The copper wire falling off of PCB (also known as copper dumping) is not good. PCB factories say that the laminate is the problem and require their production factories to bear the bad losses. According to my years of customer complaint handling experience, the common reasons for PCB factory copper dumping are as follows.

I. Qodobbada habka wax -soo -saarka warshadda PCB:

1. copper foil etching is excessive, the electrolytic copper foil used in the market is generally single-sided galvanized (commonly known as ashing foil) and single-sided copper plating (commonly known as red foil), common copper dumping is generally more than 70um galvanized copper foil, red foil and 18um below ashing foil basically have no batch copper dumping. Marka naqshadda khadka macmiilku ay ka fiican tahay xariijinta qashinka, haddii tilmaamaha bireedka naxaas la beddelo oo aan la beddelin xuduudaha qoditaanka, bireedka naxaasku wuxuu ku sii jirayaa xalka qashin -qubka muddo aad u dheer. Sababtoo ah zinc waa bir firfircoon, marka siligga naxaasta ah ee PCB -ga lagu dhex milmay xallinta qashin -qubka muddo dheer, waxay lama huraan u horseedi doontaa nabaad -guur xad -dhaaf ah, taasoo dhalisay in xoogaa xarriiq wanaagsan oo daaha -ka -qaadista zinc si buuxda looga falceliyo oo laga sooco maaddada aasaasiga ah , taas oo ah, siligga naxaasta ahi wuu dhacaa. Xaalad kale ayaa ah inaysan jirin wax dhibaato ah oo ku saabsan xuduudaha ETCHING ee PCB, laakiin qashin -qubka ayaa la dhaqaa ka dib marka la qallajiyo oo qallajintiisu ay liidato, taasoo dhalisay in siligga naxaasta ah ay sidoo kale ku hareereysan tahay dareeraha qallajinta ee ku haray SURFACE -ka PCB. Haddii aan la daaweyn muddo dheer, siligga naxaasku si xad -dhaaf ah ayuu u daxalaysta naxaasna waa la tuuraa. Waxqabadka guud ee duruufaha noocan ahi waxay ku urursan yihiin khadadka wanaagsan, ama xilliga cimilada qoyan, PCB-ga oo dhan wuxuu u muuqan doonaa mid la mid ah, ka saar siligga naxaasta si aad u aragto isku-xidhka iyo xididdada hoose (waxa loogu yeero dusha qallafsan) midabku wuu isbeddelaa, si ka duwan midabka bireedka naxaasta ee caadiga ah, waa in la arko midabka asalka ah ee naxaasta ah ee asalka ah, khadadka qaro weyn ee xoogga diirka bireed ee naxaasku sidoo kale waa caadi.

2. HABKA PCB -ga, isku dhaca deegaanka ayaa dhaca, oo siligga naxaasta ah waxaa lagu kala soocay qalabka aasaasiga ah iyadoo la adeegsanayo xoog farsamo dibadeed. Wax -qabadkan aan la rabin ayaa si liidata u taagan ama jihaysan, siligga naxaasta ah ee dabacsan ayaa yeelan doona dhalanrog muuqda, ama isla jihada calaamadda xoqidda/saamaynta. Ku xoqida siligga naxaasta meel xun si aad u aragto dusha timaha bireedka naxaasta, waxaad arki kartaa in midabka dusha timaha bireedka naxaasku uu yahay mid caadi ah, ma jiri doonto nabaad guur dhinaca xun ah, iyo awoodda diirka bireed ee naxaasku waa caadi.

3. PCB circuit design is not reasonable, with thick copper foil design too thin circuit, will also cause excessive circuit etching and copper dumping.

Laba, sababaha hannaanka laminate:

Xaaladaha caadiga ah, ilaa inta laminate-ka lagu cadaadiyo heerkul aad u sarreeya in ka badan 30min, foornada naxaasta ah iyo xaashida la-bogsiiyay asal ahaan waa la isku daray, markaa cadaadiska guud ahaan ma saameynayo xoogga wax-qabad ee biraha naxaasta iyo substrate ee dahaarka Si kastaba ha noqotee, marka la raacayo dabagelinta iyo is -dul -saaridda, haddii wasakhaynta PP ama waxyeellada dusha timaha bireedka naxaasku waxay sidoo kale horseedi doontaa xoog ku -xirnaan oo aan ku filnayn inta u dhexaysa bireedka naxaasta iyo maaddada saldhigga ka dib dahaadhka, taas oo keenta meelaynta (kaliya taarikada waaweyn) ama xadhigga naxaas ee goos gooska ah hoos u dhacaya, laakiin ma jiri doonto xoog fiiqan bireed oo naxaas ah oo aan caadi ahayn meel u dhow xariijinta la cabbiray.

Saddex, alaabta ceeriin laminate:

1. the above mentioned general electrolytic copper foil MAO foil galvanized or copper plating the processed products, when MAO foil production peak is abnormal, or zinc/copper plating, coating the dendrite, the peel strength of the copper foil itself is not enough, caused by the bad foil after pressing sheet made PCB electronics factory plug-in, copper wire fall off by external shocks will occur. Noocan ah naxaas xun oo ka siibaysa siligga naxaasta si aad u aragto dusha timaha bireedka naxaasta ah (taas oo ah, dusha xiriirka oo leh agabka salka ah) ma noqon doonto nabaadguur dhinaca cad ah, laakiin dusha oo dhan ee xoogga diirka bireed ee naxaasku wuxuu noqon doonaa mid aad u liita.

2. the adaptability of copper foil and resin is poor: some special performance laminate used now, such as HTg sheet, because the resin system is not the same, the curing agent is generally PN resin, resin molecular chain structure is simple, the crosslinking degree is low when curing, is bound to use special peak copper foil and match. Marka wax soo saarka dahaarka la isticmaalayo bireedka naxaasta ah iyo nidaamka cusbi uusan is dhigmin, taasoo keentay in saxan daboolaya xoogga biraha biraha ku filan kuma filna, fur-in sidoo kale muuqan doonaa xuubka naxaas xun xun.