Ishicilelwe ibhodi yesekethe emva kokufakelwa kwakhona kwe-welding kuthambekele kwipleyiti yokugoba ipleyiti yokugoba, amagama abalulekileyo aya kubangela ukuba izinto zingabinanto, i-monument, njalo njalo, ungoyisa njani?

1. Ukwenzakaliswa kwebhodi yesekethe ye-PCB

Kumgca wokumisa umphezulu wokuzenzekelayo, ukuba ibhodi yesekethe ayihambanga kakuhle, iya kubangela ukubekwa ngendlela engachanekanga, izinto ezingenakufakwa okanye zixhonywe emngxunyeni kunye nephedi yokufaka umphezulu webhodi, kwaye zonakalise umatshini wokufaka ozenzekelayo. Ibhodi yesekethe elayishwe ngamacandelo igobile emva kwentsimbi, kwaye iinyawo zecandelo kunzima ukusika ngokucocekileyo. Iibhodi azinakufakwa kwi-chassis okanye kwisokethi somatshini, ke isityalo sendibano esidibene nokuthambeka kwebhodi nako kuyingxaki. Okwangoku, umphezulu obandayo ubuchwephesha bukhula ngokubhekisele kukuchaneka okuphezulu, isantya esiphezulu kunye nolwalathiso olukrelekrele, oluthi lubeke phambili iimfuno eziphezulu zokubhabha kwibhodi ye-PCB njengekhaya lezinto ezahlukeneyo.

Umgangatho we-IPC uxela ngokuthe ngqo ukuba ubuninzi be-deformation evumelekileyo yi-0.75% yebhodi ye-PCB enesixhobo sokunyuka komhlaba kunye ne-1.5% yebhodi ye-PCB ngaphandle kwesixhobo sokunyuka komhlaba. Ngapha koko, ukuze kuhlangatyezwane neemfuno zokuchaneka okuphezulu kunye nokunyuka kwesantya esiphezulu, abanye abavelisi bokufaka i-elektroniki banemfuno engqongqo ngakumbi yokujika.

Ibhodi ye-PCB yenziwe ngefoyile yobhedu, i-resin, ilaphu leglasi kunye nezinye izinto, zonke zinempawu ezahlukeneyo zomzimba kunye neekhemikhali. Emva kokucinezelwa kunye, intsalela yoxinzelelo lwe-thermal iya kwenzeka ngokungathandabuzekiyo, ikhokelela kulwakhiwo. Kwangaxeshanye kwinkqubo yokulungiswa kwe-PCB, ngobushushu obuphezulu, ukusika ngoomatshini, inkqubo emanzi kunye nenye inkqubo, iya kuvelisa ifuthe elibonakalayo kwi-deformation yeplate, ngokufutshane kunokubangela ukushenxiswa kwe-PCB kunzima, ukunciphisa okanye ukuphelisa okubangelwa yiipropati ezahlukeneyo izinto kunye nokulungiswa, deformation le PCB abavelisi enye yeengxaki ezinzima.

2. Unobangela wohlalutyo lwesiphene

I-deformation yebhodi ye-PCB kufuneka ifundwe kwimiba yezixhobo, ulwakhiwo, ukuhanjiswa kwegraphic, inkqubo yokuqhubekeka njalo njalo. Eli phepha liza kuhlalutya lize licacise izizathu ezahlukeneyo ezinokubangela ukusombuluka kunye neendlela zokuphucula.

Indawo engalinganiyo yobhedu kwibhodi yesekethe iya kwenza mandundu ukugoba kunye nokusonta kwebhodi.

Kuyilo lwebhodi yesekethe ngokubanzi inommandla omkhulu wobhedu we-foil, ngamanye amaxesha umaleko we-Vcc uyile indawo enkulu yefoyile yobhedu, xa le mimandla mikhulu yeefoyile zobhedu ingenakulinganiswa ngokulinganayo kwiibhodi zesekethe ezifanayo, iya kubangela ubushushu obungalinganiyo kwaye isantya sokupholisa, iibhodi zesekethe, ewe, nazo zinokufudumeza i-bilges ebandayo, Ukuba ukwandiswa kunye nokuncipha akunakubakho ngaxeshanye kubangelwe luxinzelelo olwahlukileyo kunye nokusilela, ngeli xesha ukuba iqondo lobushushu bebhodi lifikelele kumda ophezulu wexabiso le-Tg, ibhodi iya kuqala ukuthamba, ikhokelele kwisiphene esisigxina.

Iindawo zokudibanisa (i-ViAs) zamanqanaba ebhodini anciphisa ukwanda kunye nokucutha kwebhodi

Kule mihla, ibhodi yesekethe ubukhulu becala ibhodi ye-multilayer, kwaye kuyakubakho iirivets ezinje ngendawo yokudibanisa (i-VIAS) phakathi komaleko kunye nongqameko, indawo yoqhagamshelo yahlulwe yangena ngomngxunya, umngxunya ongaboniyo kunye nomngxunya ongcwatyelweyo, apho kukho indawo yokudibanisa ukunciphisa umda wokunwenwa kweplate kunye nokuncipha, kuya kuthi ngokungangqalanga kubangele ukugoba kweplate kunye nokujija kweplate.

Ubunzima bebhodi yesekethe ngokwayo inokubangela ukuba ibhodi ihle kwaye ikhubazeke

Isithando somlilo ngokubanzi siya kusebenzisa ikhonkco ukuqhuba ibhodi yesekethe kwiziko lokuwelda phambili, oko kukuthi, xa omabini amacala ebhodi xa i-fulcrum yokuxhasa ibhodi iphela, ukuba ibhodi ingaphezulu kwamalungu atyebileyo, okanye ubungakanani Ibhodi inkulu kakhulu, ngenxa yemali yayo kwaye ivele embindini wento yoxinzelelo, ekhokelela ekuguqulweni kweplate.

Ubunzulu be-V-cut kunye nomtya wokuqhagamshela uya kuchaphazela ukuguqulwa kwepaneli

Ngokusisiseko, i-V-cut ngoyena nobangela wokutshabalalisa ubume bebhodi, kuba i-V-cut kukusika ii-grooves kwiphepha elikhulu lasekuqaleni, ngoko ke kulula ukuyonakalisa indawo ye-V-cut.

2.1 Uhlalutyo lwempembelelo yezixhobo ezicinezelweyo, ulwakhiwo kunye nemizobo kwi-deformation plate

Ibhodi ye-PCB yenziwa ngokucinezela ibhodi engundoqo, iphepha elomeleleyo kunye nephepha elingaphandle lobhedu. Ibhodi engundoqo kunye neefoyile zobhedu ziyafudunyezwa kwaye zikhubazeke ngexesha lokucinezela. Isixa sokushenxiswa sixhomekeke kulungelelwaniso lwokwanda kwe-thermal (CTE) kwezi zinto zimbini.

Umlingani wolwandiso lwe-thermal (CTE) lwefoyile yobhedu malunga

I-Z-cTe yesiqhelo se-FR-4 yesiqhelo kwindawo ye-Tg.

Ngaphezulu kwenqaku le-TG, (250-350) x10-6, kunye ne-x-cTE ngokubanzi iyafana nefoyile yobhedu ngenxa yobukho beglasi yeglasi.