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PCB laminated process

1.高压锅

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. 这种使用单一铜皮薄基板的早期 MLB 压缩称为 Cap LaminaTIon。

3. Caul Plate

多层板压制时，在每个压床的开口（Opening）之间，往往会堆放许多“书”来压板松散材料（如8~10套），每组“松材料”（书）之间，必须用平整光滑坚硬的不锈钢板隔开， 这种镜面不锈钢板称为Caul Plate或Separate Plate。 目前常用的是AISI 430或AISI 630。

4. Crease

In the laminate pressing, often refers to the copper skin in the processing of the crease. 小于 0.5 盎司的薄铜皮在多层压制时更容易出现这种缺陷。

5. 凹痕

它是指铜表面的轻微甚至下沉，这可能是由于压制时所用钢板的点状突起造成的。 如果盘子的边缘呈断层状整齐地落下，则称为Dish Down。 These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. But when the resin in the film bulk material is softened by heat and gelatinized, and will harden, that is, to increase to the full pressure (300 ~ 500 PSI), so that the bulk material to achieve close combination and the formation of a firm multi-layer board.

8. 牛皮纸

牛皮纸用作层压多层板或基板的传热缓冲器。 它放置在压力机的热板（Paltern）和钢板之间，以缓和最接近散装物料的加热曲线。 Between multiple substrate or multilayer plates to be pressed. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. 由于高温高压，纸中的纤维已经断裂，不再有韧性，难以发挥作用，所以必须尽量更换。 This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. 为了节省厂房和共享设备，一般工厂会更多地将“重叠”和“折板”两者合并为一个综合处理单元，因此其自动化工程相当复杂。

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. 自 1986 年以来，当四层和六层层压板的需求增加时，多层板的层压方法发生了很大变化。 In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. 这种新概念的压板方法称为“大压板”或“大压板”。 近年来，国内出现了许多专业的OEM冲压行业。

11.台板热板

它是一种用于层压机或基板制造的可移动升降平台。 这种厚重的中空金属台面，主要是为板材提供压力和热源，故必须在高温下仍能保持平坦、平行的能力。 通常每块热板都嵌在蒸汽管、热管或电阻加热元件内部，周围的外边缘也应填充绝缘材料，以减少热量损失，并配有温度传感装置来控制温度。

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). 这种高硬度钢板是AISI 630（硬度可达420 VPN）或AISI 440C（600 VPN）合金钢，表面不仅极其坚硬平整，而且精心打磨成镜面，可压入平整基板或电路板. Therefore, it is also called Mirror Plate, also known as Carrier Plate. 这种钢板的要求非常严格，其表面不应出现任何划痕、凹痕或附着物，厚度应均匀，硬度应足够，并能承受高温压制产生的化学腐蚀。 The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

层压板过大时使用的压力强度（PSI），使许多树脂被挤出板外，导致铜皮直接压在玻璃布上，甚至玻璃布被压扁变形，所以板厚不足，尺寸稳定性差，内线压出变形等缺陷。 在严重的情况下，线基经常与玻璃纤维布直接接触，埋下“导电玻璃纤维”的泄漏隐患。 CAF）。 The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. 事实上，它只是层压胶合板的一种“Draven”形式，没有其他含义。

15. Resin Recession, Resin retreat

B-阶段的夹心板或玻基板（为什么）在前，压制后还不能完全硬化（即聚合度不足），填满锡锡柱上的孔，当进行活检，发现孔洞后面的铜壁缺少一定的聚合树脂，会出现从铜壁回空，“树脂下陷”的意思。 这种缺陷应归类为工艺或板材的整体问题，比表面划伤的技术缺陷更严重，应仔细调查原因。

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

压印底板或多层板时，用硬质不锈钢板（410,420、XNUMX等）在印刷机的每个开口（日光）中分离书籍。 In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

It refers to the Interconnection of the layers of a multilayer board that is formed not at the same time but at the same time at the same time in the form of blind or buried holes. This method can save the surface of the board must be drilled out of the full hole. 可以提供额外的板来增加布线和 SMDS 的数量，但制造过程被大大延迟。

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Refers to the resin flow bad, or pressing conditions with improper, resulting in the completion of the multilayer board, the plate body of the local lack of glue.

20. The Swimming line slides away

游动是指多层板内层在压缩过程中的滑动运动。 This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21.电报浮印、隐印

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. However, when the film used for the outer plate is relatively thin and the copper foil is only 0.5 oz, the circuit pattern of the inner plate may be transferred to the release paper under high pressure. 脱模纸在一套板子上重复使用时，很可能会在新板子的铜面上浮起原来的图案，这种现象称为电报现象。

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

The word often appears in the PCB industry in the laminate and dry film bonding. The Vacuum pressing of multilayer board is divided into Vacuum outer Frame (Vacuum Frame), which is the “pumping method” with the original hydraulic press, and the Vacuum chamber (Autoclave), which is the “pressure method” with the use of high temperature and high pressure carbon dioxide. Hydralic Vacuum Pressing occupies more than 90% of the market because of its simple equipment, cheap price and convenient operation. 后者是因为设备和操作很复杂，而且体积很大，加上所需耗材的成本也比较贵，所以采用的并不多。

24.皱纹，皱纹

常指胶水流量过大时的压力。 11.皱纹产生皱纹，导致其外层的强度和硬度稍弱，如0.5oz铜箔俗称皱纹。 The term is also used in other areas.