Laisi igbalode PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Imọ -ẹrọ HDI ngbanilaaye awọn apẹẹrẹ lati gbe awọn paati kekere sunmọ ara wọn. Iwọn iwuwo ti o ga julọ, iwọn igbimọ ti o kere ati awọn fẹlẹfẹlẹ diẹ ni o mu ipa cascading wa si apẹrẹ PCB.

Anfani ti HDI

Let’s take a closer look at the impact. Alekun iwuwo package gba wa laaye lati kuru awọn ọna itanna laarin awọn paati. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Idinku nọmba ti awọn fẹlẹfẹlẹ le gbe awọn isopọ diẹ sii lori igbimọ kanna ati ilọsiwaju ipo paati, wiwa ati awọn asopọ. Lati ibẹ, a le dojukọ imọ -ẹrọ kan ti a pe ni isopọ fun Layer (ELIC), eyiti o ṣe iranlọwọ fun awọn ẹgbẹ apẹrẹ lati gbe lati awọn igbimọ ti o nipọn si awọn rirọ tinrin lati ṣetọju agbara lakoko gbigba HDI lati rii iwuwo iṣẹ.

HDI PCBS rely on lasers rather than mechanical drilling. Ni idakeji, apẹrẹ HDB PCB n ṣe abajade ni iho kekere ati iwọn paadi kekere. Idinku iho gba laaye ẹgbẹ apẹrẹ lati mu alekun ti agbegbe igbimọ pọ si. Kikuru awọn ipa ọna itanna ati muu ṣiṣẹ pọ si aladanla diẹ sii mu iduroṣinṣin ifihan ti apẹrẹ ati yiyara sisẹ ifihan. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Awọn apẹrẹ PCB HDI ko lo nipasẹ awọn iho, ṣugbọn awọn afọju ati awọn iho sin. Staggered and accurate placement of burial and blind holes reduces mechanical pressure on the plate and prevents any chance of warping. In addition, you can use stacked through-holes to enhance interconnect points and improve reliability. Lilo rẹ lori awọn paadi tun le dinku pipadanu ifihan nipasẹ idinku idaduro agbelebu ati idinku awọn ipa parasitic.

HDI manufacturability requires teamwork

Apẹrẹ iṣelọpọ (DFM) nilo iṣaro kan, deede ọna apẹrẹ PCB ati ibaraẹnisọrọ deede pẹlu awọn aṣelọpọ ati awọn aṣelọpọ. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Ni kukuru, apẹrẹ, apẹẹrẹ ati ilana iṣelọpọ ti HDI PCBS nilo iṣọpọ ẹgbẹ to sunmọ ati akiyesi si awọn ofin DFM kan pato ti o wulo fun iṣẹ akanṣe naa.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Mọ awọn ohun elo igbimọ Circuit rẹ ati awọn pato

Nitori iṣelọpọ HDI nlo awọn oriṣi ti awọn ilana liluho laser, ijiroro laarin ẹgbẹ apẹrẹ, olupese ati olupese gbọdọ dojukọ iru ohun elo ti awọn lọọgan nigba ijiroro ilana liluho. Ohun elo ọja ti o ṣe ilana ilana apẹrẹ le ni iwọn ati awọn ibeere iwuwo ti o gbe ibaraẹnisọrọ ni itọsọna kan tabi omiiran. High frequency applications may require materials other than standard FR4. Ni afikun, awọn ipinnu nipa iru ohun elo FR4 ni ipa lori awọn ipinnu nipa yiyan awọn eto liluho tabi awọn orisun iṣelọpọ miiran. Lakoko ti diẹ ninu awọn ọna ṣiṣe lilu nipasẹ Ejò ni rọọrun, awọn miiran ko wọ inu awọn okun gilasi nigbagbogbo.

Ni afikun si yiyan iru ohun elo to tọ, ẹgbẹ apẹrẹ gbọdọ tun rii daju pe olupese ati olupese le lo sisanra awo to tọ ati awọn imuposi fifẹ. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Botilẹjẹpe awọn awo ti o nipọn gba aaye fun awọn iho kekere, awọn ibeere ẹrọ ti iṣẹ akanṣe le ṣalaye awọn awo ti o tẹẹrẹ ti o farahan si ikuna labẹ awọn ipo ayika kan. Ẹgbẹ apẹrẹ naa ni lati ṣayẹwo pe olupese ni agbara lati lo ilana “interconnect Layer” ati awọn iho lu ni ijinle to tọ, ati rii daju pe ojutu kemikali ti a lo fun itanna yoo kun awọn iho naa.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Bi abajade ti ELIC, awọn apẹrẹ PCB le lo anfani ti ipon, awọn isopọ eka ti o nilo fun awọn iyika iyara to gaju. Nitori ELIC nlo awọn microholes ti o kun fun idẹ fun isopọpọ, o le sopọ laarin eyikeyi fẹlẹfẹlẹ meji laisi irẹwẹsi igbimọ Circuit.

Aṣayan paati ni ipa lori ipilẹ

Eyikeyi awọn ijiroro pẹlu awọn aṣelọpọ ati awọn aṣelọpọ nipa apẹrẹ HDI yẹ ki o tun dojukọ lori ipilẹ tootọ ti awọn paati iwuwo giga. The selection of components affects wiring width, position, stack and hole size. Fun apẹẹrẹ, awọn apẹrẹ HDI PCB ni igbagbogbo pẹlu titobi akoj rogodo ti o nipọn (BGA) ati BGA ti o ni aye to dara ti o nilo ona abayo pin. Awọn ifosiwewe ti o ṣe ibajẹ ipese agbara ati iduro ifihan bi daradara bi iduroṣinṣin ti ara ti igbimọ gbọdọ jẹ idanimọ nigba lilo awọn ẹrọ wọnyi. Awọn ifosiwewe wọnyi pẹlu iyọrisi ipinya ti o yẹ laarin awọn fẹlẹfẹlẹ oke ati isalẹ lati dinku iṣipopada iṣọpọ ati lati ṣakoso EMI laarin awọn fẹlẹfẹlẹ ifihan inu.Symmetrically spaced components will help prevent uneven stress on the PCB.

Pay attention to signal, power and physical integrity

Ni afikun si ilọsiwaju iduroṣinṣin ifihan, o tun le mu iduroṣinṣin agbara pọ si. Nitori HDB PCB n gbe fẹlẹfẹlẹ ilẹ ti o sunmọ ilẹ, iduroṣinṣin agbara ti ni ilọsiwaju. Ipele oke ti igbimọ naa ni fẹlẹfẹlẹ ilẹ ati fẹlẹfẹlẹ ipese agbara, eyiti o le sopọ si fẹlẹfẹlẹ ilẹ nipasẹ awọn iho afọju tabi awọn microholes, ati dinku nọmba awọn iho ọkọ ofurufu.

HDI PCB dinku nọmba ti awọn iho nipasẹ iho-inu ti igbimọ. In turn, reducing the number of perforations in the power plane provides three major advantages:

Agbegbe ti o tobi ti awọn ifunni AC ati DC lọwọlọwọ sinu PIN agbara chiprún

L resistance decreases in the current path

L Nitori ailagbara kekere, lọwọlọwọ iyipada to tọ le ka PIN agbara.

Another key point of discussion is to maintain minimum line width, safe spacing and track uniformity. Lori ọran igbehin, bẹrẹ lati ṣaṣeyọri sisanra idẹ Ejò ati iṣọkan wiwu lakoko ilana apẹrẹ ati tẹsiwaju pẹlu iṣelọpọ ati ilana iṣelọpọ.

Lack of safe spacing can lead to excessive film residues during the internal dry film process, which can lead to short circuits. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Design teams and manufacturers must also consider maintaining track uniformity as a means of controlling signal line impedance.

Ṣeto ati lo awọn ofin apẹrẹ kan pato

High-density layouts require smaller external dimensions, finer wiring and tighter component spacing, and therefore require a different design process. The HDI PCB manufacturing process relies on laser drilling, CAD and CAM software, laser direct imaging processes, specialized manufacturing equipment, and operator expertise. The success of the entire process depends in part on design rules that identify impedance requirements, conductor width, hole size, and other factors that affect the layout. Dagbasoke awọn ofin apẹrẹ alaye ṣe iranlọwọ yan olupese tabi olupese ti o tọ fun igbimọ rẹ ati fi ipilẹ fun ibaraẹnisọrọ laarin awọn ẹgbẹ.