Amacandelo e-PCB akumgangatho ophezulu (PCBA) abe yimfuneko enkulu kushishino lombane. I-PCB Assembly isebenza njengecandelo elidityanisiweyo lezixhobo zombane ezahlukeneyo. Ukuba umvelisi wecandelo le-PCB akakwazi ukwenza umsebenzi ngenxa yempazamo yemveliso, ukusebenza kwezixhobo zombane ezahlukeneyo kuya kusongelwa. Ukuthintela umngcipheko, ii-PCBS kunye nabavelisi bendibano ngoku benza iintlobo ezahlukeneyo zokuhlola kwii-PCB kumanyathelo ahlukeneyo okuvelisa. Ibhlog ixoxa ngeendlela ezahlukeneyo zokuhlola i-PCBA kunye neentlobo zeziphene abazihlalutyayo.

Indlela yokujonga i-PCBA

Namhlanje, ngenxa yobunzima obuninzi beebhodi zeesekethe eziprintiweyo, ukuchongwa kweziphene zokuvelisa kunzima. Amaxesha amaninzi, i-PCBS inokuba neziphene ezinjengeesekethe ezivulekileyo nezifutshane, iindlela ezingalunganga, ii-welds ezingahambelaniyo, izinto ezingalunganga, izinto ezibekwe ngokungachanekanga, izinto ezingalunganga zombane, izinto zombane ezingekhoyo, njl. Ukuphepha zonke ezi meko, turnkey PCB abavelisi indibano sebenzisa iindlela zokuhlola zilandelayo.

Zonke iindlela zobugcisa ezixoxwe ngasentla ziqinisekisa uhlolo oluchanekileyo lwamacandelo e-PCB e-elektroniki kwaye zinceda ekuqinisekiseni umgangatho wamacandelo e-PCB phambi kokuba zimke kumzi-mveliso. Ukuba ucinga ngendibano yePCB yeprojekthi yakho elandelayo, qiniseka ukuba ufumana izibonelelo kwiinkonzo zendibano ye-PCB ethembekileyo.

Ukuhlolwa kwenqaku lokuqala

Umgangatho wemveliso uhlala uxhomekeke ekusebenzeni kakuhle kwe-SMT. Ke ngoko, phambi kokuba kuqaliswe ukudibanisa ngobuninzi kunye nokuveliswa, abavelisi be-PCB benza uhlolo lokuqala ukuqinisekisa ukuba izixhobo ze-SMT zifakwe ngokufanelekileyo. Olu hlolo lubanceda ukuba babone imilomo yevacuum kunye neengxaki zokulungelelanisa ezinokuphetshwa kwimveliso yomthamo.

Jonga ngokubonakalayo ifayile ye-

Ukuhlolwa okubonwayo okanye okuvulelekileyo – ukuhlola kwamehlo yenye yezona ndlela ziqhelekileyo zokuhlola ezisetyenziswayo ngexesha lendibano yePCB. Njengoko igama libonisa, oku kubandakanya ukuvavanya izinto ezahlukeneyo ngokusebenzisa iliso okanye isixhobo sokujonga izinto. Ukukhethwa kwezixhobo kuya kuxhomekeka kwindawo oza kuhlolwa kuyo.Ngokomzekelo, ukubekwa kwamacandelo kunye nokuprintwa kwe-solder paste kubonakala kwiso lenyama. Nangona kunjalo, iidiphozithi zokuncamathisela kunye neepads zethusi zinokubonwa kuphela nge-Z-high detector. Olona hlobo luqhelekileyo lokuhlola imbonakalo lwenziwa kwi-reflow weld yeprism, apho ukukhanya okubonakalisiweyo kuhlalutywa kwii-angles ezahlukeneyo.

Uvavanyo oluzenzekelayo

I-AOI yeyona ndlela iqhelekileyo kodwa ebanzi yokuhlola inkangeleko esetyenziswayo ukuchonga iziphene. I-AOI yenziwa kusetyenziswa iikhamera ezininzi, imithombo yokukhanya, kunye nethala leencwadi elikhokelweyo. Iinkqubo ze-AOI zinokucofa imifanekiso yamalungu e-solder kwii-engile ezahlukeneyo kunye neendawo ezithambekileyo. Iinkqubo ezininzi ze-AOI zinokujonga amalungu angama-30 ukuya kwangama-50 ngomzuzwana, nto leyo enceda ukunciphisa ixesha elifunekayo lokuchonga nokulungisa iziphene. Namhlanje, ezi nkqubo zisetyenziswa kuzo zonke izigaba PCB ibandla. Ngaphambili, iisistim ze-AOI bezingajongwa njengefanelekileyo ukulinganisa ubude bomdibaniso we-solder kwi-PCB. Nangona kunjalo, ngokufika kweenkqubo ze-3D AOI, oku kunokwenzeka ngoku. Ukongeza, iisistim ze-AOI zifanelekile ekuhloleni iindawo ezimile ezintsonkothileyo ezinezithuba eziyi-0.5mm.

Uviwo lwe-X-ray

Ngenxa yokusetyenziswa kwazo kwizixhobo ezincinci, imfuno yezinto ezixineneyo kunye nobungakanani obuncinci bebhodi yesekethe iyakhula. Itekhnoloji yokunyuka komphezulu (SMT) iye yaba lukhetho oludumileyo phakathi kwabavelisi bePCB abajonge ukuyila iPCBS exineneyo nentsonkothileyo besebenzisa izinto ezipakishwe ngeBGA. Nangona i-SMT inceda ukunciphisa ubungakanani beepakethe ze-PCB, ikwazisa nobunzima obungabonakaliyo ngeliso lenyama. Umzekelo, iphakheji encinci ye-chip (CSP) eyenziwe nge-SMT inokuba ne-15,000 yoqhagamshelo oludityanisiweyo olungangqinwanga lula ngeliso lenyama. Kulapho kusetyenziswa iiX-reyi. Inekhono lokungena kwi-solder joints kunye nokuchonga iibhola ezingekhoyo, izikhundla ze-solder, ukungahambi kakuhle, njl. I-X-ray ingena kwiphakheji ye-chip, enonxibelelwano phakathi kwebhodi yesekethe edibeneyo kunye ne-solder joint engezantsi.

Zonke iindlela zobugcisa ezixoxwe ngasentla ziqinisekisa uhlolo oluchanekileyo lwamacandelo e-elektroniki kunye nokunceda abahlanganisi bePCB baqinisekise umgangatho wabo phambi kokuba bahambe kwiplanti. Ukuba ucinga ngamacandelo e-PCB kwiprojekthi yakho elandelayo, qiniseka ukuba uthenge kumvelisi wecandelo le-PCB othembekileyo.