1. It is the first time that we have been able to do this. 2

BPA laminated process

1. Periuk tekanan autoklaf

Laminates adalah bekas yang diisi dengan wap air tepu suhu tinggi, dan boleh menggunakan tekanan tinggi, Laminasi spesimen, diletakkan di dalamnya untuk tempoh masa, memaksa air ke dalam pinggan, dan kemudian mengeluarkan pinggan dan diletakkan di atas permukaan timah cair suhu tinggi, ukuran ciri-ciri “rintangan terhadap pelaminasi”. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Mampatan MLB awal menggunakan substrat nipis kulit tembaga tunggal ini dipanggil Cap LaminaTIon.

3. Caul Plate

Apabila plat berbilang lapisan ditekan, di antara setiap Pembukaan katil akhbar (Pembukaan), selalunya disusun banyak “buku” untuk ditekan bahan longgar plat (seperti 8~10 set), di antara setiap set “bahan longgar” (Buku) , mesti dipisahkan oleh plat keluli tahan karat yang licin dan keras, Plat keluli tahan karat cermin jenis ini dipanggil Plat Caul atau Plat Berasingan. AISI 430 atau AISI 630 biasanya digunakan pada masa ini.

4. Crease

Dalam menekan lamina, sering merujuk kepada kulit tembaga dalam pemprosesan lipatan. Kulit tembaga nipis kurang daripada 0.5 oz lebih terdedah kepada kecacatan ini apabila ditekan dalam beberapa lapisan.

5. Kemek

Ia merujuk kepada penenggelaman lembut dan sekata pada permukaan tembaga, yang mungkin disebabkan oleh tonjolan bertompok plat keluli yang digunakan dalam menekan. Jika tepi pinggan jatuh dengan kemas dengan cara seperti kerosakan, ia dipanggil Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. But when the resin in the film bulk material is softened by heat and gelatinized, and will harden, that is, to increase to the full pressure (300 ~ 500 PSI), so that the bulk material to achieve close combination and the formation of a firm multi-layer board.

8. Kertas Kraft

Kertas kraft digunakan sebagai penimbal pemindahan haba untuk melamina papan berbilang lapisan atau papan substrat. Ia diletakkan di antara plat panas (Platern) penekan dan plat keluli untuk menyederhanakan lengkung pemanasan yang paling hampir dengan bahan pukal. Between multiple substrate or multilayer plates to be pressed. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Kerana suhu tinggi dan tekanan tinggi, gentian dalam kertas telah pecah, tidak lagi mempunyai keliatan dan sukar untuk memainkan peranan, jadi kita mesti cuba menggantikannya. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Untuk menjimatkan loji dan berkongsi peralatan, kilang am akan menjadi lebih “bertindih” dan “papan lipat” kedua-duanya digabungkan menjadi unit pemprosesan yang komprehensif, jadi kejuruteraan automasinya agak rumit.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Sejak tahun 1986, apabila permintaan untuk empat dan enam lamina telah meningkat, kaedah laminating multilamina telah banyak berubah. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Kaedah platen konsep baru ini dipanggil “plat besar” atau “plat besar”. Dalam beberapa tahun kebelakangan ini, terdapat banyak industri menekan OEM profesional di China.

11. Pinggan Pinggan panas

Ia adalah platform angkat alih untuk mesin penekan lamina atau pembuatan plat asas. Mesa logam berongga jenis jisim ini, pada asasnya ia adalah untuk menawarkan tekanan dan sumber haba untuk papan, sebab mesti masih boleh mengekalkan rata, keupayaan selari dalam suhu tinggi untuk pergi. Biasanya setiap plat panas tertanam di dalam paip stim, tiub panas atau elemen pemanasan rintangan, dan pinggir luar persekitaran juga harus diisi dengan bahan penebat, untuk mengurangkan kehilangan haba, dan dilengkapi dengan peranti pengesan suhu untuk mengawal suhu.

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). Plat keluli kekerasan tinggi ini ialah keluli aloi AISI 630 (kekerasan sehingga 420 VPN) atau AISI 440C (600 VPN), permukaannya bukan sahaja rata yang sangat keras, dan digilap dengan teliti untuk cermin, boleh ditekan ke dalam substrat rata atau papan litar . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Keperluan plat keluli ini sangat ketat, permukaannya tidak sepatutnya kelihatan apa-apa calar, penyok atau lampiran, ketebalan harus seragam, kekerasan harus cukup, dan dapat menahan goresan kimia yang dihasilkan oleh tekanan suhu tinggi. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Kekuatan tekanan (PSI) digunakan apabila plat berlapis terlalu besar, sehingga banyak resin tersemperit keluar dari plat, mengakibatkan kulit tembaga terus ditekan pada kain kaca, dan bahkan kain kaca menjadi rata dan cacat, jadi bahawa ketebalan plat tidak mencukupi, kestabilan saiz adalah buruk, dan garisan dalam ditekan keluar dari bentuk dan kecacatan lain. Dalam kes yang serius, asas wayar selalunya mempunyai sentuhan terus dengan kain gentian kaca, menimbulkan kebimbangan kebocoran “gentian kaca konduktif”. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Malah, ia hanyalah satu bentuk “Draven” untuk papan lapis berlamina, tanpa makna lagi.

15. Resin Recession, Resin retreat

Plat sandwic dalam B – peringkat filem resin atau papan BoJi (mengapa) dalam bekas, belum dapat mengeras sepenuhnya selepas ditekan (iaitu kekurangan tahap pempolimeran), mengisi lubang pada tiang timah, apabila untuk biopsi, mendapati bahawa dinding kuprum lubang di belakang kekurangan resin pempolimeran tertentu, akan muncul dari dinding tembaga kembali ke kosong, “penenggelaman resin” bermaksud. Kecacatan ini harus diklasifikasikan sebagai masalah keseluruhan proses atau plat, yang lebih serius daripada kecacatan teknikal calar permukaan, dan puncanya harus disiasat dengan teliti.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Apabila plat asas atau plat berbilang lapisan ditekan, plat keluli tahan karat keras (410,420, dsb.) yang digunakan untuk memisahkan Buku dalam setiap Pembukaan (Daylight) akhbar ialah. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

It refers to the Interconnection of the layers of a multilayer board that is formed not at the same time but at the same time at the same time in the form of blind or buried holes. This method can save the surface of the board must be drilled out of the full hole. Papan tambahan boleh disediakan untuk menambah bilangan pendawaian dan SMDS, tetapi proses pembuatan telah tertangguh dengan ketara.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Merujuk kepada aliran resin yang buruk, atau keadaan menekan dengan tidak betul, menyebabkan penyiapan papan multilayer, badan plat kekurangan tempatan gam.

20. The Swimming line slides away

Berenang merujuk kepada pergerakan gelongsor lapisan dalam papan berbilang lapisan semasa pemampatan. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraf percetakan terapung, percetakan tersembunyi

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. However, when the film used for the outer plate is relatively thin and the copper foil is only 0.5 oz, the circuit pattern of the inner plate may be transferred to the release paper under high pressure. Apabila kertas demoulding digunakan semula pada set papan, ia berkemungkinan mengapungkan corak asal pada permukaan tembaga papan baharu, fenomena ini dipanggil Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Perkataan ini sering muncul dalam industri PCB dalam ikatan filem lamina dan kering. Penekanan vakum papan berbilang lapisan dibahagikan kepada Bingkai luar Vakum (Bingkai Vakum), iaitu “kaedah pengepaman” dengan penekan hidraulik asal, dan kebuk Vakum (Autoclave), iaitu “kaedah tekanan” dengan penggunaan tinggi. suhu dan karbon dioksida tekanan tinggi. Penekan Vakum Hidralik menduduki lebih daripada 90% pasaran kerana peralatannya yang ringkas, harga yang murah dan operasi yang mudah. Yang terakhir adalah kerana peralatan dan operasinya sangat kompleks, dan jumlahnya sangat besar, ditambah dengan kos bekalan yang diperlukan dan lebih mahal, jadi penggunaannya tidak banyak.

24. Kedut, Kedut

Selalunya merujuk kepada tekanan apabila aliran gam terlalu besar. 11. Kedutan Menyebabkan Kedutan, yang menyebabkan lapisan luarnya menjadi lemah sedikit dalam kekuatan dan kekerasan, kerana kerajang tembaga 0.5oz yang biasa dikenali sebagai Kedutan. The term is also used in other areas.