phambi kokuba PCB, iisekethe zazenziwe nge-wiring-to-point. Ukunyaniseka kwale ndlela kusezantsi kakhulu, kuba njengoko iminyaka yesekethe, ukuqhekeka komgca kuya kukhokelela kwikhefu okanye kwisekethe emfutshane yenode yomgca. Ukubhijela inkqubela phambili ephambili kwitekhnoloji yesekethe, ephucula ukuzinza kunye nokutshintsha kwesekethe ngokufaka i-wire-diameter yocingo olujikeleze ikholamu kwindawo yokudibanisa.

Njengoko ishishini le-elektroniki lisuka kwiityhubhu ezincamathelayo kwaye zithunyelwa kwii-semiconductors ze-silicon kunye neesekethe ezihlanganisiweyo, ubungakanani kunye nexabiso lezinto ze-elektroniki zehlile. Ukubakho rhoqo kweemveliso ze-elektroniki kwicandelo labathengi kuye kwabangela ukuba abavelisi bafune izisombululo ezincinci nezineendleko. Yiyo loo nto i-PCB yazalwa. Inkqubo yokuvelisa PCB entsonkothileyo kakhulu. Ukuthatha maleko-PCB ezine njengomzekelo, inkqubo yokuvelisa ikakhulu ibandakanya ubeko PCB, imveliso yebhodi engundoqo, ukuhanjiswa kwangaphakathi kwePCB, ukubhola kwebhodi engundoqo kunye nokuhlolwa, ukugoba, ukubhola, ikhemikhali yemvula yodonga lomngxuma, ukuhanjiswa kwangaphandle kwePCB, iPCB yangaphandle ukudibanisa kunye namanye amanyathelo.

1. Ubume bePCB

Isinyathelo sokuqala semveliso ye-PCB kukucwangcisa kwaye ujonge ubeko lwePCB. Umatshini wokuvelisa we-PCB ufumana iifayile ze-CAD kwinkampani yoyilo lwe-PCB. Kuba isoftware nganye ye-CAD inefomathi yayo eyahlukileyo yefayile, isityalo sePCB siziguqulela kwifomathi emanyeneyo-eyandisiweyo yeGerber RS-274X okanye iGerber X2. Ke injineli yomzi-mveliso iya kujonga ukuba ubeko lwe-PCB luhambelana nenkqubo yemveliso, nokuba kukho naziphi na iziphene kunye nezinye iingxaki.

2. Ukuveliswa kweplate

Coca ipleyiti enxibe ubhedu, ukuba uthuli lunokubangela isiphaluka sokugqibela okanye ikhefu. Umzobo 1 ngumzekeliso we-PCB engama-8, eneneni yenziwe ngamacwecwe e-3 anxitywe ngobhedu (iibhodi ezingundoqo) kunye neefilimu ezimbini zobhedu emva koko zinamatheliswe kunye namashiti aphilisiweyo. Ulandelelwano lwemveliso luqala kwibhodi engundoqo (amanqwanqwa amane okanye amahlanu emigca) embindini, kwaye ngokuqhubekekayo ehlanganiswe ndawonye ngaphambi kokulungiswa. I-4-layer PCB yenziwe ngokufanayo, kodwa yipleyiti enye kuphela kunye neefilimu ezimbini zobhedu.

3. Yenza isekethe yebhodi engundoqo ephakathi

Utshintsho lobeko lwe-PCB yangaphakathi kufuneka kuqala lwenze isekethe yomaleko emibini yebhodi ephambili ye-Core (Core). Emva kokuba icwecwe lobhedu licociwe, umphezulu ugqunywe yifilimu efotayo. Ifilimu iyomelela xa ivezwe kukukhanya, yenze umboniso wokhuselo ngaphezulu kwefoyile yobhedu yesitya esenziwe ngobhedu. Faka izaleko ezimbini zefomathi yoyilo lwePCB kunye namanqanaba amabini ebhodi enxibe ubhedu, kwaye ekugqibeleni faka umaleko ophezulu wefilimu yokuma kwePCB yokuqinisekisa ukuba iindawo ezingaphezulu nezisezantsi zesakhiwo sePBB sokubeka ifilimu zichanekile. I-photosensitizer isebenzisa isibane se-UV ukukhanyisela ifilimu ye-photosensitive kwi-foil foil. Ifilimu yokufota iyomelela phantsi kwefilimu ebonakalayo, kwaye ifilim ebonakalayo enqabileyo ayiqiniswanga phantsi kwefilimu ebonakalayo. Iifoyile zobhedu ezigutyungelwe yifilimu eqinileyo yokujonga iifoto ngumda wobeko lwePCB ofunekayo, olingana nendima ye-inki yomshicileli we-laser ye-PCB yesandla. Ifilimu engaxutywanga iyahlanjwa nge-lye kwaye isiphaluka esifunekayo sobhedu sigutyungelwe yifilimu ephilisiweyo. Iifoyile zobhedu ezingafunekiyo emva koko zigxunyekwe ngesiseko esomeleleyo, njengeNaOH. Krazula ifilimu ephilileyo yokuveza ifreyim yobhedu efunekayo kwisekethe yoyilo lwePCB.

4. Core iplanga ukubhola kunye nokuhlolwa

Icwecwe lesiseko lenziwe ngempumelelo. Emva koko yenza umngxuma olwahlukileyo kwipleyiti yesiseko sokulungelelanisa ngokulula nezinye izinto eziluhlaza. Nje ukuba ibhodi engundoqo icinezelwe ngamanye amacandelo e-PCB, ayinakuguqulwa, ke ngoko kubaluleke kakhulu ukukhangela. Lo matshini uya kuthelekiswa ngokuzenzekelayo kunye nemizobo ubeko PCB ukujonga iimpazamo.

5. Elaminethiweyo

Apha sifuna imathiriyeli eluhlaza ekrwada ebizwa ngokuba yicrafti ephilisiweyo, yona ibhodi engundoqo kunye nebhodi engundoqo (PCB umaleko & GT; 4), kunye nokuncamathela phakathi kwepleyiti engundoqo kunye nefoyile yobhedu engaphandle, kodwa ikwadlala indima ekubambeni. Umaleko esezantsi ngefoyile ye yobhedu kunye maleko ezimbini sheet semi-eqinileyo ziye kwangaphambili ngokusebenzisa umngxuma indawo kunye ipleyiti yentsimbi asezantsi indawo esisigxina, kwaye ke ipleyiti engundoqo elungileyo nayo ibekwe kwindawo umngxuma, kwaye ekugqibeleni izaleko ezimbini iphepha eliqinileyo, iphepha lokuloba lobhedu kunye nocingo lweplate ye-aluminium egutyungelwe kwiplate ephambili. Ibhodi ye-PCB icinezelwe yipleyiti yentsimbi ibekwe kwinkxaso, emva koko ungene kumatshini wokushicilela oshushu wokukhusela. Ubushushu kumatshini wokushicilela oshushu bunyibilika kwi-epoxy resin kwiphepha eliphilisiweyo, libambe isiseko kunye nefoyile yobhedu kunye phantsi koxinzelelo. Emva kokulaminetha, susa ipleyiti yentsimbi ephezulu ecofa i-PCB. Emva koko ipleyiti yoxinzelelo lwealuminiyam iyasuswa. Ipleyiti yealuminium ikwadlala indima ekuhlukaniseni iiPCBS ezahlukeneyo kunye nokuqinisekisa ifreyim yobhedu egudileyo kumaleko angaphandle kwePCB. Omabini amacala e-PCB agutyungelwe ngomaleko wefoyile egudileyo yobhedu.

6. Ukubhola

Ukuqhagamshela izaleko ezine zefoyile yobhedu engachukumisiyo kwi-PCB, qala uqhekeze imingxunya ngePCB, emva koko udibanise iindonga zemingxunya ukuze uqhube umbane. Umatshini we-X-ray wokugrumba usetyenziselwa ukukhangela ibhodi engundoqo yomaleko wangaphakathi. Lo matshini uya kufumana ngokuzenzekelayo kwaye ufumane indawo mngxuma kwibhodi engundoqo, uze wenze imingxuma ukubeka for the PCB ukuqinisekisa ukuba ukubhola zilandelayo ngokusebenzisa embindini indawo mngxuma. Beka iphepha lealuminium kumatshini wepunch uze ubeke iPBB ngaphezulu. Ukuphucula ukusebenza kakuhle, enye ukuya kwiibhodi zePCB ezifanayo zidityaniswe ngokudityaniswa ngokwenani leendlela zePCB. Okokugqibela, i-PCB ephezulu igutyungelwe ngumaleko we-aluminium, umphezulu kunye namanqwanqwa asezantsi e-aluminium ukuze xa kusombiwa i-drill ngaphakathi nangaphandle, ifoyile yobhedu kwi-PCB ayizukukrazula. Kwinkqubo yangaphambili yokupeyinta, i-epoxy enyibilikiweyo yadluliselwa ngaphandle kwePCB, ke kufuneka isuswe. Lo matshini wokugaya usika umda we-PCB ngokungqinelana nolungelelwaniso lwe-XY oluchanekileyo.

7. Imvula eyenziwayo ngobhedu eludongeni

Kuba phantse zonke uyilo lwe-PCB zisebenzisa i-perforations ukudibanisa iileya ezahlukeneyo zemigca, unxibelelwano olufanelekileyo lufuna ifilimu yobhedu engama-25 micron eludongeni lomngxunya. Obu bunzima befilimu yobhedu bufezekiswa ngokwenza i-electroplating, kodwa udonga lomngxunya lwenziwe nge-resin epoxy resin kunye nebhodi ye-fiberglass. Ke ngoko, inyathelo lokuqala kukuqokelela umaleko wezinto eziqhubayo eludongeni lomngxunya, kwaye wenze ifilimu yobhedu e-1-micron kuwo wonke umphezulu wePCB, kubandakanya udonga lomngxunya, ngokufakwa kwemichiza. Yonke le nkqubo, enjengonyango lwekhemikhali kunye nokucoca, ilawulwa ngoomatshini.

8. Dlulisa ubeko lwePCB yangaphandle

Okulandelayo, ubeko lwePCB lwangaphandle luya kudluliselwa kwifoyile yobhedu. Inkqubo iyafana naleyo yenkqubo ye-PCB yebhodi engaphakathi, edluliselwe kwifoyile yobhedu kusetyenziswa ifotokopi ekhutshelweyo kunye nefoto efotayo. Umahluko kuphela kukuba ipleyiti elungileyo iya kusetyenziswa njengebhodi. Ugqithiso lobeko lwangaphakathi lwe-PCB lusebenzisa indlela yokuthabatha kwaye yamkele ipleyiti engentle njengebhodi. I-PCB egutyungelwe yifilimu eqinileyo yokujonga iifoto sisiphaluka, coca ifilimu ye-photosensitive engaqinisekiswanga, ifoyile yobhedu eveziweyo, i-PCB yesekethe yoyilo ikhuselwe yifilimu eqinileyo. Ubeko lwangaphandle lwePCB luhanjiswa ngendlela eqhelekileyo, kwaye ipleyiti elungileyo isetyenziswa njengebhodi. Indawo egqunywe yifilimu ephilisiweyo kwi-PCB yindawo engeyoyomgca. Emva kokucoca ifilimu engaxutywanga, i-electroplating iyenziwa. Akukho bhanyabhanya inokuchongwa ngombane, kwaye akukho bhanyabhanya, kuqala ubhedu emva koko kube nesingxobo se-tin. Emva kokuba ifilimu isuswe, i-alkaline etching iyenziwa, kwaye ekugqibeleni i-tin isuswe. Ipateni yesekethe ishiywe ebhodini kuba ikhuselwe yitin. Ukubamba i-PCB kunye ne-electroplate yobhedu. Njengoko bekutshiwo ngaphambili, ukuze kuqinisekiswe ukuba umngxunya uqhuba kakuhle ngombane, umboniso wobhedu osuswe kudonga lomngxunya kufuneka ubenobunzima beemicron ezingama-25, ke yonke inkqubo iya kulawulwa ngokuzenzekelayo yikhompyuter ukuqinisekisa ukuchaneka kwayo.

9.I-PCB yangaphandle

Okulandelayo, umgca opheleleyo wendibano ugqibezela inkqubo yokudibanisa. Okokuqala, coca ifilimu ephilisiweyo kwibhodi yePCB. Ialkali eyomeleleyo ke isetyenziselwa ukucoca ifoyile yobhedu engafunekiyo egutyungelwe yiyo. Ke ukutyabeka ngetini kwifoyile yobhedu yoyilo lwePCB kususwe ngesisombululo seetin. Emva kokucoca, maleko 4 uyilo PCB igqityiwe.