Inqubo yokukhiqiza ehlanzekile yebhodi lesifunda eliguquguqukayo

Inqubo yokukhiqiza ehlanzekile ye ibhodi lesifunda eliguquguqukayo

Ngesandla Esiqinile-Flex PCB
Ngesandla Esiqinile-Flex PCB

1. I-Direct metallization (i-DMS): i-ethylenediamine tetraacetic acid (i-EDTA) iqukethe isixazululo semvula yethusi yamakhemikhali njenge-ejenti yokukhohlisa, futhi iningi labakhiqizi bebhodi lesifunda eliphrintiwe abanabo ubuchwepheshe bokubuyisa i-ethylenediamine tetraacetic acid, ngakho-ke ukusetshenziswa kwethusi lamakhemikhali imvula inqunyelwe. Njengamanje, okuthuthuke kakhulu yindlela eqondile ye-metallization (DMS) ngaphandle kokufakwa kwamakhemikhali ethusi. Esikhundleni salokho, i-carbon powder enhle icwilisiwe futhi ifakwe odongeni lomgodi ukwakha ungqimba oluqhubayo. Ngemuva kokudonswa okuncane, isisekelo sekhabhoni kusendlalelo sethusi siyasuswa, futhi kugcinwa kuphela ungqimba we-carbon film oqhubekayo ku-non conductor (evikela i-epoxy resin substrate) ngaphakathi kodonga lomgodi, bese i-electroplated ngqo. Ekuhumusheni ngasikhathi sinye, imishini emisha efakwe ngokuphelele yasetshenziswa ekukhetheni. Uma kuqhathaniswa nendawo yokugeza yendabuko ekhiqiza ugesi, ukukhishwa kukaphethiloli ongaphandle kuye kwehliswa ngaphezu kwama-95%, ukukhishwa kwendle kuncishiswe cishe ngo-1/3, futhi ukuhlushwa kokungcola kuketshezi oludoti bekuphansi. Ngasikhathi sinye, ngenxa yomphumela omuhle wokufaka umsindo wemishini nokufakwa kwensimbi ethulisa umshayeli ophoqelelwe ngenkani, ukungcoliswa komsindo kuncishisiwe kakhulu.

2. Indlela ehlanzekile ye-tin electroplating: ukusebenzisa i-tin electroplating ehlanzekile esikhundleni se-tin lead electroplating kungaqeda ukungcoliswa komthofu wensimbi esindayo. Ngokuya ngokushuba kocingo lwethini lokugoqa ithini lebhodi lesifunda elingu-10 m, inani lomthofu ku-1t imfucuza ketshezi lingu-18 ~ 20 kg. Ngokwenani likathayela okhumula imfucumfucu engu-52.1t / a, ukukhishwa okuholayo kungancishiswa ngo-937.8 ~ 104.0kg / a.

3. Faka i-roller yamanzi nommese womoya: irola lokumunca amanzi nommese womoya kusethwe phakathi kwesigaba sokuthungwa kwe-ammonia yethusi nesigaba sokuwasha amanzi, ukuze isisombululo sokusetshenziswa sisetshenziswe ngokuphelele ethangini lokufaka, nenani le-ammonia yethusi elikhishwe indle ekhishiwe ingancishiswa ngo-80% uma kuqhathaniswa nendlela yendabuko, kunciphise ubunzima nezindleko zokuphathwa kwamanzi angcolile. Esigabeni semishini esakhulayo nasengxenyeni yokuwasha amanzi, kusethwe izigaxa zokumunca amanzi nemimese yomoya, ukuze unjiniyela asetshenziswe ngokuphelele ethangini elisathuthuka futhi nenani le-potassium carbonate elethwe yindle ekhishiwe lincishisiwe kakhulu. Izindawo ezifanele zokukhipha zinikezwa izindawo zokukhipha igesi, ezixhumene ngqo nepayipi legesi yokukhipha ngesikhathi sokukhipha, futhi igesi yokukhipha ingena ezikhungweni zokwelashwa ukugwema ukuvuza. Ngasikhathi sinye, amanzi avela ekuwashweni kokugcina konjiniyela asetshenziswa kabusha esigabeni sokudonsa, konga amanzi amaningi ahlanzekile.

4. Imishini eboshwe ngokugcwele: isigaba se-oxidation sisebenzisa imishini eboshwe ngokuphelele, futhi ukuchichima kwegesi kadoti kuchichime ngaphezu kuka-95% kunalokho kwethangi lendabuko elimnyama. Ingxenye engaphambili yesistimu ifakwe kuhhavini lokomisa. Uma kuqhathaniswa nolayini omnyama ohlukaniswe nehhavini, igesi yemfucuza engokwemvelo ingaqoqwa futhi yelashwe kangcono futhi inciphise ukugcwala kwayo. Okokusebenza kunomphumela omuhle wokugquma umsindo, futhi ithulisi elithulisayo lomlandeli ophoqelelwe ongakusebenzisa linganciphisa kakhulu ukungcoliswa komsindo.

5. Ukushintsha i-rack: ukuguqula i-rack nokumboza i-rack nge-tin kungandisa imvamisa yokushintsha ithangi le-nitric acid solution ye-rack kusuka ku-2D / isikhathi kuye ku-7d / isikhathi, futhi kunciphise ukukhishwa kwendle.

6. Ukusebenzisa i-nitric acid esikhundleni se-fluoroboric acid: ukusebenzisa i-nitric acid esikhundleni se-fluoroboric acid ukususa ithini kungaqeda ukungcoliswa kwe-fluorine.

7. Ukusebenzisa i-CAD ne-photo plate making: ukusebenzisa i-CAD ne-photo plate yokwenza ubuchwepheshe kungathuthukisa ikhwalithi yepuleti enezithombe futhi kunciphise imfucuza nokungcoliswa kwepuleti enezithombe.

8. Ukusebenzisa i-laser technology imaging technology: ukusebenzisa i-laser direct imaging technology kungonga inqubo yokwenza amapuleti enezithombe, ukuze kugwenywe ukungcola nokungcoliswa kwezinto ezingezinhle ezithwebula izithombe.