Emva kokuba i-laminate ye-copper clad icutshungulwe ukuvelisa Ibhodi PCB, ezahlukeneyo ngemingxuma, kunye nemingxuma yokuhlanganisa, amacandelo ahlukeneyo ahlanganiswe. Emva kokudibanisa, ukwenzela ukuba amacandelo afikelele ukudibanisa kunye nesekethe nganye ye-PCB, kuyimfuneko ukuqhuba inkqubo ye-Xuan welding. I-Brazing yohlulwe ngokweendlela ezintathu: i-wave soldering, i-reflow soldering kunye ne-solder manual. Amacandelo afakwe kwi-socket adibaniswe ngokubanzi ngokuthengiswa kwamaza; ukudityaniswa kwebrazi kwamacandelo axhonywe phezulu ngokuqhelekileyo kusebenzisa i-reflow soldering; amacandelo ngamnye kunye namacandelo enziwe ngesandla (i-chrome yombane) ngenxa yeemfuno zenkqubo yokufakela kunye ne-welding yokulungisa umntu. Intsimbi) ukuwelda.

1. Ukumelana ne-solder ye-laminate yobhedu

I-laminate ye-Copper efakwe kwi-substrate yimpahla ye-PCB. Ngexesha lokugqabhuka, lidibana noqhagamshelwano lwezinto ezinobushushu obuphezulu ngephanyazo. Ngako oko, inkqubo ye-welding ye-Xuan yindlela ebalulekileyo “yokutshatyalaliswa kwe-thermal” kwi-laminate ye-copper clad kunye novavanyo lokumelana nokushisa kwe-laminate ye-copper clad. I-laminates ene-Copper iqinisekisa umgangatho weemveliso zabo ngexesha lokutshatyalaliswa kwe-thermal, eyona nto ibalulekileyo yokuvavanya ukuxhathisa ukushisa kwee-laminates ezifakwe ubhedu. Kwangaxeshanye, ukuthembeka kwe-laminate ye-copper clad ngexesha le-Xuan welding nayo inxulumene namandla ayo okutsala, amandla e-peel phantsi kobushushu obuphezulu, kunye nokufuma kunye nokumelana nobushushu. Kwiimfuno zenkqubo yokuqhankqalaza kweelaminates ezinxibe ubhedu, ukongeza kwizinto eziqhelekileyo zokumelana nokuntywiliselwa, kwiminyaka yakutshanje, ukuze kuphuculwe ukuthembeka kweelaminates ezigqunywe ngobhedu kwi-welding ye-Xuan, umlinganiselo othile wesicelo kunye nezinto zokuhlola zongeziwe. Okufana nokufunxa ukufuma kunye novavanyo lokumelana nobushushu (unyango lwe-3 h, emva koko i-260 ℃ uvavanyo lwe-soldering), uvavanyo lokufunxa ukufunxa lokuphinda lufakwe kwi-soldering (ibekwe kwi-30 ℃, ukufuma okuhambelana ne-70% ixesha elichaziweyo, uvavanyo lokuphinda lufakwe kwi-soldering) njalo njalo. . Phambi kokuba iimveliso ezilaminethiweyo zobhedu zimke kumzi-mveliso, umenzi welaminethi egqunywe ngobhedu uya kwenza uvavanyo olungqongqo lwe-dip solder (ekwaziwa ngokuba yi-thermal blistering blistering) ngokomgangatho. Abavelisi bebhodi yesekethe eprintiweyo kufuneka kwakhona baqaphele le nto ngexesha emva kokuba i-laminate ye-copper clad ingena kumzi-mveliso. Kwangaxeshanye, emva kokuba isampulu yePCB ivelisiwe, ukusebenza kufuneka kuvavanywe ngokulinganisa iimeko zokuthengisela amaza kwiibhetshi ezincinci. Emva kokuqinisekisa ukuba olu hlobo lwe-substrate luhlangabezana neemfuno zomsebenzisi malunga nokuchasana nokuntywiliselwa kwe-soldering, i-PCB yolu hlobo inokuveliswa ngobuninzi kwaye ithunyelwe kumzi-mveliso womatshini opheleleyo.

Indlela yokulinganisa ukuxhathisa i-solder ye-laminates yobhedu ifana ngokusisiseko namazwe ngamazwe (GBIT 4722-92), umgangatho we-IPC waseMelika (IPC-410 1), kunye nomgangatho we-JIS waseJapan (JIS-C-6481-1996) . Ezona mfuno ziphambili zezi:

①Indlela yokumisela yolamlo “yindlela yokudada edadayo” (isampulu idada kumphezulu we-solder);

②Ubungakanani besampulu yi-25 mm X 25 mm;

③Ukuba indawo yomlinganiselo weqondo lobushushu yithemometha imekyuri, ithetha ukuba indawo enxuseneyo yentloko yemercury nomsila kwisolder yi (25 ± 1) mm; umgangatho we-IPC yi-25.4 mm;

④Ubunzulu bebhafu ye-solder ayikho ngaphantsi kwe-40 mm.

Kufuneka kuqatshelwe ukuba: indawo yokulinganisa iqondo lokushisa inempembelelo ebaluleke kakhulu kwimbonakaliso echanekileyo neyinyani yezinga lokumelana ne-dip solder yebhodi. Ngokuqhelekileyo, umthombo wokufudumeza we-solder tin uphantsi kwebhafu ye-tin. Okukhona mkhulu (unzulu) umgama phakathi kwendawo yokulinganisa ubushushu kunye nomgangatho we-solder, ukutenxa okukhulu phakathi kobushushu be-solder kunye nobushushu obulinganisiweyo. Ngeli xesha, iqondo elisezantsi lobushushu bomphezulu wolwelo kuneqondo lobushushu elilinganisiweyo, ixesha elide lepleyiti enoxhathiso lwediphu yediphu elinganiswa nesampulu yendlela yokuwelda ukudada ukuya kwiqamza.

2. Ukulungiswa kwamaza e-soldering

Kwinkqubo yokuthengiswa kwamaza, iqondo lobushushu le-solder liyiqondo lobushushu le-solder, kwaye eli qondo lobushushu lihambelana nohlobo lwe-solder. Ubushushu be-welding kufuneka bulawuleke ngokubanzi ngaphantsi kwe-250’c. Ukushisa okuphantsi kakhulu kwe-welding kuchaphazela umgangatho we-welding. Njengoko ubushushu be-soldering bukhula, ixesha le-soldering yediphu lifutshane kakhulu. Ukuba ukushisa kwe-soldering kuphezulu kakhulu, kuya kubangela ukuba isiphaluka (ityhubhu yobhedu) okanye i-substrate ibe yi-blistering, i-delamination, kunye ne-warpage enzulu yebhodi. Ngoko ke, ukushisa kwe-welding kufuneka kulawulwe ngokungqongqo.

Eyesithathu, ukusetyenzwa kwakhona kwe-welding

Ngokubanzi, iqondo lobushushu le-reflow soldering lingaphantsi kancinci kunobushushu be-solder. Ukusetwa kweqondo lobushushu le-reflow soldering linxulumene nale miba ilandelayo:

①Uhlobo lwezixhobo zokuphinda zithengiselwe;

②Imiqathango yokumisela isantya somgca, njl.;

③Udidi kunye nobungqingqwa bemathiriyeli yesubstrate;

④ Ubungakanani bePCB, njl.

Ubushushu obumiselweyo bokuphinda buphinde buphinde buphinde bufakwe kwi-soldering buhluke kubushushu bomphezulu we-PCB. Kwiqondo lobushushu obusetiyo obufanayo bokuthengiswa kwe-reflow, ubushushu bomphezulu wePCB bukwahluka ngenxa yohlobo kunye nobukhulu bezinto ezingaphantsi.

Ngethuba lenkqubo yokuthengiswa kwe-reflow, umda wokumelana nobushushu bobushushu bomphezulu we-substrate apho i-foil yobhedu idumba (amaqamza) iya kutshintsha ngeqondo lokushisa langaphambili le-PCB kunye nobukho okanye ukungabikho kokufunxa ukufuma. Inokubonwa kwi-Figure 3 ukuba xa i-preheating ye-PCB (iqondo lokushisa elingaphezulu kwe-substrate) liphantsi, umda wokumelana nokushisa kweqondo lokushisa eliphantsi kwe-substrate apho ingxaki yokuvuvukala iyenzeka nayo iphantsi. Ngaphantsi kwemeko yokuba iqondo lokushisa elibekwe nge-soldering ye-reflow kunye ne-preheating ye-soldering ye-reflow ihlala ihleli, ubushushu bomhlaba buhla ngenxa yokufunxa ukufuma kwe-substrate.

Isine, ukuwelda ngesandla

Ekulungiseni ukuwelda okanye ukwahlula ukuwelda ngesandla kwamacandelo akhethekileyo, ubushushu bomphezulu be-ferrochrome yombane kufuneka bube ngaphantsi kwe-260 ℃ kwiilaminates ezigqunywe ngobhedu esekwe ephepheni, kwaye ngaphantsi kwe-300 ℃ kwiilaphu zeglasi zefiber ezisekelwe kwilaphu lobhedu. Kwaye kangangoko kunokwenzeka ukunciphisa ixesha le-welding, iimfuno eziqhelekileyo; iphepha substrate 3s okanye ngaphantsi, glass fiber ilaphu substrate yi 5s okanye ngaphantsi.