1. Ibhodi PCB ihlala ilayishwe ukusetyenziswa

Isizathu:

(1) Izinto zomthengisi okanye iingxaki zenkqubo; (2) Ukukhethwa kwezinto ezimbi kunye nokusasazwa komphezulu wobhedu; (3) Ixesha lokugcina lide kakhulu, lidlula ixesha lokugcina, kwaye ibhodi ye-PCB ichaphazeleka ngokufuma; (4) Ukupakisha okungalunganga okanye ukugcinwa, ukufuma.

Izinto zokulwa: khetha ukupakisha okuhle, sebenzisa ubushushu kunye nezixhobo zokugcina ukufuma. Umzekelo, kuvavanyo lokuthembeka lwe-PCB, umthengisi ophethe uvavanyo loxinzelelo lwe-thermal uthatha ngaphezulu kwamaxesha ama-5 okungahlanjululwa njengomgangatho kwaye uya kuqinisekisa kwinqanaba lesampula nakuwo wonke umjikelo wemveliso yobuninzi, ngelixa umenzi ngokubanzi enokuthi ifuna amaxesha ama-2 kwaye uyiqinisekise kube kanye kwiinyanga ezimbalwa. Uvavanyo lwe-IR lokunyusa okulingisiweyo lunokuthintela ukuphuma kweemveliso ezineziphene, eziyimfuneko kwimizi-mveliso yePCB ebalaseleyo. Ukongeza, i-TG yebhodi ye-PCB kufuneka ibe ngaphezulu kwe-145 ℃, ukuze ikhuseleke noko.

2, ibhodi PCB solder ulihlwempu

Isizathu: sibekwe ixesha elide, sikhokelela ekufunxeni ukufuma, ungcoliseko lobume kunye ne-oxidation, i-nickel emnyama engaqhelekanga, i-anti-welding SCUM (isithunzi), i-anti-welding PAD.

Isixazululo: nikela ingqalelo kwisicwangciso solawulo lomgangatho kunye nemigangatho yolondolozo lwefektri yePCB. Umzekelo, i-nickel emnyama, kubalulekile ukubona ukuba ngaba umenzi webhodi ye-PCB unesingxobo segolide sangaphandle, nokuba uxinizelelo lolwelo lwegolide luzinzile, nokuba uhlalutyo lwamaxesha lwanele, nokuba ngaba uvavanyo lwegolide oluqhelekileyo kunye novavanyo lomxholo we-phosphorus ukuseta ukufumanisa, nokuba ngaba uvavanyo lwangaphakathi lwe-solder lwenziwe kakuhle, njl.

3, ibhodi PCB ukugoba ibhodi warping

Izizathu: ukukhetha izinto ezingenangqondo zabathengisi, ulawulo olubi lomzi mveliso onzima, ukugcinwa okungafanelekanga, umgca wokusebenza ongaqhelekanga, umahluko ocacileyo kwindawo yobhedu kulwahlulo ngalunye, lomelele ngokwaneleyo ukwenza umngxunya owaphukileyo, njl.

Amanyathelo okuchasana: pakisha kwaye uthumele ipleyiti ebhityileyo emva kokuyicinezela ngebhodi yeplanga yomthi, ukuthintela ukuvela de kube lixesha elizayo. Ukuba kukho imfuneko, yongeza indawo yokulungiselela ukukhusela isixhobo ekugoba ibhodi phantsi koxinzelelo olunzima. I-PCB ifuna ukulinganisa iimeko ze-IR zovavanyo phambi kokupakisha, ukwenzela ukuthintela imeko engathandekiyo yokugoba kwepleyiti emva kokudlula eziko.

4. Ukungahambi kakuhle kwibhodi ye-PCB

Isizathu: Umahluko we-impedance phakathi kweebhetshi ze-PCB mkhulu kakhulu.

Isisombululo: umenzi uyafuneka ukuba ancamathisele ingxelo yovavanyo lwe-batch kunye ne-impedance strip kunikezelo, kwaye ukuba kukho imfuneko, ukubonelela ngedatha yokuthelekisa yeplate yangaphakathi enobubanzi kunye nobubanzi beplate.

5, i-anti-welding bubble / icinyiwe

Isizathu: ukhetho lwe-inki echasene ne-welding yahlukile, inkqubo ye-PCB yokulwa ne-welding ayiqhelekanga, ishishini elinzima okanye ubushushu beepatch buphezulu kakhulu.

Isisombululo: Abathengisi be-PCB kufuneka baseke iimfuno zokuvavanywa kokuvavanywa kwe-PCB kwaye babalawule kwiinkqubo ezahlukeneyo zemveliso.