1. It is the first time that we have been able to do this. 2

PCB laminated process

1. ʻO ka mea kuke kīʻaha autoclave

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Ua kapa ʻia kēia hoʻopiʻi MLB mua e hoʻohana ana i kahi substrate ʻili keleawe hoʻokahi i kapa ʻia ʻo Cap LaminaTIon.

3. Caul Plate

Ke paʻi ʻia ka pā multilayer, ma waena o kēlā me kēia Wehe o ka moena paʻi (Wehe), e hoʻopaʻa pinepine i nā “puke” e hoʻopaʻa ʻia i nā mea hoʻokuʻu (e like me 8 ~ 10 sets), ma waena o kēlā me kēia pūʻulu o “mea wehe” (Buke) , pono e hoʻokaʻawale ʻia e ka pāpaʻa paʻa paʻa a me ka paʻakikī paʻakikī, Kapa ʻia kēia ʻano aniani ʻano kila kila ʻole ʻo Caul Plate a i ʻole Separate Plate. Hoʻohana mau ʻia ʻo AISI 430 a i ʻole AISI 630 i kēia manawa.

4. Kuʻi

I ka laminate kaomi, pili pinepine i ka ʻili keleawe i ka hana ʻana o ka crease. ʻOi aku ka maʻalahi o ka ʻili keleawe lahilahi ma lalo o 0.5 oz i kēia hemahema ke kaomi ʻia i nā papa he nui.

5. Dent

E pili ana ia i ka haʻahaʻa a me ka hāʻule ʻana ma luna o ka ʻili keleawe, ʻo ia ke kumu ma muli o ka puka ʻana o ka pā kila i hoʻohana ʻia i ke kaomi ʻana. Inā hāʻule maikaʻi ka lihi o ka pā ma ke ʻano he hewa, ua kapa ʻia ʻo Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. But when the resin in the film bulk material is softened by heat and gelatinized, and will harden, that is, to increase to the full pressure (300 ~ 500 PSI), so that the bulk material to achieve close combination and the formation of a firm multi-layer board.

8. Kraft Paper

Hoʻohana ʻia ka pepa Kraft ma ke ʻano he mea hoʻoneʻe wela no ka laminating multilayer board a i ʻole substrate board. Hoʻonoho ʻia ma waena o ka pā wela (Platern) o ka mīkini paʻi a me ka pā kila e hoʻohaʻahaʻa i ka pā wela kokoke loa i ka mea nui. Ma waena o nā papa he nui a i ʻole nā ​​​​palapala multilayer e kaomi ʻia. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Ma muli o ke kiʻekiʻe o ka wela a me ke kaomi kiʻekiʻe, ua haki ka fiber i loko o ka pepa, ʻaʻohe paʻakikī a paʻakikī ke pāʻani, no laila pono mākou e hoʻāʻo e pani. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. I mea e mālama ai i nā mea kanu a kaʻana like i nā lako, e ʻoi aku ka “overlap” a me ka “folding board” o ka hale hana maʻamau i hui pū ʻia i loko o kahi ʻāpana hana piha, no laila paʻakikī loa kāna ʻenehana automation.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Mai ka makahiki 1986, i ka wā i hoʻonui ai ka noi no nā laminates ʻehā a me ʻeono, ua loli nui ke ʻano o ka laminating multilaminates. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. ʻO ke ʻano platen o kēia manaʻo hou i kapa ʻia ʻo “platen nui” a i ʻole “platen nui”. I nā makahiki i hala iho nei, ua nui nā ʻoihana paʻi OEM ʻoihana ma Kina.

11. Papa Pepa wela

He kahua hoʻokiʻekiʻe hoʻoneʻe ia no ka mīkini paʻi laminate a i ʻole ka hana ʻana o ka pā papa. ʻO ka mesa hollow mesa o kēia ʻano massiness, ʻo ia ka mea e hāʻawi i ke kaomi a me ke kumu wela i ka plank, pono e hiki i ke kumu ke mālama i ka palahalaha, hiki ke kūlike i ka wela kiʻekiʻe e hele. ʻO ka maʻamau, hoʻokomo ʻia kēlā me kēia pā wela i loko o ka paipu mahu, ka paipu wela a i ʻole ka mea hoʻomehana kūpaʻa, a ʻo ka ʻaoʻao o waho a puni e hoʻopiha ʻia me nā mea insulating, e hōʻemi i ka nalowale o ka wela, a hoʻolako ʻia me kahi mea ʻike wela e hoʻomalu i ka. mahana wela.

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). ʻO kēia pā kila paʻakikī kiʻekiʻe ʻo AISI 630 (paʻakikī a hiki i 420 VPN) a i ʻole AISI 440C (600 VPN) ke kila kila, ʻaʻole paʻakikī wale ka ʻili, a hoʻomaʻamaʻa maikaʻi ʻia i ke aniani, hiki ke paʻi ʻia i loko o ka substrate a i ʻole ka papa kaapuni. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. ʻO nā koi o kēia pā kila he koʻikoʻi loa, ʻaʻole ʻike ʻia kona ʻili i nā ʻōpala, nā niho a i ʻole ka hoʻopili ʻana, pono ka mānoanoa, lawa ka paʻakikī, a hiki ke kū i ka etching kemika i hana ʻia e ke kaomi wela kiʻekiʻe. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

ʻO ka ikaika kaomi (PSI) i hoʻohana ʻia i ka nui o ka pā laminated, no laila e hoʻokuʻu ʻia nā resins he nui mai ka pā, e hoʻopiʻi pololei ʻia ka ʻili keleawe ma ka lole aniani, a ʻo ka lole aniani hoʻi i palahalaha a deformed, no laila ʻaʻole lawa ka mānoanoa o ka pā, maikaʻi ʻole ka nui o ka paʻa, a paʻi ʻia ka laina o loko mai ke ʻano a me nā hemahema ʻē aʻe. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. ʻO ka ʻoiaʻiʻo, he ʻano ia o “Draven” no ka lāʻau laminated plywood, ʻaʻohe manaʻo hou aʻe.

15. Resin Recession, Resin retreat

ʻO ka pā Sandwich i ka B – ke kahua o ka resin film a i ʻole ka papa BoJi (no ke aha) i ka mua, ʻaʻole hiki ke paʻakikī loa ma hope o ke kaomi ʻana (ʻo ia hoʻi, ka nele o ka polymerization), e hoʻopiha i ka lua ma ke kolamu tin tin, ke no ka biopsy, ua ike ia ka paia keleawe o ka lua ma hope o ka nele o kekahi polymerization resin, e ikeia mai ke keleawe paia hoʻi a nele, “resin subsidence” ‘o ia hoʻi. Pono e helu ʻia kēia hemahema ma ke ʻano he pilikia holoʻokoʻa o ke kaʻina hana a i ʻole ka pā, ʻoi aku ka koʻikoʻi ma mua o nā hemahema ʻenehana o ka ʻili ʻili, a pono e noiʻi pono ʻia ke kumu.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Ke paʻi ʻia ka pā kumu a i ʻole ka pā multilayer, ʻo ka pā kila kuhili ʻole paʻa (410,420, a me nā mea ʻē aʻe) i hoʻohana ʻia e hoʻokaʻawale i nā Buke i kēlā me kēia wehe ʻana (Daylight) o ka paʻi. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

It refers to the Interconnection of the layers of a multilayer board that is formed not at the same time but at the same time at the same time in the form of blind or buried holes. This method can save the surface of the board must be drilled out of the full hole. Hiki ke hoʻolako ʻia nā papa ʻē aʻe e hoʻonui i ka helu o nā uwila a me SMDS, akā ua lohi nui ke kaʻina hana.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. E pili ana i ka resin kahe ino, a i ole kaomi ‘ana me ka pono ole, ka hopena i ka pau ana o ka papa multilayer, ka papa kino o ka kūloko nele o ke kāpili.

20. The Swimming line slides away

ʻO ka ʻauʻau ʻana e pili ana i ka neʻe ʻana o ka papa i loko o kahi papa multilayer i ka wā o ka hoʻoemi ʻana. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing lana paʻi, huna paʻi

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Eia nō naʻe, ke ʻano lahilahi ke kiʻiʻoniʻoni i hoʻohana ʻia no ka pā o waho a ʻo ka pahu keleawe he 0.5 oz wale nō, hiki ke hoʻololi ʻia ke ʻano kaapuni o ka pā i loko i ka pepa hoʻokuʻu ma lalo o ke kaomi kiʻekiʻe. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

The word often appears in the PCB industry in the laminate and dry film bonding. Hoʻokaʻawale ʻia ka pahu kaomi ʻana o ka papa multilayer i Vacuum outer Frame (Vacuum Frame), ʻo ia ke ʻano “pumping method” me ka mīkini hydraulic kumu, a me ke keʻena Vacuum (Autoclave), ʻo ia ka “pressure method” me ka hoʻohana ʻana i ke kiʻekiʻe. ka mahana a me ke kaomi kiʻekiʻe carbon dioxide. ʻO ka Hydralic Vacuum Pressing e noho ana ma mua o 90% o ka mākeke ma muli o kāna mau mea maʻalahi, kumukūʻai maʻalahi a me ka hana maʻalahi. ʻO ka mea hope no ka mea paʻakikī loa nā mea hana a me ka hana, a nui loa ka leo, me ke kumukūʻai o nā lako i koi ʻia a ʻoi aku ka nui o ke kumukūʻai, no laila ʻaʻole nui ka lawe ʻana.

24. Wrinkle, Wrinkle

ʻO ka manawa pinepine e pili ana i ke kaomi i ka nui o ke kahe o ke kāpili. 11. ʻO ka Wrinkle ke kumu i ka Wrinkle, kahi e hoʻonāwaliwali iki ai kona papa o waho i ka ikaika a me ka paʻakikī, e like me ka 0.5oz copper foil i kapa ʻia ʻo Wrinkle. The term is also used in other areas.