1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Autoklav trykkoger

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Denne tidlige MLB-kompression ved hjælp af et enkelt kobberhud-tyndt substrat blev kaldt Cap LaminaTIon.

3. Caul Plate

Når flerlagspladen presses, mellem hver åbning af presselejet (åbning), stables ofte mange “bøger” for at blive presset plade løst materiale (såsom 8~10 sæt), mellem hvert sæt “løst materiale” (bog) , skal adskilles af flad glat og hård rustfri stålplade, Denne slags spejlplade i rustfrit stål kaldes Caul Plate eller Separate Plate. AISI 430 eller AISI 630 er almindeligt anvendt i øjeblikket.

4. Fold

I laminatpresning, refererer ofte til kobberhuden i behandlingen af ​​folder. Tynd kobberhud mindre end 0.5 oz er mere tilbøjelig til denne defekt, når den presses i flere lag.

5. Buk

Det refererer til den blide og jævne nedsænkning på kobberoverfladen, som kan være forårsaget af det plettede fremspring af stålpladen, der anvendes ved presningen. Falder kanten af ​​tallerkenen pænt ned på en fejlagtig måde, kaldes det Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Men når harpiksen i filmen bulkmateriale er blødgjort af varme og gelatineret, og vil hærde, det vil sige at øge til det fulde tryk (300 ~ 500 PSI), således at bulkmaterialet for at opnå tæt kombination og dannelsen af ​​en fast flerlagsplade.

8. Kraft Paper

Kraftpapir bruges som varmeoverførselsbuffer til laminering af flerlagsplader eller substratplader. Den placeres mellem pressens varmeplade (Platern) og stålpladen for at moderere varmekurven tættest på bulkmaterialet. Mellem flere substrat- eller flerlagsplader, der skal presses. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. På grund af høj temperatur og højt tryk er fiberen i papiret blevet brudt, har ikke længere sejhed og svær at spille en rolle, så vi må prøve at erstatte. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. For at spare anlæg og dele udstyr vil den generelle fabrik være mere “overlap” og “foldeplade” begge fusioneret til en omfattende behandlingsenhed, så dens automatiseringsteknik er ret kompleks.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Siden 1986, hvor efterspørgslen efter fire og seks laminater er steget, har metoden til at laminere multilaminater ændret sig meget. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Plademetoden for dette nye koncept kaldes “stor plade” eller “stor plade”. I de seneste år har der været mange professionelle OEM-presseindustrier i Kina.

11. Plade varmeplader

Det er en bevægelig løfteplatform til fremstilling af laminatpressemaskine eller bundplade. Den hule metal mesa af denne form for massiness, dybest set er det at tilbyde tryk og varmekilde til planke, fornuften skal stadig kan opretholde flad, parallel evne i høj temperatur til at gå. Normalt er hver varmeplade indlejret inde i damprøret, varmeslangen eller modstandsvarmeelementet, og den ydre kant af omgivelserne skal også fyldes med isolerende materiale for at reducere varmetabet og være udstyret med en temperaturføler til at kontrollere temperatur.

12. Press Plate

Henviser til substratet eller flerlagspladen i presningen, der bruges til at adskille hver gruppe af løse bøger (henviser til kobber, film og indre lag af en bog osv.). Denne stålplade med høj hårdhed er AISI 630 (hårdhed op til 420 VPN) eller AISI 440C(600 VPN) legeret stål, overfladen er ikke kun ekstrem hård flad, og omhyggeligt poleret til at spejlvende, kan presses ind i det flade underlag eller printplade . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Kravene til denne stålplade er meget strenge, dens overflade bør ikke forekomme nogen ridser, buler eller vedhæftning, tykkelsen skal være ensartet, hårdheden skal være tilstrækkelig og kan modstå den kemiske ætsning produceret ved højtemperaturpresning. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Trykstyrken (PSI), der anvendes, når den laminerede plade er for stor, så mange harpikser ekstruderes ud af pladen, hvilket resulterer i, at kobberhuden presses direkte på glasdugen, og selv glasdugen bliver flad og deformeret, så at pladetykkelsen er utilstrækkelig, størrelsesstabiliteten er dårlig, og den indvendige linje er presset ud af form og andre defekter. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Faktisk er det bare en form for “Draven” for lamineret krydsfiner, uden yderligere betydning.

15. Resin Recession, Resin retreat

Sandwichplade i B-stadiet af harpiksfilm eller BoJi-plade (hvorfor) i førstnævnte, kunne endnu ikke hærde fuldstændigt efter presning (dvs. manglende polymerisationsgrad), fyld hullet på tinsøjlen op, når for en biopsi, fandt, at kobbervæggen af ​​hullet bag manglen på visse polymerisationsharpiks, vil se ud fra kobbervæggen tilbage til tom, betyder “harpikssynkning”. Denne defekt bør klassificeres som et overordnet problem i processen eller pladen, som er mere alvorlig end de tekniske defekter på overfladeridsen, og årsagen bør undersøges omhyggeligt.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Når bundpladen eller flerlagspladen presses, er den hårde rustfri stålplade (410,420 osv.), der bruges til at adskille bøgerne i hver åbning (dagslys) af pressen. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Det refererer til sammenkoblingen af ​​lagene på et flerlagskort, der ikke er dannet på samme tid, men på samme tid på samme tid i form af blinde eller nedgravede huller. Denne metode kan spare overfladen af ​​brættet skal bores ud af det fulde hul. Yderligere boards kunne stilles til rådighed for at øge antallet af ledninger og SMDS, men fremstillingsprocessen blev betydeligt forsinket.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Henviser til harpiksen flow dårlige, eller trykke betingelser med forkert, hvilket resulterer i færdiggørelsen af ​​flerlags bord, pladen krop af den lokale mangel på lim.

20. The Swimming line slides away

Svømning refererer til en glidende bevægelse af det indre lag af et flerlagsbræt under kompression. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraferende flydende trykning, skjult trykning

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Men når filmen, der anvendes til den ydre plade, er relativt tynd, og kobberfolien kun er 0.5 oz, kan kredsløbsmønsteret af den indre plade overføres til slippapiret under højt tryk. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Temperaturprofil

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Ordet optræder ofte i PCB-industrien i laminat- og tørfilmbinding. Vakuumpresningen af ​​flerlagsplade er opdelt i Vakuum ydre Frame (Vacuum Frame), som er “pumpemetoden” med den originale hydrauliske presse, og Vakuumkammeret (Autoclave), som er “trykmetoden” med brug af høj temperatur og højtryk kuldioxid. Hydralic Vacuum Pressing optager mere end 90% af markedet på grund af dets enkle udstyr, billige pris og bekvemme betjening. Sidstnævnte skyldes, at udstyret og driften er meget kompleks, og volumen er meget stor, plus omkostningerne ved de nødvendige forsyninger og dyrere, så vedtagelsen er ikke meget.

24. Rynke, Rynke

Henviser ofte til trykket, når limstrømmen er for stor. 11. Rynke forårsager Rynken, hvilket får dets ydre lag til at være lidt svagere i styrke og hårdhed, som 0.5 oz kobberfolie almindeligvis kendt som Wrinkle. The term is also used in other areas.