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PCB laminated process

1.高壓鍋

層壓板是一種盛滿高溫飽和水蒸氣的容器，可以施加高壓，將試樣層壓，在其中放置一段時間，迫使水進入板中，然後取出板放置在樣品表面。高溫熔融錫，測量其“抗層壓”特性。 This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. 這種使用單一銅皮薄基板的早期 MLB 壓縮稱為 Cap LaminaTIon。

3. Caul Plate

多層板壓制時，在每個壓床的開口（Opening）之間，往往堆放許多“書”來壓板鬆散材料（如8~10套），每組“松材料”（書）之間，必須用平整光滑堅硬的不銹鋼板隔開， 這種鏡面不銹鋼板稱為Caul Plate或Separate Plate。 目前常用的是AISI 430或AISI 630。

4. Crease

在層壓板壓制中，常指在加工摺痕時對銅皮進行處理。 小於 0.5 盎司的薄銅皮在多層壓制時更容易出現這種缺陷。

5. 凹痕

它是指銅表面的輕微甚至下沉，這可能是由於壓制時所用鋼板的點狀突起造成的。 如果盤子的邊緣呈斷層狀整齊地落下，則稱為Dish Down。 These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. 但當薄膜塊料中的樹脂受熱軟化、膠化，並會變硬，即增加到全壓（300～500PSI），使塊料達到緊密結合併形成堅固的多層板。

8. 牛皮紙

牛皮紙用作層壓多層板或基板的傳熱緩衝器。 它放置在壓力機的熱板（Paltern）和鋼板之間，以緩和最接近散裝物料的加熱曲線。 Between multiple substrate or multilayer plates to be pressed. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. 由於高溫高壓，紙中的纖維已經斷裂，不再有韌性，難以發揮作用，所以必須盡量更換。 This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. 為了節省廠房和共享設備，一般工廠將更多的“重疊”和“折疊板”兩者合併為一個綜合處理單元，因此其自動化工程相當複雜。

10. Mass LaminaTIon (laminated)

這是一種摒棄“對齊尖端”而在同一表面上採用多排板的新施工方法。 自 1986 年以來，當四層和六層層壓板的需求增加時，多層板的層壓方法發生了很大變化。 In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. 二是取消對中針尖的各種鬆散材料（如內片、薄膜、外單片等）； The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. 這種新概念的壓板方法稱為“大壓板”或“大壓板”。 近年來，國內出現了許多專業的OEM沖壓行業。

11.台板熱板

它是一種用於層壓機或基板製造的可移動升降平台。 這種厚重的中空金屬檯面，主要是為板材提供壓力和熱源，故在高溫下仍須能保持平整、平行的能力。 通常每塊熱板都嵌在蒸汽管、熱管或電阻加熱元件內部，周圍的外邊緣也應填充絕緣材料，以減少熱量損失，並配有溫度傳感裝置來控制溫度。

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). 這種高硬度鋼板是AISI 630（硬度可達420 VPN）或AISI 440C（600 VPN）合金鋼，表面不僅極其堅硬平整，而且經過精心打磨成鏡面，可壓入平整基板或電路板. Therefore, it is also called Mirror Plate, also known as Carrier Plate. 這種鋼板的要求非常嚴格，其表面不應出現任何划痕、凹痕或附著物，厚度應均勻，硬度應足夠，並能承受高溫壓制產生的化學腐蝕。 The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

層壓板過大時使用的壓力強度（PSI），使許多樹脂被擠出板外，導致銅皮直接壓在玻璃布上，甚至玻璃布被壓扁變形，所以板厚不足，尺寸穩定性差，內線壓出變形等缺陷。 嚴重時，線基往往與玻璃纖維布直接接觸，埋下“導電玻璃纖維”漏電隱患。 CAF）。 The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. 事實上，它只是層壓膠合板的一種“Draven”形式，沒有其他含義。

15. Resin Recession, Resin retreat

B-階段的夾心板或玻基板（為什麼）在前，壓制後還不能完全硬化（即聚合度不足），填滿錫柱上的孔，當進行活檢，發現孔洞後面的銅壁缺少一定的聚合樹脂，會出現從銅壁回空，“樹脂下陷”的意思。 這種缺陷應歸類為工藝或板材的整體問題，比表面劃傷的技術缺陷更嚴重，應仔細調查原因。

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

壓印底板或多層板時，用硬質不銹鋼板（410,420，XNUMX等）在印刷機的每個開口（日光）中分離書籍。 In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

It refers to the Interconnection of the layers of a multilayer board that is formed not at the same time but at the same time at the same time in the form of blind or buried holes. 這種方法可以省去板面必須鑽出的全孔。 可以提供額外的板來增加佈線和 SMDS 的數量，但製造過程被大大延遲。

19. 飢餓膠

這個詞在電路板行業中，一直是常用的多層板粘接“缺膠”餓死問題的表達方式。 指樹脂流動不良，或壓合條件不當，造成多層板完成後，板體局部缺膠。

20. The Swimming line slides away

游動是指多層板內層在壓縮過程中的滑動運動。 This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21.電報浮印、隱印

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. However, when the film used for the outer plate is relatively thin and the copper foil is only 0.5 oz, the circuit pattern of the inner plate may be transferred to the release paper under high pressure. 脫模紙在一套板子上重複使用時，很可能會在新板子的銅面上浮起原來的圖案，這種現象稱為電報現象。

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

這個詞經常出現在PCB行業的層壓板和乾膜粘合中。 多層板的真空壓合分為真空外框（Vacuum Frame），是原液壓機的“抽氣法”，和真空室（Autoclave），是用高壓機的“壓力法”。溫度和高壓二氧化碳。 液壓真空壓力機設備簡單、價格低廉、操作方便，佔據了90%以上的市場。 後者是因為設備和操作很複雜，而且體積很大，加上所需耗材的成本也比較貴，所以採用的並不多。

24.皺紋，皺紋

常指膠水流量過大時的壓力。 11.皺紋產生皺紋，導致其外層的強度和硬度稍弱，如0.5oz銅箔俗稱皺紋。 The term is also used in other areas.