Inkqubo yoyilo esisiseko ye-PCB imi ngolu hlobo lulandelayo:

Amalungiselelo okuqala Ukuqinisekiswa kweprojekthi EQ → ukukhutshwa kwedatha yokuphuma → ukugqitywa kweprojekthi.

1: Amalungiselelo

Oku kubandakanya ukulungiselela iilayibrari zephakeji kunye nezikimu. phambi kokuba Uyilo PCB, we should first prepare the logic package of schematic SCH and the package library of PCB. Iilayibrari zephakheji zinokuza ne-PADS, kodwa kunzima ukufumana iilayibrari ezifanelekileyo ngokubanzi. Kungcono ukwenza eyakho iphakheji yeelayibrari ngokolwazi olusezantsi lwezixhobo ezikhethiweyo. In principle, the PCB packaging library should be done first, and then the SCH logic packaging should be done. PCB packaging library has high requirements, which directly affects the board installation; SCH logical packaging requirements are relatively loose, as long as the definition of pin attributes and the corresponding relationship with PCB packaging on the line. I-PS: Qaphela izikhonkwane ezifihliweyo kwilayibrari esemgangathweni. Ke uyilo loyilo, olulungele ukwenza uyilo lwePCB.

2. Uyilo lwesakhiwo sePCB

Kweli nqanaba, ngokobungakanani bebhodi yesekethe kunye nokubekwa koomatshini, indawo yebhodi yePCB ityhilwe kwimeko yoyilo lwePCB, kunye nezihlanganisi, amaqhosha / ukutshintsha, imingxunya yokujija, imingxunya yendibano njalo njalo ibekwa ngokweemfuno zokubeka. Kwaye ujonge ngokupheleleyo kwaye umisele indawo ye-wiring kunye nendawo engenazingcingo (njengobungakanani bomngxunya wokujija ojikeleze indawo engenazingcingo).

3: isikhokelo setafile yenethiwekhi

Kuyacetyiswa ukuhambisa itafile yomnatha kwisakhelo sebhodi kuqala. Import a board enclosure in DXF format or EMN format

4: Rule setting

Imigaqo esengqiqweni inokumiselwa ngokungqinelana noyilo oluthile lwePCB. Le mithetho ngabaphathi bezibophelelo ze-PADS, ezinokusetyenziselwa ukuthintela ububanzi bomgca kunye nokushiya ngokukhuselekileyo nangaliphi na ixesha lenkqubo yoyilo. Iindawo ezingahambelaniyo ziphawulwa ngabamakishi beDRC ngexesha lokuvavanywa kwe-DRC.

Ukusekwa komgaqo ngokubanzi kubekwe phambi kobeko, kuba ngamanye amaxesha umsebenzi othile we-fanout kufuneka ugqityiwe ngexesha lobeko, ke imigaqo kufuneka isethwe kakuhle phambi kwe-FANout. Xa iprojekthi yoyilo inkulu, uyilo lunokugqitywa ngokufanelekileyo. Qaphela: imigaqo isetelwe uyilo olungcono nolukhawulezayo, ngamanye amagama, ukulungiselela abaqulunqi. Useto oluqhelekileyo zezi: 1. Ubungakanani obumiselweyo bomda / isithuba somgca kwiimpawu eziqhelekileyo. Khetha kwaye usete umngxunya. 3. Cwangcisa ububanzi bomgca kunye nombala weempawu ezibalulekileyo kunye nokuhanjiswa kwamandla. 4. Useto lobeko lweBhodi.

5: ubeko PCB

Isidingo sokuhlawula ngokukodwa, endaweni yamacandelo, izinto kufuneka ziqwalaselwe xa ubukhulu bobona (kwindawo kunye nokuphakama) kunye nokuma okuphakathi kwezixhobo, ukuqinisekisa ukuba iipropathi zombane kunye nokuveliswa kokufakwa kwebhodi yesekethe lula kwaye kunokwenzeka Ukwabelana ngesondo ngaxeshanye, kufanele ukuba ube kwisiseko sesiqinisekiso somgaqo ongentla ukubonisa, ukutshintsha isixhobo esifanelekileyo, sicoceke kwaye sihle, Umzekelo, kwa esi sixhobo kufuneka sibekwe ngokucocekileyo nakwicala elinye, hayi “ukusasazwa ngokungacwangciswanga”. Eli nyathelo lijongana nobunzima bebhodi yokudityaniswa kunye nenqanaba elilandelayo le-wiring, bafuna ukuchitha umzamo omkhulu wokujonga njalo. Xa ubeko, lunokwenza i-wiring yokuqala ukuba ingabi yindawo evumayo, uqwalaselo olwaneleyo.

6: iingcingo

Iingcingo yinkqubo ebaluleke kakhulu kuyilo PCB. Oku kuya kuchaphazela ngokuthe ngqo ukusebenza kwebhodi ye-PCB. Kwinkqubo yoyilo lwe-PCB, i-wiring ngokubanzi inamanqanaba amathathu okwahlulahlula: eyokuqala kukusasazwa, eyona nto isisiseko kuyilo lwe-PCB. Ukuba umgca awuyongubo, fika kuyo yonke indawo uhamba ngomgca, uya kuba yibhodi engafanelekanga, unokuthi akukho nto yokungena.

Okwesibini kukoneliseka kokusebenza kombane. Lo ngumgangatho wokulinganisa ukuba ibhodi yesekethe eprintiweyo iyafaneleka. Oku kusemva kokuhanjiswa, hlengisa ngononophelo i-wiring, ukuze ikwazi ukufezekisa owona msebenzi mhle wombane. Emva koko kukho ubuhle. Ukuba ilaphu lakho le-wiring belidityanisiwe, nayo ayinayo indawo echaphazela ukusebenza kwesixhobo sombane, kodwa jonga ngaphaya kokungathandekiyo, yongeza imibala, eqaqambileyo, ebala ukuba intle into yokusebenza kwesixhobo sombane, iseyinkunkuma kwabanye iliso. Oku kuzisa inkxamleko enkulu kuvavanyo nakulondolozo. Iingcingo kufuneka zihlale zicocekile kwaye zifanane, hayi kwi-crisscross ngaphandle kwemithetho. Zonke ezi zinto kufuneka zifezekiswe kwimeko yokuqinisekisa ukusebenza kombane kunye nokuhlangabezana nezinye iimfuno zomntu ngamnye, kungenjalo kukushiya isiseko.

Ukufakelwa kweengcingo kwenziwa ngokukodwa kule migaqo ilandelayo: (1) Ngokubanzi, umgca wamandla kunye nocingo lomhlaba kufuneka lubotshwe kuqala ukuqinisekisa ukusebenza kombane kwibhodi yesekethe. Kwimiqathango yeemeko zivumela, kangangoko kunokwenzeka ukwandisa ububanzi bokunikezelwa kwamandla, ucingo lomhlaba, ucingo oluphambili lomhlaba lubanzi kunomgca wamandla, ubudlelwane babo: ucingo lomhlaba> umgca wamandla> umgca wesiginali, ngokuqhelekileyo umgca womgca wesiginali Ngu: 0.2 ~ 0.3mm (malunga ne-8-12mil), ububanzi bumxinwa ukuya kuthi ga kwi-0.05 ~ 0.07mm (2-3mil), intambo yamandla ngokubanzi yi-1.2 ~ 2.5mm (50-100mil). I-PCB yesekethe yedijithali ingasetyenziselwa njengesiphaluka esinee-conductor ezibanzi zomhlaba, oko kukuthi, inethiwekhi yomhlaba (umhlaba wesekethe ye-analog awunakusetyenziswa ngale ndlela). (2) in advance to the more strict requirements of the line (such as high frequency line) wiring, input and output side line should avoid adjacent parallel, so as not to produce reflection interference. Xa kukho imfuneko, ucingo lomhlaba kufuneka longezwe lodwa, kwaye ii-wiring zeengqimba ezimbini ezikufutshane kufuneka zijolise komnye nomnye, ekulula ukuvelisa ukudibanisa i-parasitic ngokudibeneyo. (3) the oscillator shell is grounded, and the clock line should be as short as possible, and it can’t be everywhere. Ngaphantsi kwesekethe yokujikeleza kwewotshi, isekethe ekhethekileyo ene-high-speed logic circuit kufuneka inyuse indawo yomhlaba, kwaye akufuneki iye kweminye imigca yomqondiso, ukuze intsimi yombane ejikelezileyo ithambekele kwi-zero;

(4) Sebenzisa ii-45 ° zomnxeba ophukileyo kangangoko kunokwenzeka, hayi i-90 ° yomgca owaphukileyo, ukwenzela ukunciphisa ukusasazeka kwemitha yomqondiso wamaza aphakamileyo; (5) Nawuphi na umgca womqondiso akufuneki wenze iluphu, ukuba awunakuphepheka, iluphu kufuneka ibe ncinane kangangoko; Umgca wokutyikitya emngxunyeni kufuneka ubencinci kangangoko; (6) Umgca ophambili kufuneka ube mfutshane kwaye ungqingqe kangangoko kunokwenzeka, kwaye umhlaba okhuselayo kufuneka wongezwe kumacala omabini. (7) xa uhambisa imiqondiso ethambileyo kunye neempawu zentsimi yengxolo ngeentambo ezithe tyaba, kufanelekile ukusebenzisa indlela “yomgca womhlaba – umqondiso – umgca womhlaba”. (8) Iindawo zovavanyo kufuneka zigcinelwe imiqondiso ephambili ukulungiselela ukuvavanywa kwemveliso nolondolozo. (9) Emva kokuba iintambo zeskimu zigqityiwe, iintambo kufuneka zilungiselelwe; Kwangelo xesha, emva kokutshekishwa kwenethiwekhi yokuqala kunye nokutshekishwa kweDRC kuchanekile, ucingo lomhlaba luzaliswe kuloo ndawo ngaphandle kweentambo, kwaye indawo enkulu yobhedu isetyenziswa njengocingo lomhlaba, kwaye iindawo ezingasetyenziswanga zidibene nomhlaba njenge ucingo lomhlaba kwibhodi eprintiweyo. Okanye yenze ibhodi yomaleko omninzi, unikezelo lwamandla, umgca womhlaba ngamnye uhlala kwilayini.

(1) Umgca Ngokubanzi, ububanzi bomgca wesiginali yi-0.3mm (12mil), kunye nobubanzi bomgca wamandla yi-0.77mm (30mil) okanye i-1.27mm (50mil); Umgama phakathi kocingo kunye nocingo naphakathi kocingo kunye nephedi kufuneka ube mkhulu okanye ulingane no-0.33mm (13mil). Kwisicelo esisebenzayo, kufanele kuthathelwe ingqalelo ukwandisa umgama xa iimeko zivuma; Xa uxinano lwekhabhathi luphezulu, kuyacetyiswa (kodwa akucebisi) ukusebenzisa iintambo ezimbini phakathi kwezikhonkwane ze-IC. Ububanzi beentambo ngu-0.254mm (10mil), kwaye umgama phakathi kweentambo awukho ngaphantsi kwe-0.254mm (10mil). Phantsi kweemeko ezizodwa, xa ipini yesixhobo ixinene kwaye ububanzi bumxinwa, ububanzi bomgca kunye nokushiya umgca kungancitshiswa ngokufanelekileyo. (2) PAD (PAD) PAD (PAD) kunye nomngxuma wotshintsho (VIA) iimfuno ezisisiseko zezi: ububanzi bediski kunobubanzi bomngxunya bungaphezulu kwe-0.6mm; Umzekelo, iipikisi zohlobo lwepiniki, ii-capacitors kunye neesekethe ezihlanganisiweyo, kusetyenziswa idiski / ubungakanani bemingxunya 1.6mm /0.8mm (63mil / 32mil), isokethi, ipini kunye nedayode 1N4007, kusetyenziswa i-1.8mm / 1.0mm (71mil / 39mil). Kwisicelo esisebenzayo, kufanele ukuba kugqitywe ngokobungakanani bezinto ezikhoyo. Ukuba iimeko ziyafumaneka, ubungakanani bephedi bunokunyuswa ngokufanelekileyo. Ufakelo lokufakwa kwezinto eziyilwe kwi-PCB kufuneka lube malunga ne-0.2 ~ 0.4mm (8-16mil) enkulu kunobungakanani bezikhonkwane zezinto. (3) Ukugqobhoza (VIA) ngokubanzi yi-1.27mm / 0.7mm (50mil / 28mil); Xa uxinano lweengcingo luphezulu, ubungakanani bomngxunya bunokucitshiswa ngokufanelekileyo, kodwa bungabuncinci kakhulu, bunokuthathela ingqalelo i-1.0mm / 0.6mm (40mil / 24mil). I-PAD kunye ne-VIA: ≥ 0.3mm (12mil) i-PAD kunye ne-PAD: ≥ 0.3mm (12mil) I-PAD kunye ne-TRACK: ≥ 0.3mm (12mil) TRACK and TRACK: ≥ 0.3mm (12mil) ≥ 0.3mm (12mil) I-PAD kunye ne-VIA: ≥ 0.254mm (10mil) I-PAD kunye ne-TRACK: ≥ 0.254mm (10mil) I-PAD kunye ne-TRACK: ≥ 0.254mm (10mil) UKUQHUBEKA nokulandelela: ≥ 0.254mm (10mil)

7: wiring optimization and screen printing

“Akukho nto ibhetele, kungcono kuphela”! Nokuba ungakanani na umzamo owenzayo kuyilo, xa ugqibile, jonga kwakhona, kwaye uya kuziva ukuba ungatshintsha kakhulu. Umgaqo woyilo ngokubanzi wesithupha kukuba i-wiring efanelekileyo ithatha kabini ubude njenge-wiring yokuqala. Emva kokuziva ukuba akukho nto ifuna ukutshintsha, ungabeka ubhedu. Ukubeka ubhedu ngokubanzi kubeka ucingo lomhlaba (jonga ukwahlula i-analog kunye nomhlaba wedijithali), ibhodi ye-multilayer inokufuna ukubeka amandla. Ukuprintwa kwesikrini, kuya kufuneka sinike ingqalelo ekungavinjelweni sisixhobo okanye sisuswe ngomngxunya nakwiphedi. Kwangelo xesha, uyilo lokujongana nomphezulu wecandelo, emazantsi eli gama kufuneka kube kusenziwa isipili, ukuze ungabhidanisi inqanaba.

8: Uthungelwano, iDRC kunye novavanyo lwesakhiwo

Ngaphambi kokupeyinta ngokukhanya, kuyimfuneko ngokubanzi ukujonga. Yonke inkampani inoluhlu lwayo lokujonga, kubandakanya iimfuno zomgaqo, uyilo, imveliso kunye nolunye unxibelelwano. Oku kulandelayo kukwazisa ngemisebenzi emibini ephambili yokuhlola enikezwe yisoftware. Jonga iDRC:

9: imveliso ukukhanya ukupeyinta

Phambi kokuba kuphume ukupeyinta okukhanyayo, qinisekisa ukuba i-veneer yinguqulelo yamva nje esele igqityiwe kwaye ihlangabezana neemfuno zoyilo. Ifayile yemveliso yokupeyinta ukukhanya isetyenziselwa ukuveliswa kwebhodi kumzi-mveliso wepleyiti, ukuveliswa kwensimbi yentsimbi kwifektri yomnatha wentsimbi, kunye nefayile yenkqubo yemveliso kwifektri yewelding.

The output files are as follows (take the four-layer board as an example) : 1). Wiring layer: refers to the conventional signal layer, mainly wiring. Babizwa ngokuba yi-L1, L2, L3, Kunye ne-L4, apho L imele uluhlu lwentambo.

2). Umaleko wokushicilela kwiscreen: kubhekiswa kumaleko kuxwebhu loyilo olunikezela ngolwazi malunga nokuprinta kwescreen. Ngokwesiqhelo, kuya kubakho ukuprinta okuphezulu kwescreen kunye nokushicilela kwesikrini esisezantsi ukuba kukho izixhobo okanye amanqaku kumaleko aphezulu nasezantsi. Ukubiza: Uluhlu oluphezulu lubizwa ngokuba yi-SILK_TOP; Igama elisezantsi nguSILK_BOTTOM.