Popanda zamakono PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Tekinoloje ya HDI imalola okonza mapulani kuyika zigawo zing’onozing’ono pafupi ndi wina ndi mnzake. Kuchuluka kwa phukusi, kukula kwa bolodi ndi zigawo zochepa kumabweretsa kusintha kwakapangidwe ka PCB.

Ubwino wa HDI

Let’s take a closer look at the impact. Kuchulukitsa kwa phukusi kumatilola kufupikitsa njira zamagetsi pakati pazinthu. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Kuchepetsa kuchuluka kwa zigawo kumatha kuyika kulumikizana kambiri pa bolodi lomwelo ndikusintha mayikidwe azinthu, zingwe ndi kulumikizana. Kuchokera pamenepo, titha kuyang’ana pa njira yotchedwa interconnect pa Layer (ELIC), yomwe imathandizira magulu opanga kuti asunthire kuchoka pama board ochepa kupita owonda osinthasintha kuti akhalebe ndi mphamvu ndikuloleza a HDI kuwona kuchuluka kwa magwiridwe antchito.

HDI PCBS rely on lasers rather than mechanical drilling. Komanso, kapangidwe ka HDI PCB kamatulutsa kabowo kakang’ono komanso kakang’ono kakang’ono ka pad. Kuchepetsa kutseguka kunaloleza gulu laopanga kuti liwonjezere dongosolo la bolodi. Kufupikitsa njira zamagetsi ndikuthandizira kulumikizana kwakukulu kumathandizira kukhulupirika kwa mapangidwe ndikuthandizira kukonza ma siginolo. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Mapangidwe a HDI PCB sagwiritsa ntchito kudzera m’mabowo, koma mabowo akhungu ndikuyika m’manda. Kuyika manda mozungulira komanso molondola kumachepetsa kuthamanga kwa mbale ndikuletsa mwayi uliwonse wopindika. Kuphatikiza apo, mutha kugwiritsa ntchito mabowo otukuka kuti muthandizire kulumikizana komanso kukonza kudalirika. Kugwiritsa ntchito kwanu mapadi kungathandizenso kuchepetsa kuwonongeka kwa chizindikiro pochepetsa kuchepa kwa mtanda ndikuchepetsa zovuta zamatenda.

Kupanga kwa HDI kumafunikira mgwirizano

Kupanga kwamagetsi (DFM) kumafunikira kulingalira, kulondola kwa kapangidwe ka PCB ndi kulumikizana kosasintha ndi opanga ndi opanga. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Mwachidule, kapangidwe kake, prototyping ndi kapangidwe ka HDI PCBS kumafunikira kuyanjana ndi chidwi ndi malamulo apadera a DFM omwe akugwira ntchitoyi.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Dziwani zida zanu zoyang’anira dera ndi malongosoledwe

Chifukwa kupanga kwa HDI kumagwiritsa ntchito mitundu yosiyanasiyana ya ma pobowola laser, zokambirana pakati pa gulu lopanga, wopanga ndi wopanga ayenera kuganizira za mtundu wa matabwa pokambirana za kuboola. Ntchito yogulitsa yomwe imalimbikitsa mapangidwe ake atha kukhala ndi zofunikira pakukula ndi kulemera komwe kumasunthira zokambiranazo mbali ina. High frequency applications may require materials other than standard FR4. Kuphatikiza apo, zisankho zamtundu wa zinthu za FR4 zimakhudza zisankho pakusankhidwa kwa makina obowolera kapena zida zina zopangira. Ngakhale makina ena amabowola mkuwa mosavuta, ena samalowa mosalekeza.

Kuphatikiza pa kusankha mtundu wazinthu zoyenera, gulu lopanga liyeneranso kuwonetsetsa kuti wopanga ndi wopanga amatha kugwiritsa ntchito makulidwe olondola ambale ndi ma plating. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Ngakhale mbale zowirira zimaloleza timipanda ting’onoting’ono, zofunikira pamakonzedwewo zitha kutanthauzira mbale zowonda zomwe sizingachitike m’malo ena azachilengedwe. Gulu lopanga limayenera kuwona ngati wopanga ali ndi luso logwiritsa ntchito njira ya “interconnect layer” ndikubowola mabowo pakuya kolondola, ndikuwonetsetsa kuti mankhwala omwe amagwiritsidwa ntchito popanga ma electroplating adzaza mabowo.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Chifukwa cha ELIC, mapangidwe a PCB atha kugwiritsa ntchito kulumikizana kowongoka, kovuta kofunikira pama circuits othamanga kwambiri. Chifukwa ELIC imagwiritsa ntchito tinthu tating’onoting’ono tomwe timadzaza mkuwa polumikizirana, imatha kulumikizidwa pakati pazigawo ziwiri popanda kufooketsa bolodi.

Kusankhidwa kwa chigawo kumakhudza masanjidwe

Zokambirana zilizonse ndi opanga ndi opanga zokhudzana ndi kapangidwe ka HDI ziyeneranso kuyang’ana pamakonzedwe olondola azipangizo zazitali kwambiri. The selection of components affects wiring width, position, stack and hole size. Mwachitsanzo, mapangidwe a HDI PCB amakhala ndi gulu lamagulu owirikiza (BGA) ndi BGA yolowa bwino yomwe imafuna kuti pini ithawe. Zinthu zomwe zimasokoneza magetsi ndikuwonetsa kukhulupirika komanso kuwonetsetsa kwa bolodi ziyenera kuzindikirika mukamagwiritsa ntchito zida izi. Izi zikuphatikiza kukwaniritsa kudzipatula koyenera pakati pazigawo zakumtunda ndi zapansi kuti muchepetse crosstalk ndikulamulira EMI pakati pazigawo zamkati.Symmetrically spaced components will help prevent uneven stress on the PCB.

Samalani ndi chizindikiro, mphamvu ndi kukhulupirika kwakuthupi

Kuphatikiza pakukweza kukhulupirika kwa siginecha, mutha kulimbikitsanso kukhulupirika kwamphamvu. Chifukwa HDI PCB imasunthira wosanjikiza pafupi ndi pamwamba, mphamvu yamphamvu imakonzedwa. Chipilala chapamwamba chimakhala ndi chosanjikiza komanso chosanjikiza magetsi, chomwe chimatha kulumikizidwa ndi chosanjikiza kudzera m’mabowo akhungu kapena ma microholes, ndikuchepetsa mabowo a ndege.

HDI PCB imachepetsa kuchuluka kwa mabowo kudzera mkatikati mwa bolodi. In turn, reducing the number of perforations in the power plane provides three major advantages:

Dera lokulirapo lamkuwa limadyetsa AC ndi DC pakadali pano mu pini yamagetsi yamagetsi

L resistance decreases in the current path

L Chifukwa chotsikira pang’ono, kusinthaku kolondola kumatha kuwerengera pini yamagetsi.

Mfundo ina yofunika pokambirana ndikusunga mzere wocheperako, kutalikirana bwino ndikufanana. Patsamba lomalizirali, yambani kukwaniritsa makulidwe amkuwa amtundu umodzi komanso mawonekedwe ofanana pakapangidwe ndikupitilira pakupanga ndi kupanga.

Kupanda malo otetezeka kumatha kubweretsa zotsalira zamafilimu nthawi yamafilimu owuma amkati, zomwe zimatha kubweretsa madera azifupi. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Magulu opanga ndi opanga akuyeneranso kulingalira zofananira njanji ngati njira yowongolera kutsekemera kwa ma siginecha.

Khazikitsani ndikugwiritsa ntchito malamulo apangidwe

Mawonekedwe apamwamba kwambiri amafunika magawo ang’onoang’ono akunja, kulumikizana bwino komanso malo olimbirana, motero amafunika njira ina yopangira. Njira yopangira HDI PCB imadalira kubowola laser, mapulogalamu a CAD ndi CAM, njira zowonera molunjika za laser, zida zapadera zopangira, ndi ukatswiri woyendetsa. Kupambana kwa ntchito yonse kumatengera gawo pamalamulo opanga omwe amafunikira ma impedance, kukula kwa kondakitala, kukula kwa dzenje, ndi zina zomwe zimakhudza masanjidwewo. Kupanga malamulo atsatanetsatane amathandizira kusankha wopanga kapena wopanga bolodi lanu ndikuyika maziko olumikizirana pakati pa magulu.