1. PCB ibhodi ivame ukwakheka ngokusetshenziswa

Isizathu:

(1) Izimpahla zomhlinzeki noma izinkinga zenqubo; (2) Ukukhethwa kwezinto ezimbi kanye nokusatshalaliswa kwendawo yethusi; (3) Isikhathi sokugcina side kakhulu, sidlula isikhathi sokugcina, futhi ibhodi le-PCB lithinteka ngomswakama; (4) Ukupakisha okungalungile noma ukugcinwa, umswakama.

Izinyathelo zokuphikisa: khetha ukupakisha okuhle, sebenzisa okokushisa okungapheli nemishini yomswakama ukugcina. Isibonelo, esivivinyweni sokwethenjelwa kwe-PCB, umphakeli ophethe isivivinyo sokushisa esishisayo uthatha ngaphezu kwezikhathi ezi-5 zokungahlukanisi njenge-standard futhi uzoqinisekisa esigabeni sesampula nakuwo wonke umjikelezo wokukhiqizwa kobuningi, ngenkathi umenzi ojwayelekile angasebenza kuphela kudinga izikhathi ezi-2 bese uyiqinisekisa kanye ezinyangeni ezimbalwa. Ukuhlolwa kwe-IR kokufakwa okulingisiwe nakho kungavimbela ukuphuma kwemikhiqizo enesici, okudingeka kumafemu we-PCB amahle kakhulu. Ngaphezu kwalokho, i-Tg yebhodi le-PCB kufanele ibe ngaphezu kuka-145 ℃, ukuze iphephe ngokuqhathaniswa.

2, PCB ibhodi solder abampofu

Imbangela: ibekwe isikhathi eside kakhulu, okuholela ekumuncekeni komswakama, ukungcoliswa kwesakhiwo kanye namachibi, i-nickel emnyama engajwayelekile, i-anti-welding SCUM (isithunzi), i-anti-welding PAD.

Isixazululo: naka uhlelo lokulawulwa kwekhwalithi namazinga wokugcinwa kwemboni ye-PCB. Isibonelo, nge-nickel emnyama, kuyadingeka ukubona ukuthi ngabe umkhiqizi webhodi le-PCB unezingxobo zangaphandle zegolide, noma ngabe ukuhlushwa ketshezi lwensimbi yegolide kuzinzile, noma imvamisa yokuhlaziya yanele, noma ngabe ukuhlolwa kwegolide okujwayelekile nokuhlolwa kokuqukethwe kwe-phosphorus setha ukuthola, ukuthi ngabe ukuhlolwa kwe-solder kwangaphakathi kwenziwa kahle, njll.

3, PCB ibhodi eguqa ibhodi warping

Izizathu: ukukhetha impahla engenangqondo kwabahlinzeki, ukulawulwa okungafanele kwemboni esindayo, ukugcina okungalungile, ulayini wokusebenza ongajwayelekile, umehluko osobala endaweni yethusi kusendlalelo ngasinye, ayinamandla anele okwenza imbobo ephukile, njll.

Izinyathelo zokulwa: pakisha bese uthumela ipuleti elincanyana ngemuva kokulicindezela ngokhuni lwepulp, ukuze ugweme ukusonteka ngokuzayo. Uma kunesidingo, engeza isimbembembe ku-patch ukuvimbela ukuthi idivayisi ingagojeki ibhodi ngaphansi kwengcindezi enkulu. I-PCB idinga ukulingisa izimo ze-IR zokuhlola ngaphambi kokupakisha, ukuze kugwenywe into engathandeki yokugoba kwepuleti ngemuva kokudlula kwesithando somlilo.

4. impedance abampofu PCB ibhodi

Imbangela: Umehluko we-impedance phakathi kwamaqoqo e-PCB mkhulu kakhulu.

Isixazululo: umenzi uyadingeka ukunamathisela umbiko wokuhlolwa kwe-batch kanye ne-impedance strip ekulethweni, futhi uma kunesidingo, ukuhlinzeka ngemininingwane yokuqhathanisa yobubanzi bepuleti langaphakathi nobubanzi bepuleti.

5, anti-Welding bubble / off

Isizathu: ukukhethwa kukayinki wokulwa nokushisela kuhlukile, inqubo yebhodi yokulwa nokushisela ye-PCB ayijwayelekile, imboni esindayo noma izinga lokushisa le-patch liphezulu kakhulu.

Isixazululo: Abahlinzeki be-PCB kufanele basungule izidingo zokuhlola ukuthembeka kwe-PCB futhi bazilawule kuzinqubo ezahlukahlukene zokukhiqiza.