1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Autoklav tryckkokare

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Denna tidiga MLB-kompression med ett enda tunt substrat av kopparhud kallades Cap LaminaTIon.

3. Caul Plate

När flerskiktsplattan pressas, mellan varje öppning av pressbädden (öppning), staplas ofta många “böcker” för att pressas platta löst material (som 8~10 set), mellan varje uppsättning “löst material” (bok) , måste separeras av platt slät och hård rostfri stålplåt, Denna typ av spegelplatta i rostfritt stål kallas Caul Plate eller Separate Plate. AISI 430 eller AISI 630 används ofta för närvarande.

4. Crease

In the laminate pressing, often refers to the copper skin in the processing of the crease. Thin copper skin less than 0.5 oz is more prone to this defect when pressed in multiple layers.

5. Dent

Det hänvisar till den milda och jämna sättningen på kopparytan, som kan orsakas av det fläckiga utsprånget på stålplåten som används vid pressningen. Om tallrikens kant faller prydligt på ett felliknande sätt kallas det för Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. But when the resin in the film bulk material is softened by heat and gelatinized, and will harden, that is, to increase to the full pressure (300 ~ 500 PSI), so that the bulk material to achieve close combination and the formation of a firm multi-layer board.

8. Kraftpapper

Kraftpapper används som värmeöverföringsbuffert för laminering av flerskiktsskivor eller substratskivor. Den placeras mellan pressens värmeplatta (Platern) och stålplattan för att dämpa värmekurvan närmast bulkmaterialet. Between multiple substrate or multilayer plates to be pressed. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. På grund av hög temperatur och högt tryck har fibern i papperet gått sönder, har inte längre seghet och svår att spela en roll, så vi måste försöka byta ut. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. In order to save plant and share equipment, the general factory will be more “overlap” and “folding board” both merged into a comprehensive processing unit, so its automation engineering is quite complex.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Sedan 1986, när efterfrågan på fyra och sex laminat har ökat, har metoden att laminera multilaminat förändrats mycket. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Plattmetoden för detta nya koncept kallas “stor platta” eller “stor platta”. Under de senaste åren har det funnits många professionella OEM-pressindustrier i Kina.

11. Platta Varmplattor

Det är en flyttbar lyftplattform för tillverkning av laminatpressmaskin eller basplatta. Den ihåliga metall mesa av denna typ av massiness, i grund och botten är att erbjuda tryck och värmekälla till planka, måste förnuftet fortfarande kan behålla platt, parallell förmåga i hög temperatur att gå. Vanligtvis är varje värmeplatta inbäddad inuti ångröret, varmslangen eller motståndsvärmeelementet, och den yttre kanten av omgivningen bör också fyllas med isolerande material för att minska värmeförlusten och utrustad med en temperaturavkänningsanordning för att kontrollera temperatur.

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). Denna stålplåt med hög hårdhet är AISI 630 (hårdhet upp till 420 VPN) eller AISI 440C(600 VPN) legerat stål, ytan är inte bara extremt hård platt, och noggrant polerad för att spegelvända, kan pressas in i det plana underlaget eller kretskortet . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Kraven på denna stålplåt är mycket stränga, dess yta bör inte förekomma några repor, bucklor eller fäste, tjockleken ska vara enhetlig, hårdheten ska vara tillräcklig och tål den kemiska etsningen som produceras av högtemperaturpressning. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Tryckhållfastheten (PSI) som används när den laminerade plattan är för stor, så att många hartser extruderas ur plattan, vilket resulterar i att kopparhuden pressas direkt på glasduken och till och med glasduken plattas till och deformeras, så att plåttjockleken är otillräcklig, storleksstabiliteten är dålig och den inre linjen pressas ur form och andra defekter. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. I själva verket är det bara en form av “Draven” för laminerad plywood, utan någon vidare betydelse.

15. Resin Recession, Resin retreat

Sandwich plate in the B – stage of resin film or BoJi board (why) in the former, could not yet completely hardened after pressing (that is, the lack of degree of polymerization), fill up the hole on the tin tin column, when for a biopsy, found that the copper wall of hole behind the lack of certain polymerization resin, will appear from copper wall back to empty, “resin subsidence” means. This defect should be classified as an overall problem of the process or the plate, which is more serious than the technical defects of the surface scratch, and the cause should be carefully investigated.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

När basplattan eller flerskiktsplattan pressas, är den hårda rostfria stålplattan (410,420, etc.) som används för att separera böckerna i varje öppning (dagsljus) av pressen. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

It refers to the Interconnection of the layers of a multilayer board that is formed not at the same time but at the same time at the same time in the form of blind or buried holes. This method can save the surface of the board must be drilled out of the full hole. Ytterligare kort kunde göras tillgängliga för att öka antalet ledningar och SMDS, men tillverkningsprocessen försenades avsevärt.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Refers to the resin flow bad, or pressing conditions with improper, resulting in the completion of the multilayer board, the plate body of the local lack of glue.

20. The Swimming line slides away

Simning hänvisar till en glidrörelse av det inre lagret av en flerskiktsbräda under kompression. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraferande flytande tryckning, dold tryckning

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. However, when the film used for the outer plate is relatively thin and the copper foil is only 0.5 oz, the circuit pattern of the inner plate may be transferred to the release paper under high pressure. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

The word often appears in the PCB industry in the laminate and dry film bonding. The Vacuum pressing of multilayer board is divided into Vacuum outer Frame (Vacuum Frame), which is the “pumping method” with the original hydraulic press, and the Vacuum chamber (Autoclave), which is the “pressure method” with the use of high temperature and high pressure carbon dioxide. Hydralic Vacuum Pressing occupies more than 90% of the market because of its simple equipment, cheap price and convenient operation. The latter is because the equipment and operation are very complex, and the volume is very large, plus the cost of the required supplies and more expensive, so the adoption is not much.

24. Wrinkle, Wrinkle

Syftar ofta på trycket när limflödet är för stort. 11. Wrinkle Causes the Wrinkle, which causes its outer layer to be slightly weaker in strength and hardness, as the 0.5oz copper foil commonly known as Wrinkle. The term is also used in other areas.