The copper wire falling off of PCB (also known as copper dumping) is not good. PCB factories say that the laminate is the problem and require their production factories to bear the bad losses. According to my years of customer complaint handling experience, the common reasons for PCB factory copper dumping are as follows.

I. PCB fekitori yekugadzira maitiro zvinhu:

1. copper foil etching is excessive, the electrolytic copper foil used in the market is generally single-sided galvanized (commonly known as ashing foil) and single-sided copper plating (commonly known as red foil), common copper dumping is generally more than 70um galvanized copper foil, red foil and 18um below ashing foil basically have no batch copper dumping. Kana mutengi dhizaini dhizaini iri nani pane etching mutsetse, kana mhangura foil maratidziro akachinjwa uye etching parameter isina kuchinjwa, iyo yemhangura foil inogara mune iyo etching mhinduro kwenguva yakareba. Nekuti zinc isimbi inoshanda, kana waya yemhangura paPCB yakanyudzwa mukugadzirisa mhinduro kwenguva yakareba, inozotungamira kukukurwa kwemutsetse, zvichikonzera imwe mutsetse wakanaka kutsigira zinc denderedzwa inogadziriswa zvachose uye yakaparadzaniswa neyepasi zvinhu ndokuti, waya yemhangura inodonha. Imwe mamiriro ndeyekuti hapana dambudziko neETCHING parameter yePCB, asi iyo yekugezesa inoshambidzwa mushure mekucheka uye kuomesa kwakashata, zvichikonzera iyo waya yemhangura yakakomberedzwa nemvura inoyevedza yasara paSURFACE yePCB. Kana ikasarapwa kwenguva yakareba, waya yemhangura inozokanganiswa zvakanyanya uye mhangura inokandwa. General mashandiro erudzi urwu rwemamiriro ezvinhu akaiswa mumitsara yakanakisa, kana mamiriro ekunze akanyorova, iyo pcb yose ichaonekwa senge yakashata, bvisa waya yemhangura kuti uone yayo nehuswa interface (inonzi coarsening pamusoro) ruvara rwakachinja, kusiyana yakajairika mhangura foil ruvara, ndiko kuona iyo yepakutanga mhangura yemavara, mitsara gobvu yemhangura foil peel simba zvakare yakajairwa.

2. Mune MAFAMBIRO ePCB, kudhumhana kwemuno kunoitika, uye waya yemhangura inopatsanurwa kubva kune hwaro hwezvinhu nekunze kwema mechanical force. Kuita uku kusingadiwe kwakamisikidzwa zvakanaka kana kunongedzera, iyo tambo yemhangura yakasununguka ichave nekukanganisa kuri pachena, kana munzira imwechete yekukanda / kukanganisa chiratidzo. Kuongorora tambo yemhangura panzvimbo yakaipa kuti uone yemhangura foil bvudzi pamusoro, iwe unogona kuona kuti ruvara rwemhangura foil bvudzi pamusoro rwakajairika, hapazove nekukuvara kweaside, uye simba remhangura peel rakajairika.

3. PCB circuit design is not reasonable, with thick copper foil design too thin circuit, will also cause excessive circuit etching and copper dumping.

Maviri, laminate maitiro zvikonzero:

Mumamiriro ezvinhu akajairwa, chero bedzi iyo laminate yakadzvanywa patembiricha yakakwira kweanopfuura makumi matatu, iyo mhangura yemhangura uye pepa rakapora rakabatanidzwa zvakazara, saka kudzvanya kazhinji hakukanganise simba rinosunga remhangura pepi uye substrate mune iyo laminate. Nekudaro, mukuita kwekunamatira kuisirwa uye kuisira, kana kusvibiswa kwePP kana kukuvara kwemhangura foil bvudzi pamusoro kuchatungamira kune isina kukwana simba rinosunga pakati pemhangura foil uye hwaro hwezvinhu mushure mekumhara, zvichikonzera kumisikidza (chete pamahwendefa mahombe) kana waya wepapo wendarira kudonha, asi panenge pasina husavi hwemhangura yekuveza simba padyo netambo yakayerwa.

Zvitatu, laminate mbishi zvigadzirwa:

1. the above mentioned general electrolytic copper foil MAO foil galvanized or copper plating the processed products, when MAO foil production peak is abnormal, or zinc/copper plating, coating the dendrite, the peel strength of the copper foil itself is not enough, caused by the bad foil after pressing sheet made PCB electronics factory plug-in, copper wire fall off by external shocks will occur. Mhando iyi yemhangura yakashata inobvisa waya yemhangura kuti ione iyo yemhangura foil bvudzi pamusoro (kureva kuti, nzvimbo yekubatana neyekugadzika zvinhu) haizove pachena kukwira kwevhu, asi iyo yese yemhangura foil peeling simba ichave yakashata kwazvo.

2. the adaptability of copper foil and resin is poor: some special performance laminate used now, such as HTg sheet, because the resin system is not the same, the curing agent is generally PN resin, resin molecular chain structure is simple, the crosslinking degree is low when curing, is bound to use special peak copper foil and match. Kana kugadzirwa kwe laminate uchishandisa mhangura foil uye iyo resin system isingaenderane, zvichikonzera ndiro yakafukidza simbi foil peeling simba haina kukwana, plug-in inozoonekwa zvakare yakaipa mhangura waya peeling.