1. Papa PCB is often layered in use

Ke kumu:

(1) Supplier material or process problems; (2) Poor material selection and copper surface distribution; (3) The storage time is too long, exceeding the storage period, and PCB board is affected with moisture; (4) Improper packaging or storage, moisture.

Countermeasures: choose good packaging, use constant temperature and humidity equipment for storage. ʻO kahi laʻana, i ka hoʻowalewale hilinaʻi PCB, ʻo ka mea hoʻolako i ka hoʻowalewale hoʻokolohua wela e ʻoi aku ma mua o 5 mau manawa o ka non-stratification e like me ke kūlana maʻamau a e hōʻoia ia ia i ka pae o ka laʻana a me kēlā me kēia pōʻaiapili o ka hana nuipa, ʻoiai ʻo ka mea hana nui wale nō koi i nā manawa 2 a hōʻoia i hoʻokahi manawa i kēlā me kēia mau mahina. Hiki i ka hōʻike IR o ka hoʻouka simulate ke pale i ka kahe mai o nā huahana kīnā, kahi mea e pono ai nā hale hana PCB maikaʻi loa. Hoʻohui ʻia, THE Tg o ka papa PCB ma luna o 145 ℃, no laila e palekana.

2, PCB board solder poor

Cause: placed for too long, resulting in moisture absorption, layout pollution and oxidation, black nickel abnormal, anti-welding SCUM (shadow), anti-welding PAD.

Solution: pay close attention to the quality control plan and maintenance standards of PCB factory. For example, for black nickel, it is necessary to see whether the PCB board manufacturer has external gold plating, whether the concentration of gold wire liquid is stable, whether the analysis frequency is enough, whether the regular gold stripping test and phosphorus content test is set up to detect, whether the internal solder test is well executed, etc.

3, PCB board bending board warping

Reasons: unreasonable material selection of suppliers, poor control of heavy industry, improper storage, abnormal operation line, obvious difference in copper area of each layer, not strong enough to make broken hole, etc.

Countermeasures: pack and ship the thin plate after pressurizing it with wood pulp board, so as to avoid deformation in the future. If necessary, add fixture on the patch to prevent the device from bending the board under heavy pressure. PCB needs to simulate IR conditions for testing before packaging, in order to avoid the undesirable phenomenon of plate bending after passing the furnace.

4. Poor impedance of PCB board

Cause: The impedance difference between PCB batches is relatively large.

Solution: the manufacturer is required to attach the batch test report and impedance strip to the delivery, and if necessary, to provide the comparison data of plate inner diameter and plate edge diameter.

5, anti-welding bubble/off

Cause: the selection of anti-welding ink is different, PCB board anti-welding process is abnormal, heavy industry or patch temperature is too high.

Solution: PCB suppliers should establish PCB reliability test requirements and control them in different production processes.