Ungazivimbela kanjani izenzakalo eziyisithupha zokuxhunywa kwethini ebhodini lesifunda ngemuva kokugoqeka kwegagasi.

Ungazivimbela kanjani izenzakalo eziyisithupha zokuxhunywa kwethini ku- ibhodi yesifunda ngemuva kokufakwa kwe-wave wave.

1. Ngenxa yesimo sokuxhunywa kukathayela okubangelwe yiphini yento ende kakhulu ngesikhathi sokufakwa kwegagasi ngebhodi lesifunda, kuzobhekelwa ubude besandiso sephini yengxenye ngokuvamile ingu-1.5-2mm, engeke yenzeke uma ingadluli lokhu kuphakama .

2. Ngoba ukwakheka kwenqubo ye-PCB kuyinkimbinkimbi ngokwengeziwe futhi isikhala sesikhonkwane esiholayo siminyene ngokwengeziwe, isimo sokuxhuma kwethini ngemuva kokuvela kwe-wave soldering. Ukushintsha ukwakheka kwephedi yisixazululo. Isibonelo, ukunciphisa usayizi wephedi, ukukhulisa ubude bephedi eliphuma ohlangothini lwegagasi, ukukhulisa umsebenzi we-flux / ukunciphisa ubude besandiso sokuhola nakho kuyizisombululo.

3. Ngemuva kokugoqeka kwegagasi, uthini oncibilikisiwe ungene ebusweni bebhodi lesifunda ukwakha ukuxhumana kothayela phakathi kwezikhonkwane zezinto. Isizathu esiyinhloko salesi simo ukuthi ububanzi obungaphakathi bephedi elingenalutho bukhulu kakhulu, noma ububanzi bangaphandle bephini lwento buncane kakhulu.

4. I-wave crest eyakhiwe izingxenye zezinyawo eziminyene ezindaweni ezimbili ixhunywe ngothayela ngemuva kokushisela.

5. I-Wave soldering ne-tin ngenxa yobukhulu be-pad ngokweqile.

6. Ukuxhuma kwethini lezikhonkwane zezinto ngemuva kokushiswa kwegagasi ngenxa yokungaxhumi kahle kwezikhonkwane zezinto.

Indlela yokuvimbela ukuxhumeka kwamathini ebhodini lesifunda ngemuva kokufaka amandla kwegagasi.

1. Design ngokuya PCB design sebhithi. I-eksisi ende yamachipsi amabili okuphela izobonakala ekuqondeni kwe-welding, futhi i-axis ende ye-SOT ne-SOP izofanelana nesiqondiso sokushisela. Nweba iphedi lephini lokugcina le-SOP (yakhela iphedi yokuthengisa);

2. Izikhonkwane zezinto ezifakiwe zizokwakhiwa ngokusho kwesikhala semigodi nezidingo zomhlangano webhodi eliphrintiwe. Uma inqubo emfushane yokufaka i-welding yamukelwa, izikhonkwane zezingxenye ebusweni be-welding zizovezwa ebusweni bebhodi eliphrintiwe ngo-0.8 ~ 3mm, futhi umzimba wengxenye uzobe ume ngesikhathi sokufakwa;

3. Setha ukushisa okushisa ngaphambili ngokuya ngosayizi we-PCB, noma ngabe kunamabhodi ama-multilayer, inani lezinto, inani lezinto ezifakiwe, njll.

4. Ukushisa kwe-tin wave kungu-250 ± 5 ℃, kanti isikhathi sokushisela ngu-3 ~ 5S. Lapho izinga lokushisa liphansi kancane, ijubane lebhande elihambayo kufanele lihambe kancane;

5. Buyisela ukugeleza.