1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Autoclave siab cooker

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Qhov no thaum ntxov MLB compression siv ib qho tooj liab tawv nyias substrate hu ua Cap LaminaTion.

3. Caul Plate

Thaum lub phaj multilayer raug nias, nruab nrab ntawm txhua qhov Qhib ntawm lub txaj xovxwm (Qhib), feem ntau stacked ntau “phau ntawv” kom nias phaj cov khoom xoob (xws li 8 ~ 10 teeb), nruab nrab ntawm txhua pawg “cov ntaub ntawv xoob” (Phau ntawv) , yuav tsum tau sib cais los ntawm tiaj tus thiab tawv stainless hlau phaj, Hom iav stainless hlau phaj no hu ua Caul Plate lossis Separate Plate. AISI 430 lossis AISI 630 feem ntau siv tam sim no.

4. Ntsig

Nyob rau hauv lub laminate nias, feem ntau yog hais txog cov tawv nqaij tooj liab nyob rau hauv kev ua ntawm lub crease. Nyias daim tawv nqaij tsawg dua 0.5 oz yog qhov ua rau qhov tsis xws luag thaum nias hauv ntau txheej.

5. Dawm

Nws hais txog qhov maj mam thiab txawm tias qhov qis ntawm qhov tooj liab, uas tuaj yeem tshwm sim los ntawm qhov pom ntawm cov hlau phaj siv hauv kev nias. Yog tias ntug ntawm lub phaj ntog zoo zoo li qhov tsis zoo, nws hu ua Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Tab sis thaum cov resin nyob rau hauv zaj duab xis bulk cov ntaub ntawv yog softened los ntawm tshav kub thiab gelatinized, thiab yuav harden, uas yog, nce mus rau tag nrho cov siab (300 ~ 500 PSI), thiaj li hais tias bulk cov ntaub ntawv kom ua tiav kev sib xyaw ua ke thiab tsim ntawm ib tug ntau ntawm cov khoom. ruaj multi-layer board.

8. Kraft Paper

Kraft daim ntawv yog siv los ua cua sov hloov tsis rau laminating multilayer board los yog substrate board. Nws tau muab tso rau nruab nrab ntawm lub phaj kub (Platern) ntawm cov xovxwm thiab cov phaj hlau kom nruab nrab ntawm cov cua sov nkhaus ze tshaj plaws rau cov khoom siv ntau. Nruab nrab ntawm ntau lub substrate los yog multilayer daim hlau yuav tsum nias. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Vim tias qhov kub thiab txias siab, cov fiber ntau hauv daim ntawv tau tawg, tsis muaj zog thiab nyuaj rau kev ua haujlwm, yog li peb yuav tsum sim hloov. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Yuav kom txuag tau cov nroj tsuag thiab sib koom cov cuab yeej, lub tuam txhab dav dav yuav ntau “sib tshooj” thiab “folding board” ob qho tib si sib koom ua ke rau hauv chav ua haujlwm, yog li nws cov automation engineering yog qhov nyuaj heev.

10. Mass LaminaTIon (laminated)

Qhov no yog ib txoj kev tsim kho tshiab ntawm kev tso tseg “cov lus qhia sib dhos” thiab siv ntau kab ntawm daim hlau rau tib qhov chaw. Txij li thaum xyoo 1986, thaum qhov kev thov rau plaub thiab rau laminates tau nce, cov txheej txheem ntawm laminating multilaminates tau hloov ntau heev. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Txoj kev platen ntawm lub tswv yim tshiab no hu ua “loj platen” lossis “loj platen”. Nyob rau hauv xyoo tas los no, muaj ntau tus kws tshaj lij OEM xovxwm kev lag luam hauv Suav teb.

11. Platen Kub daim hlau

Nws yog lub tshuab nqa nqa nqa tau rau laminate pressing tshuab lossis phaj tsim. Lub hollow hlau mesa ntawm no hom ntawm massiness, yeej yog muab siab thiab kub qhov chaw rau plank, yog vim li cas yuav tsum tseem muaj peev xwm tuav ca, parallel muaj peev xwm nyob rau hauv high kub mus. Feem ntau txhua lub phaj kub yog embedded nyob rau hauv lub chav yeeb nkab, kub tubing los yog tiv thaiv cua sov lub caij, thiab lub sab ntug ntawm lub puag ncig yuav tsum tau sau nrog insulating cov ntaub ntawv, kom txo tau cov cua sov, thiab txawm peem rau nrog ib tug kub sensor los tswj lub kub.

12. Press Plate

Hais txog lub substrate los yog multilayer board nyob rau hauv lub nias, siv los cais txhua pab pawg neeg ntawm xoob Phau Ntawv (hais txog tooj liab, zaj duab xis thiab puab txheej ntawm Phau Ntawv, thiab lwm yam). Lub siab tawv steel phaj no yog AISI 630 (hardness mus txog 420 VPN) los yog AISI 440C (600 VPN) hlau alloy, qhov saum npoo tsis tsuas yog nyuaj heev, thiab ua tib zoo polished rau daim iav, tuaj yeem nias rau hauv lub tiaj tus substrate lossis Circuit Court board. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Cov kev cai ntawm cov hlau phaj no yog nruj heev, nws qhov chaw yuav tsum tsis txhob muaj khawb, dents los yog txuas, thickness yuav tsum yog uniform, hardness yuav tsum txaus, thiab muaj peev xwm tiv taus cov tshuaj etching ua los ntawm kub nias. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Lub zog siab (PSI) siv thaum lub phaj laminated loj dhau, yog li ntau cov resins raug extruded tawm ntawm lub phaj, ua rau cov tawv nqaij tooj liab ncaj qha nias rau ntawm daim ntaub iav, thiab txawm tias daim ntaub iav yog flattened thiab deformed, yog li ntawd. tias lub phaj thickness tsis txaus, qhov loj me stability tsis zoo, thiab cov kab sab hauv yog nias tawm ntawm cov duab thiab lwm yam tsis xws luag. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Qhov tseeb, nws tsuas yog ib daim ntawv ntawm “Draven” rau laminated plywood, tsis muaj lub ntsiab lus ntxiv.

15. Resin Recession, Resin retreat

Sandwich phaj nyob rau hauv B – theem ntawm resin zaj duab xis los yog BoJi board (vim li cas) nyob rau hauv lub qub, tseem tsis tau tag nrho hardened tom qab nias (uas yog, tsis muaj degree ntawm polymerization), sau lub qhov nyob rau hauv lub tin kem, thaum rau kev kuaj ntshav, pom tias cov phab ntsa tooj liab ntawm qhov tom qab tsis muaj qee yam polymerization resin, yuav tshwm sim los ntawm phab ntsa tooj liab rov qab mus rau qhov khoob, “resin subsidence” txhais tau tias. Qhov kev tsis zoo no yuav tsum tau muab cais ua ib qho teeb meem tag nrho ntawm cov txheej txheem lossis cov phaj, uas yog qhov hnyav dua li cov txheej txheem ntawm kev khawb ntawm qhov chaw, thiab qhov ua rau yuav tsum tau ua tib zoo tshawb xyuas.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Thaum lub hauv paus phaj lossis multilayer phaj yog nias, lub phaj nyuaj stainless hlau (410,420, thiab lwm yam) siv los cais cov Phau Ntawv hauv txhua qhov Qhib (Hnub Teeb) ntawm cov xovxwm yog. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Nws yog hais txog kev sib tshuam ntawm cov khaubncaws sab nraud povtseg ntawm lub rooj tsavxwm multilayer uas yog tsim tsis nyob rau tib lub sijhawm tab sis tib lub sijhawm nyob rau tib lub sijhawm nyob rau hauv daim ntawv ntawm qhov muag tsis pom lossis faus qhov. Txoj kev no tuaj yeem txuag tau qhov chaw ntawm lub rooj tsavxwm yuav tsum tau drilled ntawm tag nrho lub qhov. Cov laug cam ntxiv tuaj yeem tsim muaj los ua kom muaj cov xov hlau txuas ntxiv thiab SMDS, tab sis cov txheej txheem tsim khoom tau qeeb heev.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Hais txog cov resin ntws tsis zoo, los yog nias tej yam kev mob uas tsis tsim nyog, ua kom tiav ntawm lub multilayer board, lub phaj lub cev ntawm lub zos tsis muaj kua nplaum.

20. The Swimming line slides away

Kev ua luam dej yog hais txog qhov zawv zawg txav ntawm cov txheej sab hauv ntawm lub rooj tsavxwm multilayer thaum compression. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing floating printing, zais luam ntawv

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Txawm li cas los xij, thaum cov yeeb yaj kiab siv rau lub phaj sab nrauv yog qhov nyias nyias thiab cov ntawv ci tooj liab tsuas yog 0.5 oz, cov qauv Circuit Court ntawm cov phaj sab hauv yuav raug xa mus rau cov ntawv tso tawm nyob rau hauv siab. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Kub Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Lo lus feem ntau tshwm sim hauv PCB kev lag luam hauv laminate thiab qhuav zaj duab xis sib txuas. Lub Nqus nias ntawm multilayer board yog muab faib ua Nqus txheej ncej (Nqus ncej), uas yog “txoj kev twj tso kua mis” nrog cov thawj hydraulic xovxwm, thiab lub tshuab nqus tsev chamber (Autoclave), uas yog lub “txoj kev siab” nrog rau kev siv siab. kub thiab kub siab carbon dioxide. Hydralic Vacuum Pressing occupies ntau dua 90% ntawm kev ua lag luam vim nws cov khoom siv yooj yim, pheej yig tus nqi thiab kev ua haujlwm yooj yim. Qhov tom kawg yog vim tias cov cuab yeej siv thiab kev ua haujlwm yog qhov nyuaj heev, thiab qhov ntim loj heev, ntxiv rau cov nqi ntawm cov khoom siv uas yuav tsum tau muaj thiab kim dua, yog li kev saws me nyuam tsis ntau ntau.

24. Nplajteb, Ntxawm

Feem ntau hais txog lub siab thaum cov kua nplaum ntws loj heev. 11. Wrinkle Ua rau Wrinkle, uas ua rau nws cov txheej txheej sab nrauv yuav tsis muaj zog me ntsis hauv lub zog thiab tawv, raws li 0.5oz tooj liab ntawv ci feem ntau hu ua Wrinkle. The term is also used in other areas.