1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Jiko la shinikizo la Autoclave

Laminates ni chombo kilichojaa mvuke wa maji uliojaa joto la juu, na inaweza kutumia shinikizo la juu, Laminates sampuli, kuwekwa ndani yake kwa muda wa muda, kulazimisha maji ndani ya sahani, na kisha huchukua sahani na kuwekwa juu ya uso wa maji. joto la juu bati iliyoyeyuka, kipimo cha sifa zake za “upinzani kwa lamination”. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Mfinyazo huu wa mapema wa MLB kwa kutumia sehemu ndogo ya ngozi nyembamba ya shaba uliitwa Cap LaminaTIon.

3. Caul Plate

Wakati sahani ya multilayer inapobonyezwa, kati ya kila Ufunguzi wa kitanda cha waandishi wa habari (Ufunguzi), mara nyingi huweka “vitabu” vingi ili kushinikizwa nyenzo zisizo huru (kama vile seti 8~10), kati ya kila seti ya “nyenzo huru” (Kitabu) , lazima itenganishwe na sahani ya gorofa laini na ngumu ya chuma cha pua, Aina hii ya kioo cha chuma cha pua Bamba inaitwa Caul Plate au Separate Plate. AISI 430 au AISI 630 hutumiwa kwa kawaida kwa sasa.

4. Crease

Katika kushinikiza laminate, mara nyingi inahusu ngozi ya shaba katika usindikaji wa crease. Ngozi nyembamba ya shaba chini ya oz 0.5 huathirika zaidi na kasoro hii inapobonyeza katika tabaka nyingi.

5. Denti

Inarejelea upole na hata kutulia juu ya uso wa shaba, ambayo inaweza kusababishwa na mbenuko ya madoa ya sahani ya chuma inayotumiwa katika kushinikiza. Ikiwa makali ya sahani huanguka vizuri kwa namna ya kosa, inaitwa Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Lakini wakati resin katika nyenzo wingi wa filamu ni laini na joto na gelatinized, na itakuwa migumu, yaani, kuongezeka kwa shinikizo kamili (300 ~ 500 PSI), ili nyenzo wingi kufikia mchanganyiko wa karibu na malezi ya bodi imara ya tabaka nyingi.

8. Karatasi ya Kraft

Karatasi ya karafu hutumiwa kama bafa ya uhamishaji joto kwa bodi ya safu nyingi au ubao wa substrate. Huwekwa kati ya bati moto (Platen) ya vyombo vya habari na sahani ya chuma ili kukadiria curve ya joto iliyo karibu na nyenzo nyingi. Between multiple substrate or multilayer plates to be pressed. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Kwa sababu ya joto la juu na shinikizo la juu, fiber katika karatasi imevunjwa, haina tena ugumu na vigumu kuchukua jukumu, kwa hiyo ni lazima tujaribu kuchukua nafasi. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Ili kuokoa vifaa vya kupanda na kushiriki, kiwanda cha jumla kitakuwa “kinaingiliana” zaidi na “bodi ya kukunja” zote zimeunganishwa kwenye kitengo cha usindikaji kamili, kwa hivyo uhandisi wake wa otomatiki ni ngumu sana.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Tangu 1986, wakati mahitaji ya laminates nne na sita yameongezeka, njia ya laminating multilaminates imebadilika sana. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Njia ya sahani ya dhana hii mpya inaitwa “platen kubwa” au “platen kubwa”. Katika miaka ya hivi karibuni, kumekuwa na tasnia nyingi za kitaalamu za OEM nchini China.

11. Sahani za Moto za Bamba

Ni jukwaa la kuinua linalohamishika la mashine ya kushinikiza laminate au utengenezaji wa sahani za msingi. mashimo chuma mesa ya aina hii ya massiness, kimsingi ni kutoa shinikizo na chanzo joto kwa ubao, sababu lazima bado wanaweza kudumisha gorofa, sambamba uwezo katika joto la juu kwenda. Kawaida kila sahani ya moto hupachikwa ndani ya bomba la mvuke, neli ya moto au kipengele cha kupokanzwa upinzani, na makali ya nje ya eneo linalozunguka inapaswa pia kujazwa na nyenzo za kuhami joto, ili kupunguza upotevu wa joto, na kuwa na kifaa cha kuhisi joto ili kudhibiti joto. joto.

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). Sahani hii ya chuma ugumu wa hali ya juu ni AISI 630(ugumu hadi 420 VPN) au AISI 440C(600 VPN) aloi ya chuma, uso sio tu ni tambarare ngumu sana, na umeng’aa kwa uangalifu hadi kioo, unaweza kushinikizwa kwenye substrate bapa au bodi ya mzunguko. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Mahitaji ya sahani hii ya chuma ni kali sana, uso wake haupaswi kuonekana scratches yoyote, dents au attachment, unene unapaswa kuwa sare, ugumu unapaswa kutosha, na inaweza kuhimili etching ya kemikali inayozalishwa na shinikizo la juu la joto. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

nguvu ya shinikizo (PSI) kutumika wakati sahani laminated ni kubwa mno, hivyo kwamba resini nyingi ni extruded nje ya sahani, na kusababisha ngozi ya shaba ni moja kwa moja taabu juu ya kitambaa kioo, na hata kitambaa kioo ni bapa na deformed, hivyo. kwamba unene wa sahani haitoshi, utulivu wa ukubwa ni duni, na mstari wa ndani unasisitizwa nje ya sura na kasoro nyingine. Katika hali mbaya, msingi wa waya mara nyingi huwasiliana moja kwa moja na kitambaa cha nyuzi za glasi, na kuzika wasiwasi wa kuvuja “ConducTIve glass fiber”. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Kwa kweli, ni aina tu ya “Draven” kwa plywood laminated, bila maana zaidi.

15. Resin Recession, Resin retreat

Sahani ya sandwich katika B – hatua ya filamu ya resin au bodi ya BoJi (kwa nini) hapo awali, haikuweza kuwa ngumu kabisa baada ya kushinikiza (yaani, ukosefu wa kiwango cha upolimishaji), jaza shimo kwenye safu ya bati, wakati. kwa biopsy, iligundua kuwa ukuta wa shaba wa shimo nyuma ya ukosefu wa resin fulani ya upolimishaji, itaonekana kutoka kwa ukuta wa shaba hadi tupu, “kupungua kwa resin” inamaanisha. Kasoro hii inapaswa kuainishwa kama shida ya jumla ya mchakato au sahani, ambayo ni mbaya zaidi kuliko kasoro za kiufundi za mwanzo wa uso, na sababu inapaswa kuchunguzwa kwa uangalifu.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Wakati sahani ya msingi au sahani ya multilayer inasisitizwa, sahani ngumu ya chuma cha pua (410,420, nk.) inayotumiwa kutenganisha Vitabu katika kila Ufunguzi (Mchana) wa vyombo vya habari. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

It refers to the Interconnection of the layers of a multilayer board that is formed not at the same time but at the same time at the same time in the form of blind or buried holes. This method can save the surface of the board must be drilled out of the full hole. Bodi za ziada zingeweza kupatikana ili kuongeza idadi ya nyaya na SMDS, lakini mchakato wa utengenezaji ulicheleweshwa sana.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Inahusu mtiririko wa resin mbaya, au hali ya kushinikiza na isiyofaa, na kusababisha kukamilika kwa bodi ya multilayer, mwili wa sahani ya ukosefu wa ndani wa gundi.

20. The Swimming line slides away

Kuogelea kunamaanisha harakati ya kuteleza ya safu ya ndani ya bodi ya multilayer wakati wa kukandamiza. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing uchapishaji yaliyo, uchapishaji siri

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. However, when the film used for the outer plate is relatively thin and the copper foil is only 0.5 oz, the circuit pattern of the inner plate may be transferred to the release paper under high pressure. Wakati karatasi ya kubomoa inatumiwa tena kwenye seti ya bodi, kuna uwezekano wa kuelea muundo wa asili kwenye uso wa shaba wa ubao mpya, jambo hili linaitwa Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Neno mara nyingi huonekana katika tasnia ya PCB katika kuunganisha filamu ya laminate na kavu. Ubonyezaji wa ubao wa tabaka nyingi umegawanywa katika Sura ya Utupu ya nje (Fremu ya Utupu), ambayo ni “njia ya kusukuma” na vyombo vya habari vya asili vya hydraulic, na Chumba cha Vuta (Autoclave), ambayo ni “njia ya shinikizo” kwa matumizi ya juu. joto na shinikizo la juu la dioksidi kaboni. Hydralic Vacuum Pressing inachukua zaidi ya 90% ya soko kwa sababu ya vifaa vyake rahisi, bei nafuu na uendeshaji rahisi. Mwisho ni kwa sababu vifaa na uendeshaji ni ngumu sana, na kiasi ni kikubwa sana, pamoja na gharama ya vifaa vinavyohitajika na gharama kubwa zaidi, hivyo kupitishwa sio sana.

24. Kunyata, Kukunjana

Mara nyingi inahusu shinikizo wakati mtiririko wa gundi ni kubwa sana. 11. Mkunjo Husababisha Mkunjo, ambayo husababisha safu yake ya nje kuwa dhaifu kidogo katika nguvu na ugumu, kama karatasi ya shaba ya 0.5oz inayojulikana kama Kukunja. The term is also used in other areas.