I-substrate ye-PCB uqobo yenziwe ngento efakwa ngumoya futhi emelana nokugoba. Izinto ezincane zesekethe ezingabonwa phezulu ziyi-copper foil. Ekuqaleni, ucwecwe lwethusi lumbozwe kulo lonke ibhodi le-PCB, kepha ingxenye emaphakathi iyagxila enqubeni yokukhiqiza, futhi ingxenye esele iba inethiwekhi yamasekethe amancane.

Ungayenza kanjani ifayili le- PCB Ibhodi

Le migqa ibizwa ngokuthi ama-conductor noma izintambo futhi isetshenziselwa ukuhlinzeka ngoxhumano lukagesi phakathi kwezingxenye ze-PCB. Imvamisa umbala webhodi le-PCB luhlaza okotshani noma onsundu, okuwumbala wepende lokumelana ne-solder. Isendlalelo esivikelayo sokwahlukanisa esivikela intambo yethusi futhi sivimbele izingxenye ukuthi zishiselwe endaweni engafanele.

Ukwenziwa kwe-PCB kuqala “nge-substrate” eyenziwe nge-Glass Epoxy noma izinto ezifanayo. Isinyathelo sokuqala ukuthwebula izintambo phakathi kwezingxenye “ngokuphrinta” amanegethivu olayini webhodi le-PCB eliklanywe ku-conductor yensimbi ngokudluliswa kwe-Subtractive.

Ubuqili ukusabalalisa ungqimba oluncane lwefoyile yethusi phezu kobuso bonke bese ususa noma ikuphi okweqile. Uma wenza i-PCB enephaneli ephindwe kabili, i-copper foil izomboza izinhlangothi zombili ze-substrate. Futhi ngifuna ukwenza ibhodi ye-multilayer ukuze ukwazi ukwenza ipuleti lobuso eliphindwe kabili elinokunamathisela okwenziwe ngocingo “cindezela ukuvala”.

Okulandelayo, ukubhoboza nokucwenga okudingekayo ukuze kuxhunywe izingxenye kungenziwa ebhodini le-PCB. Ngemuva kokubholwa ngumshini njengoba kudingeka, izimbobo kufanele zifakwe ngaphakathi (Kufakwe ubuchwepheshe obugobhoza ngembobo, i-PTH). Ngemva kokwenza ukwelashwa kwensimbi ngaphakathi komgodi, imigqa yangaphakathi yesendlalelo ngasinye ingaxhunywa komunye nomunye.

Izimbobo kumele zisuswe imfucumfucu ngaphambi kokuthi kuqale ukucwecwa. Lokhu kungenxa yokuthi i-resin epoxy izokhiqiza ushintsho oluthile lwamakhemikhali ngemuva kokushisa, futhi izomboza ungqimba lwangaphakathi lwe-PCB, ngakho-ke kufanele isuswe kuqala. Ukuhlanza nokucwenga kwenziwa ngenqubo yamakhemikhali. Okulandelayo, udinga ukumboza i-wiring engaphandle ngopende we-solder (i-solder ink) ukuze i-wiring ingathinti ingxenye yesilayidi.

Amalebula ezingxenye ezihlukahlukene abe esephrintwa ebhodini lesifunda ukuze abonise indawo yengxenye ngayinye. Akufanele imbozwe kunoma iyiphi izintambo noma umunwe wegolide, ngaphandle kwalokho ingase inciphise ukuqina noma ukuqina koxhumo lwamanje. Ukwengeza, uma kukhona uxhumano lwensimbi, ingxenye “yomunwe” ivamise ukugqitshwa ngegolide ukuze kuqinisekiswe ukuxhumeka kwamanje kwekhwalithi ephezulu uma ifakwe ku-slot yokwandisa.

Ekugcineni, kukhona ukuhlolwa. Ukuhlola i-PCB yesekethe emfishane noma isekethe evulekile, ukuhlolwa kwe-optical noma i-electronic kungasetshenziswa. Ukuhlolwa okubonakalayo kusetshenziswa ukuskena ukuthola ukukhubazeka ezingqimbeni, kuyilapho izivivinyo zikagesi zisebenzisa i-flyprobe ukuhlola konke ukuxhumana. Ukuhlolwa kwe-elekthronikhi kunembe kakhulu ekutholeni amasekhethi amafushane noma amakhefu, kodwa ukuhlola kwe-optical kungathola kalula izinkinga ezinezikhala ezingalungile phakathi kwamakhondakta.