1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Kompor tekanan autoklaf

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Kompresi MLB awal iki nggunakake substrat tipis kulit tembaga siji diarani Cap Lamination.

3. Caul Plate

Nalika piring multilayer dipencet, antarane saben Opening saka amben penet (Opening), asring dibandhingke akeh “buku” kanggo dipencet plate materi ngeculke (kayata 8 ~ 10 set), antarane saben pesawat saka “bahan ngeculke” (Buku) , kudu dipisahake kanthi piring baja tahan karat sing rata lan keras, Piring stainless steel iki diarani Caul Plate utawa Piring Pisah. AISI 430 utawa AISI 630 umume digunakake saiki.

4. Krupuk

Ing laminate pressing, asring nuduhake kulit tembaga ing proses crease. Kulit tembaga tipis kurang saka 0.5 oz luwih rentan kanggo cacat iki nalika ditekan ing pirang-pirang lapisan.

5. Degung

Iku nuduhake lemah lembut lan malah subsidence ing lumahing tembaga, kang bisa disebabake protrusion spotty saka piring baja digunakake ing mencet. Yen pinggiran piring tiba kanthi rapi kanthi cara sing salah, diarani Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Nanging nalika resin ing materi film akeh softened dening panas lan gelatinized, lan bakal harden, sing, kanggo nambah kanggo meksa lengkap (300 ~ 500 PSI), supaya materi akeh kanggo entuk kombinasi cedhak lan tatanan saka papan multi-lapisan tenan.

8. Kraft Paper

Kertas kraft digunakake minangka buffer transfer panas kanggo laminating papan multilayer utawa papan substrat. Iki diselehake ing antarane piring panas (Platern) saka pers lan piring baja kanggo moderat kurva pemanasan sing paling cedhak karo bahan akeh. Antarane macem-macem substrat utawa multilayer piring kanggo dipencet. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Amarga suhu dhuwur lan meksa dhuwur, serat ing kertas wis bejat, ora ana maneh kateguhan lan angel kanggo muter peran, supaya kita kudu nyoba kanggo ngganti. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Supaya kanggo nyimpen tanduran lan nuduhake peralatan, pabrik umum bakal luwih “tumpang tindih” lan “papan lempitan” loro digabung menyang unit Processing lengkap, supaya engineering automation sawijining cukup Komplek.

10. Mass LaminaTIon (laminated)

Iki minangka cara konstruksi anyar kanggo ninggalake “tip alignment” lan nggunakake pirang-pirang larik piring ing permukaan sing padha. Wiwit 1986, nalika dikarepake kanggo papat lan enem laminates wis tambah, cara laminating multilaminates wis diganti kathah. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Cara platen saka konsep anyar iki diarani “plate gedhe” utawa “plate gedhe”. Ing taun-taun pungkasan, ana akeh industri penekan OEM profesional ing China.

11. Platen Hot plates

Iki minangka platform angkat sing bisa dipindhah kanggo mesin press laminate utawa manufaktur piring dasar. Mesa logam kothong iki jenis massiness, Sejatine iku kanggo kurban meksa lan sumber panas kanggo plank, alesan isih kudu njaga warata, kemampuan podo karo ing suhu dhuwur kanggo pindhah. Biasane saben piring panas ditempelake ing pipa uap, pipa panas utawa unsur pemanasan resistensi, lan pinggiran njaba lingkungan uga kudu diisi bahan insulasi, kanggo nyuda mundhut panas, lan dilengkapi piranti sensor suhu kanggo ngontrol suhu.

12. Press Plate

Nuduhake landasan utawa Papan multilayer ing mencet, digunakake kanggo misahake saben klompok Book ngeculke (nuduhake tembaga, film lan lapisan utama saka Book, etc.). Plat baja kekerasan dhuwur iki yaiku AISI 630 (kekerasan nganti 420 VPN) utawa baja paduan AISI 440C (600 VPN), lumahing ora mung warata hard banget, lan dipoles kanthi teliti kanggo pangilon, bisa dipencet menyang substrat datar utawa papan sirkuit. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Syarat saka piring baja iki ketat banget, lumahing ngirim ora katon sembarang goresan, dents utawa lampiran, kekandelan kudu seragam, atose kudu cukup, lan bisa tahan etsa kimia diprodhuksi dening suhu dhuwur mencet. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Kekuwatan meksa (PSI) digunakake nalika piring laminated gedhe banget, supaya akeh resins extruded metu saka piring, asil ing kulit tembaga langsung dipencet ing kain kaca, lan malah kain kaca flattened lan deformed, supaya. sing kekandelan piring punika boten cecek, stabilitas ukuran miskin, lan baris utama dipencet metu saka wangun lan cacat liyane. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Nyatane, iku mung wangun “Draven” kanggo plywood laminated, tanpa makna liyane.

15. Resin Recession, Resin retreat

Sandwich piring ing B – tataran film resin utawa Papan BoJi (kok) ing mantan, durung bisa rampung hardened sawise mencet (yaiku, lack of jurusan polimerisasi), isi munggah bolongan ing kolom timah timah, nalika kanggo biopsi, ketemu sing tembok tembaga bolongan konco lack of resin polimerisasi tartamtu, bakal katon saka tembok tembaga bali kanggo kosong, “resin subsidence” tegese. Cacat iki kudu diklasifikasikaké minangka masalah sakabèhé saka proses utawa piring, kang luwih serius saka cacat technical saka ngeruk lumahing, lan sabab kudu kasebut kanthi teliti, diselidiki.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Nalika piring basa utawa piring multilayer dipencet, hard plate stainless steel (410,420, etc.) digunakake kanggo misahake Buku ing saben Opening (Daylight) penet. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Iki nuduhake Interkoneksi lapisan papan multilayer sing dibentuk ora ing wektu sing padha, nanging ing wektu sing padha ing wangun buta utawa bolongan sing dikubur. Cara iki bisa nyimpen lumahing Papan kudu dilatih metu saka bolongan lengkap. Papan tambahan bisa kasedhiya kanggo nambah jumlah kabel lan SMDS, nanging proses manufaktur wis telat banget.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Nuduhake aliran resin ala, utawa kahanan mencet karo ora bener, asil ing completion saka Papan multilayer, awak piring saka lack lokal lim.

20. The Swimming line slides away

Nglangi nuduhake gerakan ngusapake lapisan njero papan multilayer sajrone kompresi. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing floating printing, printing didhelikake

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Nanging, nalika film sing digunakake kanggo piring njaba relatif tipis lan foil tembaga mung 0.5 oz, pola sirkuit saka piring utama bisa ditransfer menyang kertas release ing tekanan dhuwur. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Profil Suhu

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Tembung asring katon ing industri PCB ing laminate lan ikatan film garing. The Vacuum menet papan multilayer dipérang dadi Vacuum njaba Frame (Vacuum Frame), kang “cara pumping” karo asli hydraulic penet, lan kamar Vakum (Autoclave), kang “metode tekanan” karo nggunakake dhuwur. suhu lan tekanan dhuwur karbon dioksida. Hydralic Vacuum Pressing manggoni luwih saka 90% saka pasar amarga saka peralatan prasaja, rega murah lan operasi trep. Sing terakhir amarga peralatan lan operasi banget rumit, lan volume gedhe banget, ditambah biaya pasokan sing dibutuhake lan luwih larang, mula adopsi ora akeh.

24. Kerut, Kerut

Asring nuduhake tekanan nalika aliran lem gedhe banget. 11. Wrinkle Nimbulaké Wrinkle, kang nimbulaké lapisan njaba sawijining rada ora pati roso ing kekuatan lan atose, minangka 0.5oz tembaga foil umum dikenal minangka Wrinkle. The term is also used in other areas.