Menene takamaiman aikace-aikace na alumina yumbu substrate

A cikin tabbatar da PCB, alumina yumbu substrate an yi amfani da shi sosai a masana’antu da yawa. Koyaya, a cikin takamaiman aikace-aikacen, kauri da ƙayyadaddun kowane yanki na yumbu alumina sun bambanta. Menene dalilin hakan?

1. An ƙayyade kauri na yumbura yumbura alumina bisa ga aikin samfurin
Girman kauri na alumina yumbura mai kauri, mafi kyawun ƙarfi da ƙarfin juriya, amma ƙarancin zafin jiki ya fi na bakin ciki muni; Akasin haka, mafi ƙarancin alumina yumbura mai yumbura, ƙarfi da juriya na matsa lamba ba su da ƙarfi kamar lokacin farin ciki, amma haɓakar thermal yana da ƙarfi fiye da lokacin farin ciki. A kauri na alumina yumbu substrate ne kullum 0.254mm, 0.385mm da 1.0mm / 2.0mm / 3.0mm / 4.0 mm, da dai sauransu

2. Ƙayyadaddun ƙayyadaddun bayanai da girma na alumina yumbu substrates kuma sun bambanta
Gabaɗaya, alumina yumbu substrate ya fi ƙanƙanta da allon PCB na yau da kullun, kuma girmansa gabaɗaya bai wuce 120mmx120mm ba. Wadanda suka wuce wannan girman gabaɗaya suna buƙatar a keɓance su. Bugu da kari, girman alumina yumbu substrate ba shine mafi girma ba, musamman saboda kayan aikin sa na yumbu. A cikin tsarin tabbatar da PCB, yana da sauƙi don haifar da rarrabuwar farantin, yana haifar da ɓarna mai yawa.

3. Siffar alumina yumbu substrate ya bambanta
Abubuwan yumbura na alumina galibi faranti ɗaya ne kuma masu gefe biyu, tare da siffofi na rectangular, murabba’i da madauwari. A cikin tabbatar da PCB, bisa ga buƙatun tsari, wasu kuma suna buƙatar yin tsagi akan tsarin yumbura da tsarin rufe madatsar ruwa.

Siffofin yumbura alumina sun haɗa da:
1. Ƙarfafa damuwa da siffar barga; Ƙarfin ƙarfi, haɓakar haɓakar thermal da babban rufi; Ƙarfin mannewa da anti-lalata.
2. Kyakkyawan aikin sake zagayowar thermal, tare da hawan keke na 50000 da babban aminci.
3. Kamar PCB allon (ko IMS substrate), zai iya etch tsarin na daban-daban graphics; Babu gurbacewa da gurbacewa.
4. Yanayin zafin aiki: – 55 ℃ ~ 850 ℃; Ƙimar haɓakar haɓakar thermal yana kusa da silicon, wanda ke sauƙaƙa aiwatar da tsarin samar da wutar lantarki.

Menene fa’idodin alumina yumbura mai yumbu?
A. Thermal fadada coefficient na yumbu substrate yana kusa da na silicon guntu, wanda zai iya ajiye mika mulki Layer Mo guntu, ajiye aiki, kayan da rage farashin;
B. Welding Layer, rage thermal juriya, rage rami da kuma inganta yawan amfanin ƙasa;
C. Layin layi na 0.3mm lokacin farin ciki na tagulla shine kawai kashi 10% na allon da’ira na yau da kullun;
D. Ƙarƙashin zafin jiki na guntu yana sa kunshin guntu ya zama cikakke sosai, wanda ya inganta ƙarfin ƙarfin gaske kuma yana inganta amincin tsarin da na’urar;
E. Nau’in (0.25mm) yumbu mai yumbu zai iya maye gurbin BeO ba tare da lalata muhalli ba;
F. Large, 100A halin yanzu ci gaba da wucewa ta 1mm fadi da 0.3mm lokacin farin ciki jiki jan karfe, da kuma zafin jiki tashi ne game da 17 ℃; 100A halin yanzu ci gaba ta hanyar 2mm fadi da 0.3mm lokacin farin ciki jiki jan karfe, da kuma yawan zafin jiki Yunƙurin ne kawai game da 5 ℃;
G. Low, 10 × Thermal juriya na 10mm yumbu substrate, 0.63mm m yumbu substrate, 0.31k / w, 0.38mm m yumbu substrate da 0.14k / w bi da bi;
H. Babban ƙarfin juriya, tabbatar da amincin sirri da ikon kariya na kayan aiki;
1. Gane sababbin hanyoyin tattarawa da haɗuwa, don haka samfuran suna da haɓaka sosai kuma an rage ƙarar.