Ngaphandle kwesimanje PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Ubuchwepheshe be-HDI buvumela abaklami ukuthi babeke izingxenye ezincane eduze komunye nomunye. Ukuphakama kwephakeji eliphakeme, usayizi webhodi omncane nezendlalelo ezimbalwa ziletha umphumela we-Cascading kumklamo we-PCB.

Ubuhle be-HDI

Let’s take a closer look at the impact. Ukwandisa ukuminyana kwephakeji kusivumela ukuthi sinciphise izindlela zikagesi phakathi kwezinto. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Ukunciphisa inani lezendlalelo kungabeka ukuxhumana okuningi ebhodini elifanayo futhi kuthuthukise ukubekwa kwengxenye, izintambo nokuxhuma. Ukusuka lapho, singagxila kunqubo ebizwa nge-interconnect nge-Layer (ELIC), esiza amaqembu okuklama ukuthi asuke emabhodini aminyene aye kwamancane aguquguqukayo ukugcina amandla ngenkathi evumela i-HDI ukuthi ibone ukusebenza okusebenzayo.

HDI PCBS rely on lasers rather than mechanical drilling. Ngokulandelayo, ukwakhiwa kwe-HDI PCB kuholela ekuvulekeni okuncane nosayizi wephedi omncane. Ukunciphisa ukuvula kwavumela ithimba lokuklama ukuthi lenyuse ukwakheka kwendawo yebhodi. Ukunciphisa izindlela zikagesi nokunika amandla izintambo eziqinisa kakhulu kuthuthukisa ubuqotho besiginali bomklamo futhi kusheshise ukucutshungulwa kwesiginali. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Imiklamo ye-HDI PCB ayisebenzisi izimbobo, kepha izimbobo eziyimpumputhe nezingcwatshwe. Ukubekwa okungagqamile nokunembayo izimbobo zokungcwaba nezimpumputhe kunciphisa ingcindezi yemishini epuletini futhi kuvimbele noma yiliphi ithuba lokugoqeka. Ngaphezu kwalokho, ungasebenzisa izimbobo ezigqogqiwe ukuthuthukisa amaphuzu wokuxhumana nokuthuthukisa ukuthembeka. Ukusetshenziswa kwakho kuma-pads nakho kunganciphisa ukulahleka kwesiginali ngokunciphisa ukubambezeleka kokuwela nokunciphisa imiphumela ye-parasitic.

Ukukhiqizwa kwe-HDI kudinga ukusebenzisana

Idizayini yokukhiqiza (i-DFM) idinga indlela ecabangayo, eqondile yokwakhiwa kwe-PCB nokuxhumana okungaguquguquki nabakhiqizi nabakhiqizi. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Ngamafuphi, inqubo yokuklama, ukwenza prototyping nokukhiqiza i-HDI PCBS idinga ukusebenzisana ngokubambisana nokunaka imithetho ethile ye-DFM esebenza kuphrojekthi.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Yazi izinto zakho zebhodi lesifunda nokucaciswa

Ngoba ukukhiqizwa kwe-HDI kusebenzisa izinhlobo ezahlukahlukene zezinqubo zokumba imishini ye-laser, inkhulumomphendvulwano phakathi kwethimba ledizayini, umkhiqizi nomkhiqizi kumele bagxile ohlotsheni lwamabhodi lapho bexoxa ngenqubo yokumba. Uhlelo lokusebenza lomkhiqizo olushukumisela inqubo yokuklama lungaba nosayizi nezidingo zesisindo ezihambisa ingxoxo ohlangothini olulodwa noma kolunye. High frequency applications may require materials other than standard FR4. Ngaphezu kwalokho, izinqumo ngohlobo lwezinto ze-FR4 zithinta izinqumo mayelana nokukhethwa kwezinhlelo zokumba noma ezinye izinsiza zokukhiqiza. Ngenkathi ezinye izinhlelo zibhoboza kalula ithusi, ezinye azingeneki ngokungaguquguquki ezintanjeni zengilazi.

Ngaphezu kokukhetha uhlobo lwezinto ezifanele, iqembu lokuklama kufanele futhi liqinisekise ukuthi umenzi nomkhiqizi bangasebenzisa ubukhulu bokulingana bepuleti namasu wokufaka. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Yize izingcwecwe ezijiyile zivumela ukwambulwa okuncane, izidingo zomshini zephrojekthi zingacacisa amapuleti amancane athambekele ekuhlulekeni ngaphansi kwezimo ezithile zemvelo. Ithimba labaklami kwakudingeka lihlole ukuthi umenzi wayenalo ikhono lokusebenzisa inqubo ye- “interconnect layer” futhi abhoboze izimbobo ekujuleni okulungile, futhi aqinisekise ukuthi isixazululo samakhemikhali esisetshenziselwa i-electroplating sizogcwalisa izimbobo.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Njengomphumela we-ELIC, ukwakheka kwe-PCB kungathatha ithuba lokuxhuma okuxinene, okuyinkimbinkimbi okudingekayo kumasekethe anejubane elikhulu. Ngoba i-ELIC isebenzisa ama-microholes agcwele ithusi ukuhlangana, ingaxhuma phakathi kwanoma yiziphi izingqimba ezimbili ngaphandle kokwenza ibhodi lesifunda libe buthakathaka.

Ukukhethwa kwento kuthinta ukwakheka

Noma iziphi izingxoxo nabakhiqizi nabakhiqizi maqondana nokuklanywa kwe-HDI kufanele futhi zigxile ekuhlelweni okuqondile kwezinto eziphakeme kakhulu. The selection of components affects wiring width, position, stack and hole size. Isibonelo, imiklamo ye-HDI PCB ifaka phakathi i-dense ball grid array (BGA) kanye ne-BGA ehlukaniswe kahle edinga ukuphunyuka kwephini. Izici eziphazamisa ukunikezwa kwamandla nobuqotho besiginali kanye nobuqotho bomzimba bebhodi kumele zibonwe lapho kusetshenziswa lezi zinsiza. Lezi zinto zifaka phakathi ukuthola ukuhlukaniswa okufanelekile phakathi kwezendlalelo eziphezulu nezingezansi ukunciphisa i-crosstalk efanayo nokulawula i-EMI phakathi kwezingqimba zesiginali yangaphakathi.Symmetrically spaced components will help prevent uneven stress on the PCB.

Naka isignali, amandla nobuqotho bomzimba

Ngaphezu kokuthuthukisa ubuqotho besiginali, ungaphinde uthuthukise ubuqotho bamandla. Ngoba i-HDI PCB ihambisa isendlalelo sokusondeza ngaphezulu, ukuthembeka kwamandla kuyathuthukiswa. Isendlalelo esiphezulu sebhodi sinesendlalelo sokubeka phansi nesendlalelo sokuphakelwa kwamandla kagesi, esingaxhunywa kusendlalelo sokubeka phansi ngokusebenzisa izimbobo eziyimpumputhe noma ama-microholes, futhi sinciphise inani lezimbobo zezindiza.

I-HDI PCB inciphisa inani lezimbobo ngokusebenzisa ungqimba lwangaphakathi lwebhodi. In turn, reducing the number of perforations in the power plane provides three major advantages:

Indawo enkulu yethusi iphakela i-AC ne-DC yamanje kuphini yamandla we-chip

L resistance decreases in the current path

L Ngenxa yokwehliswa okuphansi, amandla wokushintsha afanele angafunda iphini yamandla.

Elinye iphuzu eliyinhloko lengxoxo ukugcina ububanzi bomugqa omncane, isikhala esiphephile nokufana kwethrekhi. Kumagazini wokugcina, qala ukufeza ukujiya kwethusi okufanayo nokufana kwezintambo ngesikhathi senqubo yokwakhiwa bese uqhubeka nenqubo yokukhiqiza neyokukhiqiza.

Ukuntuleka kwezikhala eziphephile kungaholela ezinsaleleni zefilimu ezeqile ngesikhathi senqubo yangaphakathi yefilimu eyomile, engaholela kumasekhethi amafushane. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Amathimba okuklama nabakhiqizi kufanele futhi bacabangele ukugcina ukufana kwethrekhi njengendlela yokulawula impedance yolayini wesiginali.

Sungula futhi usebenzise imithetho ethile yokuklama

Izakhiwo zokuminyana okuphezulu zidinga ubukhulu obuncane bangaphandle, ukuhlangana kahle kwe-wiring kanye nesikhala sezinto eziqinile, ngakho-ke kudinga inqubo ehlukile yokwakhiwa. Inqubo yokukhiqiza ye-HDI PCB ithembela ekubhoneni i-laser, isoftware ye-CAD ne-CAM, izinqubo zokuthwebula izithombe ze-laser ngqo, imishini yokukhiqiza ekhethekile, nobuchwepheshe bo-opharetha. Ukuphumelela kwayo yonke le nqubo kuncike engxenyeni yemithetho yokwakha ekhomba izidingo ze-impedance, ububanzi be-conductor, ubukhulu bembobo, nezinye izinto ezithinta ukwakheka. Ukuthuthukisa imithetho eningiliziwe yokuklama kusiza ukukhetha umakhi noma umakhi ofanele webhodi lakho futhi kubeka isisekelo sokuxhumana phakathi kwamaqembu.