1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Autoclave pressure cooker

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Ang maagang MLB compression na ito gamit ang isang solong tansong balat na manipis na substrate ay tinatawag na Cap LaminaTION.

3. Caul Plate

Kapag pinindot ang multilayer plate, sa pagitan ng bawat Bukas ng press bed (Pagbubukas), madalas na nakasalansan ang maraming “mga libro” na pipindutin na plate loose material (tulad ng 8~10 sets), sa pagitan ng bawat set ng “loose material” (Book) , ay dapat na pinaghihiwalay ng flat makinis at matigas na plato na hindi kinakalawang na asero, Ang ganitong uri ng salamin na hindi kinakalawang na asero Plate ay tinatawag na Caul Plate o Separate Plate. Ang AISI 430 o AISI 630 ay karaniwang ginagamit sa kasalukuyan.

4. Lukot

Sa laminate pressing, madalas na tumutukoy sa tansong balat sa pagproseso ng tupi. Ang manipis na tansong balat na mas mababa sa 0.5 oz ay mas madaling kapitan ng depektong ito kapag pinindot sa maraming layer.

5. Kupi

Ito ay tumutukoy sa banayad at pantay na paghupa sa ibabaw ng tanso, na maaaring sanhi ng batik-batik na pag-usli ng steel plate na ginamit sa pagpindot. Kung ang gilid ng plato ay bumagsak nang maayos sa paraang parang fault, ito ay tinatawag na Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Ngunit kapag ang dagta sa film bulk materyal ay pinalambot sa pamamagitan ng init at gelatinized, at tumigas, iyon ay, upang tumaas sa buong presyon (300 ~ 500 PSI), upang ang bulk materyal upang makamit ang malapit na kumbinasyon at ang pagbuo ng isang matatag na multi-layer board.

8. Kraft Paper

Ginagamit ang Kraft paper bilang heat transfer buffer para sa laminating multilayer board o substrate board. Ito ay inilalagay sa pagitan ng hot plate (Platern) ng press at ng steel plate upang i-moderate ang heating curve na pinakamalapit sa bulk material. Sa pagitan ng maramihang substrate o multilayer plate na pipindutin. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Dahil sa mataas na temperatura at mataas na presyon, ang hibla sa papel ay nasira, hindi na matigas at mahirap gampanan, kaya dapat nating subukang palitan. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Upang makatipid ng planta at magbahagi ng kagamitan, ang pangkalahatang pabrika ay magiging mas “magpatong” at “folding board” na parehong pinagsama sa isang komprehensibong yunit ng pagproseso, kaya ang automation engineering nito ay medyo kumplikado.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Mula noong 1986, nang tumaas ang demand para sa apat at anim na laminates, ang paraan ng laminating multilaminates ay nagbago nang malaki. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Ang platen method ng bagong konseptong ito ay tinatawag na “large platen” o “large platen”. Sa nakalipas na mga taon, nagkaroon ng maraming propesyonal na OEM pressing na industriya sa China.

11. Platen Hot plates

Ito ay isang movable lifting platform para sa laminate pressing machine o base plate manufacturing. Ang guwang metal mesa ng ganitong uri ng massiness, karaniwang ito ay upang mag-alok ng presyon at init pinagmulan sa tabla, dahilan ay dapat pa ring mapanatili ang flat, parallel kakayahan sa mataas na temperatura upang pumunta. Karaniwan ang bawat hot plate ay naka-embed sa loob ng steam pipe, hot tubing o resistance heating element, at ang panlabas na gilid ng paligid ay dapat ding punuin ng insulating material, upang mabawasan ang pagkawala ng init, at nilagyan ng temperature sensing device para kontrolin ang temperatura.

12. Press Plate

Tumutukoy sa substrate o multilayer board sa pagpindot, na ginagamit upang paghiwalayin ang bawat grupo ng maluwag na Aklat (tumutukoy sa tanso, pelikula at panloob na layer ng isang Aklat, atbp.). Ang mataas na tigas na steel plate na ito ay AISI 630(hardness hanggang 420 VPN) o AISI 440C(600 VPN) alloy steel, ang ibabaw ay hindi lamang napakatigas na flat, at maingat na pinakintab sa salamin, ay maaaring pinindot sa flat substrate o circuit board . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Ang mga kinakailangan ng steel plate na ito ay napakahigpit, ang ibabaw nito ay hindi dapat lumitaw ng anumang mga gasgas, dents o attachment, kapal ay dapat na pare-pareho, tigas ay dapat sapat, at maaaring mapaglabanan ang kemikal na pag-ukit na ginawa ng mataas na temperatura ng pagpindot. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Ang lakas ng presyon (PSI) na ginagamit kapag ang nakalamina na plato ay masyadong malaki, kaya’t maraming mga resin ang mapapalabas mula sa plato, na nagreresulta sa tansong balat ay direktang pinindot sa telang salamin, at kahit na ang telang salamin ay pipi at deformed, kaya na ang kapal ng plato ay hindi sapat, ang laki ng katatagan ay mahirap, at ang panloob na linya ay pinindot sa labas ng hugis at iba pang mga depekto. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Sa katunayan, ito ay isang anyo lamang ng “Draven” para sa nakalamina na plywood, na walang karagdagang kahulugan.

15. Resin Recession, Resin retreat

Sandwich plate sa B – yugto ng resin film o BoJi board (bakit) sa dating, hindi pa ganap na tumigas pagkatapos ng pagpindot (iyon ay, ang kakulangan ng antas ng polymerization), punan ang butas sa haligi ng lata, kapag para sa isang biopsy, natagpuan na ang tansong pader ng butas sa likod ng kakulangan ng ilang polymerization resin, ay lilitaw mula sa tansong pader pabalik sa walang laman, “resin subsidence” ay nangangahulugang. Ang depektong ito ay dapat na uriin bilang isang pangkalahatang problema ng proseso o ng plato, na mas seryoso kaysa sa mga teknikal na depekto ng scratch surface, at ang dahilan ay dapat na maingat na maimbestigahan.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Kapag pinindot ang base plate o multilayer plate, ang hard stainless steel plate (410,420, atbp.) na ginagamit upang paghiwalayin ang mga Aklat sa bawat Pagbubukas (Daylight) ng press ay. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Ito ay tumutukoy sa Interconnection ng mga layer ng isang multilayer board na nabuo hindi sa parehong oras ngunit sa parehong oras sa parehong oras sa anyo ng mga bulag o buried na mga butas. Ang pamamaraang ito ay maaaring i-save ang ibabaw ng board ay dapat na drilled sa labas ng buong butas. Ang mga karagdagang board ay maaaring magamit upang madagdagan ang bilang ng mga kable at SMDS, ngunit ang proseso ng pagmamanupaktura ay naantala nang malaki.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Ay tumutukoy sa dagta daloy masama, o pagpindot sa mga kondisyon na may hindi wastong, na nagreresulta sa pagkumpleto ng multilayer board, ang plate body ng lokal na kakulangan ng pandikit.

20. The Swimming line slides away

Ang paglangoy ay tumutukoy sa isang sliding na paggalaw ng panloob na layer ng isang multilayer board sa panahon ng compression. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing floating printing, hidden printing

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Gayunpaman, kapag ang film na ginamit para sa panlabas na plato ay medyo manipis at ang tansong foil ay 0.5 oz lamang, ang pattern ng circuit ng panloob na plato ay maaaring ilipat sa release paper sa ilalim ng mataas na presyon. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Ang salita ay madalas na lumilitaw sa industriya ng PCB sa laminate at dry film bonding. Ang Vacuum pressing ng multilayer board ay nahahati sa Vacuum outer Frame (Vacuum Frame), na siyang “pumping method” gamit ang orihinal na hydraulic press, at ang Vacuum chamber (Autoclave), na siyang “pressure method” gamit ang mataas na temperatura at mataas na presyon ng carbon dioxide. Sinasakop ng Hydralic Vacuum Pressing ang higit sa 90% ng merkado dahil sa simpleng kagamitan nito, murang presyo at maginhawang operasyon. Ang huli ay dahil ang kagamitan at operasyon ay napaka-kumplikado, at ang volume ay napakalaki, kasama ang halaga ng mga kinakailangang supply at mas mahal, kaya ang pag-aampon ay hindi gaanong.

24. Kulubot, Kulubot

Kadalasan ay tumutukoy sa presyon kapag ang daloy ng pandikit ay masyadong malaki. 11. Ang Wrinkle ay Nagdudulot ng Wrinkle, na nagiging sanhi ng panlabas na layer nito na bahagyang humina sa lakas at tigas, gaya ng 0.5oz copper foil na karaniwang kilala bilang Wrinkle. The term is also used in other areas.