1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Olla a presión en autoclave

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Esta compresión inicial de MLB usando un só substrato fino de pel de cobre chamouse Cap LaminaTIon.

3. Caul Plate

Cando se preme a placa multicapa, entre cada Abertura da cama de prensa (Apertura), moitas veces apiláronse moitos “libros” para prensar material solto da placa (como 8 ~ 10 xogos), entre cada conxunto de “material solto” (Libro) , debe estar separado por unha placa plana de aceiro inoxidable lisa e dura, Este tipo de placa de espello de aceiro inoxidable chámase placa de Caul ou placa separada. AISI 430 ou AISI 630 úsanse habitualmente na actualidade.

4. Engurra

No prensado laminado, moitas veces refírese á pel de cobre no procesamento do pliegue. A pel fina de cobre de menos de 0.5 oz é máis propensa a este defecto cando se presiona en varias capas.

5. Dent

Refírese ao afundimento suave e uniforme da superficie de cobre, que pode ser causado pola protuberancia irregular da placa de aceiro utilizada no prensado. Se o bordo da placa cae ordenadamente de forma parecida a unha falla, chámase Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Pero cando a resina do material a granel da película se suaviza pola calor e se xelatiniza, e endurecerase, é dicir, para aumentar a presión total (300 ~ 500 PSI), de xeito que o material a granel para lograr unha combinación estreita e a formación dun placa multicapa firme.

8. Kraft Paper

O papel kraft úsase como tampón de transferencia de calor para laminar placas multicapa ou placas de substrato. Colócase entre a placa quente (Platern) da prensa e a placa de aceiro para moderar a curva de quecemento máis próxima ao material a granel. Entre múltiples substratos ou placas multicapa a prensar. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Debido á alta temperatura e á alta presión, a fibra do papel rompeuse, xa non ten dureza e é difícil desempeñar un papel, polo que debemos tentar substituíla. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Para aforrar plantas e compartir equipos, a fábrica xeral será máis “superposición” e “placa plegable” fusionadas nunha unidade de procesamento completa, polo que a súa enxeñería de automatización é bastante complexa.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Desde 1986, cando aumentou a demanda de catro e seis laminados, o método de laminación de multilaminados cambiou moito. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. O método de placa deste novo concepto chámase “plata grande” ou “plata grande”. Nos últimos anos, houbo moitas industrias de prensado OEM profesionais en China.

11. Plato Placas quentes

É unha plataforma elevadora móbil para a fabricación de máquinas de prensado de laminados ou placa base. A mesa de metal oco deste tipo de masa, basicamente é para ofrecer presión e fonte de calor para a táboa, a razón aínda debe manter a capacidade plana e paralela en alta temperatura para ir. Normalmente, cada placa quente está incrustada dentro do tubo de vapor, tubo quente ou elemento de calefacción de resistencia, e o bordo exterior do contorno tamén debe estar cheo de material illante, para reducir a perda de calor, e equipado cun dispositivo sensor de temperatura para controlar a temperatura. temperatura.

12. Press Plate

Refírese ao substrato ou tarxeta multicapa no prensado, usado para separar cada grupo de Libro solto (refírese ao cobre, película e capa interna dun Libro, etc.). Esta placa de aceiro de alta dureza é de aceiro de aliaxe AISI 630 (dureza de ata 420 VPN) ou AISI 440C (600 VPN), a superficie non só é extremadamente dura e plana e coidadosamente pulida para espellar, pódese presionar no substrato plano ou na placa de circuíto. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Os requisitos desta placa de aceiro son moi estritos, a súa superficie non debe aparecer ningún arañazo, abolladura ou anexo, o grosor debe ser uniforme, a dureza debe ser suficiente e pode soportar o gravado químico producido pola presión a alta temperatura. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

A resistencia á presión (PSI) que se usa cando a placa laminada é demasiado grande, polo que moitas resinas son extruídas fóra da placa, o que resulta en que a pel de cobre se preme directamente sobre o pano de vidro, e mesmo o pano de vidro é aplanado e deformado, polo que que o grosor da placa é insuficiente, a estabilidade do tamaño é pobre e a liña interior está presionada fóra de forma e outros defectos. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. De feito, é só unha forma de “Draven” para contrachapado laminado, sen máis significado.

15. Resin Recession, Resin retreat

Placa sándwich na fase B de película de resina ou placa de BoJi (por que) na primeira, aínda non se endurece completamente despois da presión (é dicir, a falta de grao de polimerización), enche o burato na columna de estaño, cando Para unha biopsia, descubriuse que a parede de cobre do burato detrás da falta de certas resinas de polimerización, aparecerá da parede de cobre de volta ao baleiro, significa “afundimento da resina”. Este defecto debe ser clasificado como un problema global do proceso ou da placa, que é máis grave que os defectos técnicos do risco superficial, e a causa debe ser investigada coidadosamente.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Cando se presiona a placa base ou a placa multicapa, a placa de aceiro inoxidable duro (410,420, etc.) usada para separar os Libros en cada apertura (Luz do día) da prensa é. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Refírese á interconexión das capas dunha placa multicapa que se forma non ao mesmo tempo pero ao mesmo tempo en forma de buratos cegos ou enterrados. Este método pode salvar a superficie da tarxeta debe ser perforado fóra do burato completo. Poderíanse poñer a disposición placas adicionais para aumentar o número de cableados e SMDS, pero o proceso de fabricación atrasouse considerablemente.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Refírese ao fluxo de resina malo, ou presionando as condicións inadecuadas, o que resulta na conclusión da tarxeta multicapa, o corpo da placa da falta local de cola.

20. The Swimming line slides away

A natación refírese a un movemento de deslizamento da capa interna dunha táboa multicapa durante a compresión. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Impresión flotante telegráfica, impresión oculta

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Non obstante, cando a película utilizada para a placa exterior é relativamente delgada e a folla de cobre só ten 0.5 oz, o patrón do circuíto da placa interior pódese transferir ao papel de liberación a alta presión. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

A palabra aparece a miúdo na industria de PCB na unión de películas laminadas e secas. O prensado ao baleiro da tarxeta multicapa divídese en Marco exterior de baleiro (Marco de baleiro), que é o “método de bombeo” coa prensa hidráulica orixinal, e a cámara de baleiro (Autoclave), que é o “método de presión” co uso de alta presión. temperatura e dióxido de carbono a alta presión. O prensado hidráulico ao baleiro ocupa máis do 90% do mercado polo seu equipo sinxelo, prezo barato e cómodo funcionamento. Isto último é porque o equipo e o funcionamento son moi complexos, e o volume é moi grande, ademais do custo dos suministros necesarios e máis caro, polo que a adopción non é moita.

24. Engurra, Engurra

Moitas veces refírese á presión cando o fluxo de cola é demasiado grande. 11. Engurras Provoca a engurra, o que fai que a súa capa exterior sexa lixeiramente máis débil en resistencia e dureza, como a folla de cobre de 0.5 oz coñecida comunmente como Engurras. The term is also used in other areas.