukhangela lonke unxibelelwano. Uvavanyo lwe-elektroniki luchaneke ngakumbi ekufumaneni iisekethe okanye ikhefu elifutshane, kodwa uvavanyo lwamehlo lunokufumana ngokulula ngakumbi iingxaki ngezikhewu ezingachanekanga phakathi kwabaqhubi.