Inqubo yokwakhiwa okuyisisekelo ye-PCB imi kanjena:

Ukulungiselela kwangaphambilini → ukwakheka kwesakhiwo se-PCB → uhlu lomhlahlandlela → ukusethwa komthetho → ukwakheka kwe-PCB → ukwenziwa kwe-wiring nokwenza isikrini sikasilika → inethiwekhi ne-DRC isheke nokuhlolwa kwesakhiwo → okukhipha ukukhanya komdwebo → ukubuyekezwa komdwebo okhanyayo ukuqinisekiswa kwephrojekthi EQ → ukukhishwa kwedatha yokukhipha → ukuqedwa kwephrojekthi.

1: Ukulungiselela

Lokhu kufaka phakathi ukulungiselela imitapo yolwazi kanye ne-schematics. Ngaphambi Design PCB, we should first prepare the logic package of schematic SCH and the package library of PCB. Imitapo yolwazi yamaphakheji ingafika ne-PADS, kepha kunzima ukuthola imitapo yolwazi efanelekile ngokujwayelekile. Kungcono ukwenza imitapo yolwazi yakho yephakheji ngokuya ngemininingwane yosayizi ojwayelekile wamadivayisi akhethiwe. In principle, the PCB packaging library should be done first, and then the SCH logic packaging should be done. PCB packaging library has high requirements, which directly affects the board installation; SCH logical packaging requirements are relatively loose, as long as the definition of pin attributes and the corresponding relationship with PCB packaging on the line. I-PS: Qaphela izikhonkwane ezifihliwe kumtapo wezincwadi ojwayelekile. Lapho-ke umklamo ohleliwe, olungele ukwenza ukwakheka kwe-PCB.

2. Ukwakhiwa kwesakhiwo se-PCB

Kulesi sinyathelo, ngokuya ngosayizi webhodi lesifunda nokuma ngomshini, indawo yebhodi le-PCB idonswa kwimvelo yokwakhiwa kwe-PCB, nezixhumi, izinkinobho / amaswishi, izimbobo zesikulufa, izimbobo zomhlangano nokunye kubekwa ngokuya ngezidingo zokubeka. Futhi bhekisisa ngokugcwele bese unquma indawo yezintambo nendawo engeyona yezintambo (njengokuthi ingakanani imbobo yesikulufu ezungeze indawo engeyona yezintambo).

3: umhlahlandlela wetafula lenethiwekhi

Kunconywa ukuhambisa itafula lenetha kufreyimu yebhodi kuqala. Import a board enclosure in DXF format or EMN format

4: Rule setting

Imithetho enengqondo ingasethwa ngokuya ngomklamo othile we-PCB. Le mithetho ngabaphathi bezingqinamba ze-PADS, abangasetshenziswa ukukhawulela ububanzi bolayini nezikhala eziphephile nganoma yisiphi isikhathi kunqubo yokwakhiwa. Izindawo ezingahambisani nazo zimakwa ngabamaki baseDRC ngesikhathi sokuhlolwa kwe-SUBSEQUENT DRC.

Isethingi yemithetho ejwayelekile ibekwa ngaphambi kwesakhiwo, ngoba kwesinye isikhathi umsebenzi othile we-fanout udinga ukuqedwa ngesikhathi sokuhlelwa, ngakho-ke imithetho kufanele isethwe kahle ngaphambi kwe-FANout. Lapho iphrojekthi yokuklama inkulu, idizayini ingaphothulwa kahle. Qaphela: imithetho isethelwe ukwakhiwa okungcono futhi okusheshayo, ngamanye amagama, ukuze kube lula kwabaqambi. Izilungiselelo ezivamile yilezi: 1. Ububanzi bomugqa ozenzakalelayo / isikhala somugqa sezimpawu ezivamile. Khetha bese usetha imbobo. 3. Setha ububanzi bomugqa nombala wezimpawu ezibalulekile namandla kagesi. Izilungiselelo zesendlalelo seBhodi.

5: isakhiwo se-PCB

Udinga ukunaka ngokukhethekile, esikhundleni sezinto, izinto okufanele zicatshangelwe lapho ubukhulu bangempela (endaweni nokuphakama) kanye nokuma okuhlobene phakathi kwezinto, ukuqinisekisa ukuthi izakhiwo zikagesi nokukhiqizwa kokufakwa kwebhodi lesifunda kulula futhi kungenzeka ubulili ngasikhathi sinye, kufanele kube ngesisekelo sesiqinisekiso somthetho ongenhla ukukhombisa, idivaysi efanele yokushintsha, yenze ibe yinhle futhi ibe muhle, Isibonelo, insimbi efanayo kufanele ibekwe ngobunono nangendlela efanayo, hhayi “ukusakazwa ngokungahleliwe”. Lesi sinyathelo sithinta ubunzima bebhodi elihlanganisiwe kanye ne-wiring degree elandelayo, abafuna ukusebenzisa umzamo omkhulu ukubheka kanjalo. Lapho ukwakheka, kungenza izintambo zokuqala zingabi yindawo yokuvuma, ukucatshangelwa okwanele.

6: izintambo

Ukwenza izintambo kuyinkqubo ebaluleke kakhulu ekwakhiweni kwe-PCB. Lokhu kuzothinta ngqo ukusebenza kwebhodi le-PCB. Enkambisweni ye-PCB design, i-wiring ngokuvamile inamazinga amathathu wokwehlukanisa: owokuqala ukusatshalaliswa, okuyisidingo esiyisisekelo se-PCB design. Uma umugqa ungeyona indwangu, fika yonke indawo ulayini ondizayo, kuzoba yibhodi engafanelekile, ungasho ukuthi akukho ukungena.

Okwesibili ukwaneliseka kokusebenza kukagesi. Leli izinga elijwayelekile lokukala ukuthi ibhodi lesifunda eliphrintiwe liyafaneleka yini. Lokhu kungemuva kokusatshalaliswa, lungisa ngokucophelela i-wiring, ukuze ikwazi ukufeza ukusebenza kahle kukagesi. Bese kuba khona ubuhle. Uma indwangu yakho yezintambo yayixhunyiwe, futhi awunayo indawo yokuthi okuthinta ukusebenza kwezinto zikagesi, kepha ubheke ngokudlulele ngokweqile, engeza okugqamile, okugqamile, okubala ukuthi ukusebenza kwakho kwezinto zikagesi kuhle kanjani, kusengudoti kwabanye iso. Lokhu kuletha ukuphazamiseka okukhulu ekuhlolweni nasekulondolozweni. Ukuxhuma izintambo kufanele kucoceke futhi kufane, kungabi yinqwaba ngaphandle kwemithetho. Konke lokhu kufanele kufinyelelwe kumongo wokuqinisekisa ukusebenza kukagesi nokuhlangabezana nezinye izidingo zomuntu ngamunye, ngaphandle kwalokho kufanele kushiywe ingqikithi.

Ukuxhuma kwenziwa ikakhulukazi ngokuya ngalezi zimiso ezilandelayo: (1) Ngokuvamile, intambo yamandla nocingo lomhlabathi kufanele kuxhunywe izintambo kuqala ukuqinisekisa ukusebenza kagesi kwebhodi lesifunda. Ngokwesilinganiso sezimo vumela, ngangokunokwenzeka ukunweba ububanzi bokuphakelwa kwamandla, ucingo oluphansi, ucingo oluhamba phambili kakhulu lubanzi kunolayini wamandla, ubudlelwano babo yile: ucingo lwentambo> intambo yamandla> ulayini wesiginali, imvamisa ulayini wesiginali ngu: 0.2 ~ 0.3mm (cishe 8-12mil), ububanzi obuncane kuze kufike ku-0.05 ~ 0.07mm (2-3mil), intambo yamandla ngokuvamile i-1.2 ~ 2.5mm (50-100mil). I-PCB yesekethe yedijithali ingasetshenziswa njengesifunda esinabaqhubi bomhlaba abanzi, okungukuthi, inethiwekhi yomhlaba (i-analog circuit ground ayikwazi ukusetshenziswa ngale ndlela). (2) in advance to the more strict requirements of the line (such as high frequency line) wiring, input and output side line should avoid adjacent parallel, so as not to produce reflection interference. Uma kunesidingo, kufanele kufakwe i-wire wire ukuhlukanisa, futhi ukuxhunywa kwezingqimba ezimbili eziseduze kufanele kube okuqondakalayo komunye nomunye, okulula ukukhiqiza ukuhlangana kwe-parasitic ngokufana. (3) the oscillator shell is grounded, and the clock line should be as short as possible, and it can’t be everywhere. Ngezansi kwesekethe le-oscillation wesekethe, isekethe elikhethekile elinejubane eliphezulu kufanele lenyuse indawo engaphansi, futhi akufanele liye kolunye uphawu lwesiginali, ukuze inkambu kagesi ezungezile ithambekele ku-zero;

(4) Sebenzisa izintambo zomugqa ophukile ezingama-45 ° ngangokunokwenzeka, hhayi umugqa ophukile ongu-90 °, ukunciphisa imisebe yesiginali yemvamisa ephezulu; (5) Noma yimuphi umugqa wesiginali akufanele wakhe iluphu, uma ungenakugwenywa, iluphu kufanele libe lincane ngangokunokwenzeka; Umugqa wesiginali odlula emgodini kufanele ube mncane ngangokunokwenzeka; (6) Ulayini wokhiye kufanele ube mfushane futhi ube mkhulu ngangokunokwenzeka, nenhlabathi evikelayo kufanele ingezwe ezinhlangothini zombili. (7) lapho kudluliswa amasiginali azwelayo nezimpawu zensimu yomsindo ngezintambo eziyizicaba, kuyadingeka ukusebenzisa indlela “yomugqa womhlaba – isignali – ulayini womhlabathi”. (8) Amaphoyinti okuhlola kufanele agcinelwe amasiginali amakhulu okusiza ukuhlolwa kokukhiqiza nokunakekelwa. (9) Ngemuva kokuthi ukuqedwa kwentambo kuqediwe, izintambo kufanele zithuthukiswe; Ngasikhathi sinye, ngemuva kokuthi isheke lokuqala lenethiwekhi nokuhlolwa kwe-DRC kulungile, ucingo lwasemhlabeni luyagcwaliswa endaweni ngaphandle kwezintambo, futhi indawo enkulu yolwelwesi lwethusi isetshenziswa njengocingo lomhlabathi, futhi izindawo ezingasetshenziswanga zixhunywe nomhlabathi njengoba ucingo lomhlabathi ebhodini eliphrintiwe. Noma yenze ibhodi enezendlalelo eziningi, ukunikezwa kwamandla, ulayini wokubeka phansi ngamunye ungqimba.

(1) Umugqa Ngokuvamile, ububanzi bolayini wesiginali ngu-0.3mm (12mil), nobubanzi bolayini wamandla ngu-0.77mm (30mil) noma u-1.27mm (50mil); Ibanga phakathi kwentambo nocingo naphakathi kocingo nephedi kufanele likhulu noma lilingane no-0.33mm (13mil). Ekusebenzeni ngokoqobo, kufanele kubhekwe njengokunyusa ibanga lapho izimo zivuma; Lapho ukuminyana kwekhebula kuphezulu, kuyalulekwa (kepha akunconyiwe) ukusebenzisa izintambo ezimbili phakathi kwezikhonkwane ze-IC. Ububanzi bezintambo ngu-0.254mm (10mil), futhi ibanga phakathi kwezintambo alikho ngaphansi kuka-0.254mm (10mil). Ngaphansi kwezimo ezikhethekile, lapho iphini yedivayisi iminyene nobubanzi bumncane, ububanzi bomugqa nokuhlukaniswa kolayini kungancishiswa ngokufanele. (2) PAD (PAD) PAD (PAD) kanye nomgodi wenguquko (VIA) izidingo eziyisisekelo yilezi: ububanzi bediski kunobubanzi bomgodi bukhulu kune-0.6mm; Isibonelo, iziphikisi zohlobo lwe-pin universal, ama-capacitors namasekhethi ahlanganisiwe, kusetshenziswa usayizi wediski / imbobo 1.6mm /0.8mm (63mil / 32mil), isokhethi, iphini nedayode 1N4007, kusetshenziswa i-1.8mm / 1.0mm (71mil / 39mil). Ekusebenziseni okusebenzayo, kufanele kunqunywe ngosayizi wezinto zangempela. Uma izimo zitholakala, usayizi wephedi ungakhushulwa ngokufanele. Ukuvulwa kokufakwa kwezakhi ezenzelwe i-PCB kufanele kube cishe ngu-0.2 ~ 0.4mm (8-16mil) kukhulu kunosayizi wangempela wezikhonkwane zezinto. (3) I-perforation (VIA) imvamisa ingu-1.27mm / 0.7mm (50mil / 28mil); Lapho ukuminyana kwentambo kuphezulu, usayizi womgodi ungancishiswa ngokufanele, kepha hhayi omncane kakhulu, ungacubungula i-1.0mm / 0.6mm (40mil / 24mil). I-PAD ne-VIA: ≥ 0.3mm (12mil) i-PAD ne-PAD: ≥ 0.3mm (12mil) i-PAD ne-TRACK: ≥ 0.3mm (12mil) TRACK ne-TRACK: ≥ 0.3mm (12mil) ≥ 0.3mm (12mil) i-PAD ne-VIA: ≥ 0.254mm (10mil) i-PAD ne-TRACK: ≥ 0.254mm (10mil) i-PAD ne-TRACK: ≥ 0.254mm (10mil) TRACK kanye TRACK: ≥ 0.254mm (10mil)

I-7: ukwenziwa kwe-wiring nokuphrinta kwesikrini

“Akukho okungcono kakhulu, okungcono kuphela”! Akunandaba noma ngabe uzikhandla kangakanani ekwakhiweni, uma usuqedile, kubheke futhi, futhi usazozwa ukuthi ungashintsha okuningi. Umthetho wokuklama ojwayelekile wesithupha ukuthi i-wiring efanele ithatha kabili ubude bokubamba izintambo kokuqala. Ngemuva kokuzwa ukuthi akukho okudinga ukuguqulwa, ungabeka ithusi. Ukubeka ithusi ngokuvamile kubekwa phansi ucingo (naka ukwahlukaniswa komhlaba we-analog nedijithali), ibhodi le-multilayer lingadinga nokubeka amandla. Ukuphrinta kwesikrini, kufanele sinake ukuthi singavinjelwa yidivayisi noma sisuswe yimbobo nephedi. Ngasikhathi sinye, idizayini yokubhekana nengxenye yengxenye, phansi kwegama kufanele kube ukucubungula kwesibuko, ukuze kungadidanisi ileveli.

8: Ukuhlolwa kwenethiwekhi, iDRC nokwakheka

Ngaphambi kokudweba okulula, kudingekile ukuhlola. Yonke inkampani inohlu lwayo lokuhlola, kufaka phakathi izidingo zomgomo, ukuklama, ukukhiqiza nezinye izixhumanisi. Okulandelayo isingeniso semisebenzi emibili yokuhlola eyinhloko enikezwe yi-software. Ukuhlolwa kwe-DRC:

9: okukhipha umdwebo wokukhanya

Ngaphambi kokukhishwa komdwebo okhanyayo, qiniseka ukuthi i-veneer yinguqulo yakamuva eseqediwe futhi ihlangabezana nezidingo zedizayini. Ifayela lokukhipha lomdwebo wokukhanya lisetshenziselwa ukukhiqizwa kwebhodi efektri yepuleti, ukukhiqizwa kwensimbi yensimbi efektri yensimbi yensimbi, nefayela lenqubo yokukhiqiza efektri ye-welding.

The output files are as follows (take the four-layer board as an example) : 1). Wiring layer: refers to the conventional signal layer, mainly wiring. Zibizwa nge-L1, L2, L3, ne-L4, lapho i-L imele ungqimba lwesendlalelo sezintambo.

2). Isendlalelo sokuphrinta kwesikrini: kubhekiswa kungqimba kudokhumenti yokuqamba enikezela ngolwazi lokucutshungulwa kokuphrinta kwesikrini. Imvamisa, kuzoba nokuphrinta okuphezulu kwesikrini nokuphrinta kwesikrini esingezansi uma kukhona amadivayisi noma amamaki kusendlalelo esingaphezulu nesingezansi. Ukuqamba igama: ungqimba ophezulu uqanjwe ngo-SILK_TOP; Igama eliyisisekelo lingu-SILK_BOTTOM.