Inkqubo yemveliso icocekile ibhodi yesekethe eguqukayo

1. Direct metallization (DMS): i-ethylenediamine tetraacetic acid (EDTA) iqulethwe kwisisombululo semvula sobhedu njengearhente yokukhohlisa, kwaye uninzi lwabenzi bebhodi yesekethe eshicilelweyo abanabuchwephesha bokubuyisa i-ethylenediamine tetraacetic acid, ke ukusetyenziswa kobhedu lweekhemikhali imvula inqongophele. Okwangoku, eyona nto ihamba phambili yindlela ethe ngqo yokunyibilikisa isinyithi (DMS) ngaphandle kokufakwa kobhedu lweekhemikhali. Endaweni yoko, umgubo ocoliweyo wekhabhoni uyithi nkxu kwaye ugqitywe eludongeni lomngxunya ukwenza umaleko wokuqhuba. Emva kokufakwa ngasekhohlo okuncinci, isiseko sekhabhoni kumaleko wobhedu siyasuswa, kwaye kugcinwa kuphela umaleko ohambisa umboniso wekhabhoni kwi-non conductor (i-epoxy resin substrate) ngaphakathi kodonga lomngxunya, emva koko inyulwe ngokuthe ngqo. Kutolika kwangaxeshanye, izixhobo ezitsha ezivalelwe ngokupheleleyo zisetyenziswe kufakelo lwamandla. Xa kuthelekiswa nebhafu yendalo yokuhluza igesi, ukukhutshwa kwegesi yenkunkuma ngaphandle kuye kwancitshiswa ngaphezulu kwe-95%, ukukhutshwa kwelindle kuncitshiswe malunga ne-1/3, kunye nokuxinana kokungcola kulwelo lwenkunkuma kwakusezantsi. Kwangelo xesha, ngenxa yesandi esihle sokugquma kwesixhobo kunye nokufakelwa kwesixhobo sokuvala kwento yokunyanzelwa kwe fan, ungcoliseko lwengxolo luyancitshiswa kakhulu.

2. Indlela esulungekileyo ye-tin electroplating: ukusebenzisa i-tin eyi-electroplating esulungekileyo endaweni ye-tin ekhokela i-electroplating inokuphelisa ungcoliseko lwelothe enzima. Ngokobunzima be-lead plating layer ye-board ye-10 m, isixa selothe kwi-1t yenkunkuma engamanzi yi-18 ~ 20 kg. Ngokwenani le-tin yokuhluba inkunkuma elulwelo 52.1t / a, ukukhutshwa okukhokelayo kungancitshiswa ngo-937.8 ~ 104.0kg / a.

3. Yongeza amanzi mqengqeleki kunye nemela yomoya: irola yokufunxa amanzi kunye nemela yomoya icwangcisiwe phakathi kwecandelo le-ammonia lobhedu kunye necandelo lokuhlamba amanzi, ukuze isisombululo sisetyenziswe ngokupheleleyo kwitanki yokudambisa, kunye nesixa se-ammonia sobhedu esikhutshwe Ukukhutshwa kwelindle kungacuthwa nge-80% xa kuthelekiswa nendlela yesiNtu, ukunciphisa ubunzima kunye neendleko zokucocwa kwamanzi amdaka. Kwicandelo eliphuhlisayo lomatshini kunye necandelo lokuhlamba amanzi, izityibilikisi zokufunxa amanzi kunye nezitshetshe zomoya zibekiwe, ukuze umphuhlisi abe nokusetyenziswa ngokupheleleyo kwitanki eliphuhlisayo kwaye isixa se potassium carbonate esikhutshwe lindle elikhutshiweyo sincitshisiwe. Iindawo ezifanelekileyo zeemoto zibonelelwa ngeendawo zokukhupha igesi, ezixhumene ngokuthe ngqo nombhobho wegesi wokukhupha ngexesha lokukhupha, kwaye igesi yokukhupha ingena kwizibonelelo zonyango ukuphepha ukuvuza. Kwangelo xesha, amanzi okuhlamba okokugqibela konjiniyela asetyenziswa kwakhona kwicandelo lokutsalwa, egcina amanzi amaninzi amatsha.

4. Izixhobo ezifakwe ngokupheleleyo: icandelo le-oxidation lisebenzisa izixhobo ezifakwe ngokupheleleyo, kwaye ukugcwala kwegesi okungafunekiyo kungaphezulu kwama-95% ezantsi kunetanki lemveli lokumnyama. Icandelo eliphambili lenkqubo lixhotyiswe nge-oveni yokumisa. Xa kuthelekiswa nomgca wobumnyama ohlukaniswe ne-oveni, igesi yenkunkuma inokuqokelelwa kwaye inyangwe ngcono kunye nokunciphisa ukugcwala kwayo. Izixhobo zineziphumo ezifanelekileyo zokugquma ngesandi, kwaye isixhobo esithulisa ifeni yokunyanzelwa komqhubi sinokunciphisa kakhulu ungcoliseko lwengxolo.

5. Ukutshintsha i-rack: ukutshintsha i-rack kunye nokugubungela i-rack nge-tin kunokunyusa isantya sokutshintsha kwetanki yesisombululo se-nitric ye-rack ukusuka kwi-2D / ixesha ukuya kwi-7d / ixesha, kunye nokunciphisa ukukhutshwa kwelindle.

6. Sebenzisa i-nitric acid endaweni ye-asidi ye-fluoroboric acid: ukusebenzisa i-nitric acid endaweni ye-fluoroboric acid ukususa i-tin kunokuphelisa ungcoliseko lwe-fluorine.

7.Ukusebenzisa i-CAD kunye nokwenza ipleyiti yefoto: ukusebenzisa itekhnoloji yokwenza i-CAD kunye nefoto kungaphucula umgangatho wepleyiti yokufota kwaye kunciphise inkunkuma kunye nongcoliseko lweplate yeefoto.

8.Ukusebenzisa itekhnoloji ye-imaging ethe ngqo ye-laser: ukusebenzisa itekhnoloji ye-imaging ethe ngqo ye-laser inokugcina inkqubo yokwenza ipleyiti yokufota, ukuthintela inkunkuma kunye nongcoliseko lwee-negatives zokufota.