1. Ndekekutanga kuti takakwanisa kuita izvi. 2

PCB laminated process

1. Autoclave pressure cooker

Laminates igaba rakazadzwa nekupisa kwakanyanya kwakazara mhute yemvura, uye inogona kuisa yakakwira kudzvanywa, Laminates sampuli, inoiswa mairi kwenguva yakati rebei, inomanikidza mvura mundiro, yobva yatora ndiro ichiisa pamusoro pemvura. tembiricha yakanyungudutswa yakakwira, kuyerwa kwe “resistance to lamination” maitiro. Iri izwi rine chimwe chinoreva Pressure Cooker uye rinowanzo shandiswa muindasitiri. Pamusoro pezvo, pane imwe mhando ye “cabin pressure method” inoitwa nekupisa kwakanyanya uye yakanyanya kudzvanywa kabhoni dhaidhiyoni mukuita lamination process, inovawo yerudzi urwu rwe Autoclave Press.

2. Cap Lamination

Iyo “yekunze dhizaini” yeMLB yakashongedzwa uye yakatsikirirwa pane yakaonda imwe-sided yemhangura-yeganda substrates. Yakanga isiri kusvika pakupera kwa1984, apo kugadzirwa kweMLB kwakawedzera zvakanyanya, iyo yazvino yemhangura-yeganda yakakura kana yakawanda lamination nzira (Mss Lam) yakagamuchirwa. Iyi yekutanga MLB compression uchishandisa imwechete yemhangura ganda rakatetepa substrate yainzi Cap LaminaTIon.

3. Caul Plate

Kana iyo multilayer plate ikatsikirirwa, pakati peKuvhura kwega kwega kwemubhedha wekutsikirira (Kuvhura), kazhinji kurongedza “mabhuku” mazhinji kuti atsindirwe ndiro yakasununguka zvinhu (seti 8~10 seti), pakati peseti yega yega “yakasununguka zvinhu” (Bhuku) , inofanira kupatsanurwa neplate yakatsetseka uye yakaoma Stainless simbi, Iri rudzi rwegirazi resimbi isina tsvina ndiro inonzi Caul Plate kana Separate Plate. AISI 430 kana AISI 630 inowanzoshandiswa pari zvino.

4. Crease

Mukutsikirira laminate, kazhinji inoreva ganda remhangura mukugadziriswa kwecrease. Ganda rakatetepa remhangura risingasviki 0.5 oz rinowanzoita chikanganiso ichi kana yakadzvanywa mumatanho akawanda.

5. Dent

Inoreva kunyorova uye kunyange kuderera pamusoro pemhangura, iyo inogona kukonzerwa nekuputika kwemavara kweplate yesimbi inoshandiswa mukutsikirira. Kana mupendero weplate ukawira zvakanaka nenzira yakashata-yakafanana, inonzi Dish Down. Izvi zvinokanganisa, kana zvinosuruvarisa zvakasiiwa pamutsara mushure memhangura etching, zvinokonzeresa kusagadzikana kweiyo high-speed transmission signal, uye Noise Noise. Nokudaro, nzvimbo yemhangura ye substrate inofanira kudziviswa sezvinobvira.

6. Foil LaminaTIon

Inoreva Misa kugadzira multilayer board, iyo yekunze dhizaini yakatsikirirwa nemhangura foil uye firimu zvakananga uye yemukati layer inonzi Mass Lam ye multilayer board, ichitsiva iyo yechinyakare nzira yeimwe nhete substrate mukutanga nhanho.

7. Kusveta Kumanikidza

Kana iyo multilayer board ichidzvanywa, kana mahwendefa ari muKuvhura kwega kwega akaiswa uye akaiswa, anotanga kupisa uye kusimudza kubva pasi inopisa ndiro ine simba re hydraulic top column (Ram) kudzvanya zvinhu zvakasununguka muKuvhura kwega kwega kwekubatanidza. . Panguva ino yakabatanidzwa nefirimu (Prepreg) yakatanga kupfava zvishoma nezvishoma uye kunyange kuyerera, saka kumanikidza kunoshandiswa kwepamusoro extrusion hakugone kuve kwakakura, kudzivirira ndiro inotsvedza kana guruu kuyerera zvakanyanya. Iyi yekutanga yakaderera kudzvinyirira (15 kusvika 50 PSI) inonzi “kutsvoda kumanikidza”. Asi kana resin iri mufirimu yakawanda zvinhu yakanyoroveswa nekupisa uye gelatinized, uye ichaomesa, ndiko kuti, kuwedzera kusvika kuzere kumanikidzwa (300 ~ 500 PSI), kuitira kuti zvinhu zvakawanda zvibudirire kusanganiswa kwepedyo uye kuumbwa kwe yakasimba multi-layer board.

8. Kraft Pepa

Kraft bepa rinoshandiswa seyekupisa kupisa buffer ye laminating multilayer board kana substrate board. Inoiswa pakati pendiro inopisa (Platern) yemuchina uye ndiro yesimbi kuti ienzanise curve yekudziya iri padyo neakawanda zvinhu. Pakati peakawanda substrate kana multilayer mahwendefa anotsikirirwa. Sezvinokwanisika kuvhara mutsauko wekushisa pakati pezvikamu zvakasiyana-siyana zveplate, izvo zvinowanzo shandiswa zvinotsanangurwa ndeye 90 kusvika ku150 mapaundi. Nekuda kwekushisa kwakanyanya uye kudzvanywa kwepamusoro, iyo fiber mupepa yakatyoka, haisisina kuomarara uye kuoma kuita basa, saka tinofanira kuedza kutsiva. Iri kraft bepa musanganiswa wepaini uye dzakasiyana-siyana dzakasimba alkali yakabikwa, mushure mekupunyuka kupukunyuka uye kubviswa kweasidhi, ndokuzoshambidzwa nekunaya kwemvura; Kana yave pulp, inogona kudzvanywa zvakare kuti ive bepa rakaoma uye rakachipa.

9. Zviise

Isati yatsikirirwa laminate kana substrate, inofanirwa kurongeka, kudonha, kana kuseta iyo yemukati layer, firimu, mhangura uye zvimwe zvinhu zvakawanda zvine mahwendefa esimbi, kraft bepa padding zvinhu, nezvimwewo, kuitira kuti inyatso kudyiswa mukati muchina wekudzvanya wekudzvanya. Kugadzirira kwerudzi urwu kunonzi kuradzika. Kuti uvandudze kunaka kwebhodhi re multilayer, kwete chete iyi “yakatarisana” basa rinofanira kuitwa mukupisa uye kunyorova kwekamuri isina guruva, asiwo kuitira Misa kugadzirwa nekukurumidza uye kunaka, kazhinji zvinotevera zvisere. inogamuchirwa hombe yekumanikidza ndiro nzira (Mass Lam) kuvaka, uye inotoda kushandisa iyo “otomatiki” inopindirana nzira, kudzikisa kukanganisa kwevanhu uye kurasikirwa. Kuti uchengetedze chirimwa uye midziyo yekugovana, fekitori yakajairika ichave yakawanda “yakatarisana” uye “kupeta bhodhi” zvese zvakabatanidzwa kuita yakazara kugadzirisa unit, saka otomatiki engineering yayo yakaoma.

10. Misa LaminTIon (laminated)

Iyi inzira nyowani yekuvaka yekusiya “alignment tip” uye kutora mitsara yakawanda yemahwendefa panzvimbo imwechete. Kubva 1986, apo kudiwa kwechina uye matanhatu laminates kwakawedzera, nzira ye laminating multilaminates yakachinja zvikuru. Muchikamu chekutanga, ndiro imwe chete yekutakura ndiyo yakarongwa pandiro yekugadzira kuti itsike. Uhwu hurongwa hwehumwe-kune-humwe hwakatyorwa mumutemo mutsva, unogona kushandurwa kuita maviri maviri, kana peya yechina, kana kunyange mitsetse yakawanda yemahwendefa anotsikirirwa pamwechete maererano nehukuru hwayo. Yechipiri ndeyekukanzura marudzi ese ezvinhu zvakasununguka (zvakadai seshizha remukati, firimu, rekunze rimwe shiti, nezvimwewo) zvetipi yekurongeka; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. Kana ari matanhatu kana masere akaturikidzana emapuranga, iyo firimu yemukati yega yega uye sandwich inogona kukwizwa uye yobva yadzvanywa pakupisa kwakanyanya. Inogonawo kuwedzera nhamba ye “Pamusoro” uye Kuvhura maererano neiyo base plate nzira. Iyo haigone chete kuderedza basa uye kaviri kuburitsa, asi zvakare kuita otomatiki. Nzira yeplaten yeiyi pfungwa itsva inonzi “large platen” kana “large platen”. Mumakore achangopfuura, kwave neakawanda nyanzvi OEM anotsikirira maindasitiri muChina.

11. Platen Hot plates

Icho chikuva chinosimudza chinosimudza che laminate yekutsikirira muchina kana base plate kugadzira. Iyo hollow simbi mesa yerudzi urwu rwehukuru, kunyanya ndeye kupa kumanikidza uye kupisa sosi kune puranga, chikonzero chinofanirwa kuramba chichigona kuchengetedza rakati sandara, rakafanana kugona mukupisa kwepamusoro kuenda. Kazhinji ndiro yega yega inopisa inoiswa mukati mepombi yehutsi, kupisa tubing kana kuramba kupisa chinhu, uye kunze kwekunze kwenzvimbo yakapoteredzwa kunofanirwawo kuzadzwa nezvinhu zvinodzivirira kupisa, kuderedza kurasikirwa kwekupisa, uye kushongedzerwa nemudziyo wekunzwa tembiricha kudzora. tembiricha.

12. Press Plate

Refers to the substrate or multilayer board in the pressing, used to separate each group of loose Book (refers to copper, film and inner layer of a Book, etc.). Iyi yakakwira kuomarara simbi ndiro AISI 630 (kuoma kusvika 420 VPN) kana AISI 440C (600 VPN) alloy simbi, iyo pamusoro haisi kungoomesesa zvakanyanya, uye yakanyatsokwenenzverwa kugirazi, inogona kudzvanywa mukati meiyo flat substrate kana redunhu board. . Naizvozvo, inonziwo Mirror Plate, inozivikanwawo seCarrier Plate. Zvinodiwa zvendiro yesimbi iyi zvakanyanya kuomarara, pamusoro payo haifanire kuoneka chero zvikwambo, mazino kana kusungirirwa, ukobvu hunofanirwa kunge hwakafanana, hurema hunofanirwa kukwana, uye hunogona kumirisana nemakemikari etching anogadzirwa nekutsikirira kwakanyanya. Mutengo werudzi urwu rwendiro yesimbi inodhura zvakanyanya nekuti inokwanisa kushingirira mabhurashi emagetsi akasimba mushure mekudzvanywa kwega kwega.

13. Dhinda kuburikidza

Simba rekumanikidza (PSI) rinoshandiswa kana ndiro yakasvibiswa yakakurisa, kuitira kuti resin dzakawanda dzinobudiswa kunze kwendiro, zvichiita kuti ganda remhangura rinotsikirirwa zvakananga pamucheka wegirazi, uye kunyange jira regirazi rinoputika uye rakaremara, saka. kuti kukora kweplate hakuna kukwana, ukuru kugadzikana kwakashata, uye mutsara wemukati unotsikirirwa kunze kwechimiro uye kumwe kukanganisa. Muzviitiko zvakakomba, hwaro hwewaya hunowanzo sangana zvakananga nejira regirazi, kuviga “ConducTIve girazi fiber” kunetseka kwekudonha. CAF). Iyo yakakosha mhinduro inoenderana nemusimboti weScaled Flow, nzvimbo hombe kudzvanya kunofanirwa kushandisa hombe yekumanikidza, diki ndiro pamusoro shandisa diki kudzvanywa simba; Kudzvanywa uye Simba rekushanda kwemunda kunoverengerwa uchishandisa 1.16PSI/in2 kana 1.16Lb/in4 sehwaro hwekutanga.

14. Relamination (RE-LAM) laminated ndiro

Iyo yemukati yakaonda substrate, inogadzirwa ne substrate vatengesi vachishandisa firimu nemhangura yakatsikirirwa pamwe chete, fekitori yedunhu bhodhi yakatenga yakatetepa substrate yakagadzirwa nemukati wedunhu bhodhi, asiwo nefirimu kudzvanya synthetic multilayer board, dzimwe nguva dzinowanzo simbisa uye dzinonzi ” vakamanikidzwa pamwe chete”, inonzi re-LAM. Muchokwadi, ingori chimiro che “Draven” yelaminated plywood, isina imwe chirevo.

15. Resin Recession, Resin retreat

Sandwich ndiro muB – nhanho ye resin firimu kana BoJi bhodhi (nei) mune yekare, haisati yanyatso kuomeswa mushure mekudzvanya (kureva, kushomeka kwedhigirii repolymerization), zadza gomba pakona yerata, apo yebiopsy, yakaona kuti madziro emhangura egomba kuseri kwekushaikwa kweimwe polymerization resin, ichaonekwa kubva kumadziro emhangura ichidzokera kune isina chinhu, “resin subsidence” zvinoreva. Ichi chikanganiso chinofanirwa kuverengerwa sedambudziko rakazara rekuita kana ndiro, iro rakanyanya kukomba kupfuura hurema hwehunyanzvi hwekukwenya kwepamusoro, uye chikonzero chinofanira kunyatsoongororwa.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.Iyo zvakare inzira yekuyedza yeResin Flow pasi pekushisa kwakanyanya uye kudzvanywa kwakanyanya. Ona chikamu 2.3.18 cheIPC-TM-650 kuti uwane ruzivo rwakadzama, uye ona PCB Information Journal, Nha.

17. Separator Plate, mirror Plate

Kana iyo base plate kana multilayer plate yakatsikirirwa, iyo yakaoma Stainless simbi ndiro (410,420, nezvimwewo) inoshandiswa kupatsanura Mabhuku muKuvhura kwega kwega (Daylight) yemuchina. Kuti udzivise kunamatira, iyo nzvimbo inobatwa zvakanyanya kuti ive yakati sandara uye yakajeka, saka inonziwo Mirror Plate.

18. Sequential Lamination

Inoreva Kubatana kwezvikamu zvebhodhi re multilayer iro rinoumbwa kwete panguva imwe chete asi panguva imwe chete panguva imwechete mumhando yemapofu kana makomba akavigwa. Iyi nzira inogona kuchengetedza pamusoro pebhodhi inofanira kubudiswa kunze kwegomba rakazara. Mabhodhi ekuwedzera anogona kuwanikwa kuti awedzere nhamba yewaya uye SMDS, asi maitiro ekugadzira akanonoka zvakanyanya.

19. Nama yenzara

Izwi iri muindasitiri yebhodhi redunhu, rave richiwanzo shandiswa mu multilayer board bonding “kushomeka kwenamo” Nzara dambudziko rekutaura. Inoreva resin inoyerera yakaipa, kana kudzvanya mamiriro asina kunaka, zvichikonzera kupedzwa kweiyo multilayer board, iyo ndiro yemuviri yekushaikwa kwenzvimbo yeglue.

20. Mutsetse wekushambira unotsvedza

Kutuhwina kunoreva kufamba kutsvedza kwemukati meiyo multilayer board panguva yekumanikidza. Izvi zvakanyatsoenderana nehurefu hwe “Gel Time” yefirimu yakashandiswa. Parizvino, indasitiri yave ichida kushandisa ipfupi Gel Nguva, saka dambudziko rakaderedzwa zvakanyanya.

21. Telegraphing inoyangarara kudhinda, yakavanzika kudhinda

Kuti udzivise dambudziko reglue richipfachukira, firimu rinodzivirira kupisa (senge Tedlar) rinowedzerwa kune yemhangura foil kana nhete yepasi ndiro yezvakapararira zvakarongedzerwa, kuitira kufambisa kushandiswa kwekubvisa kana kukanganisa mushure. kudzvanya. Zvisinei, apo firimu rinoshandiswa kweplate rekunze rakanyanya kutetepa uye foil yemhangura inongova 0.5 oz, chimiro chedunhu chemukati weplate chinogona kuendeswa kune pepa rekubudiswa pasi pekumanikidzwa kukuru. Kana bepa rekudhirowa richishandiswazve pane seti yemabhodhi, rinogona kuyangarara patani yepakutanga pamusoro pemhangura yebhodhi idzva, chiitiko ichi chinodaidzwa kuti Telegraphing.

22. Kupisa Profile

Muindasitiri yedunhu redhisheni mukutsikirira, kana kudzika dhizaini ye infrared kana inopisa air welding (Reflow) process, vese vanofanirwa kutsvaga tembiricha (vertical axis) uye nguva (horizontal axis) inofananidzira kuumbwa kweakanakisa “temperature curve”, kuitira kuvandudza solder quality muhuwandu hwekugadzirwa kwehuwandu.

23. Vacuum Lamination

Izwi rinowanzo kuoneka muPCB indasitiri mune laminate uye yakaoma firimu bonding. Iyo Vacuum yekutsikirira ye multilayer board yakakamurwa kuita Vacuum yekunze Frame (Vacuum Frame), inova “pomba nzira” ine yekutanga hydraulic press, uye Vacuum chamber (Autoclave), inova “pressure nzira” nekushandiswa kwepamusoro. tembiricha uye high pressure carbon dioxide. Hydralic Vacuum Pressing inotora zvinopfuura makumi mapfumbamwe muzana emusika nekuda kwemidziyo yayo yakapusa, mutengo wakachipa uye kushanda kuri nyore. Iyo yekupedzisira imhaka yekuti midziyo uye kushanda kwakaoma kwazvo, uye vhoriyamu yakakura kwazvo, pamwe nemari yezvinhu zvinodiwa uye inodhura zvakanyanya, saka kugamuchirwa hakuna zvakawanda.

24. Kuunyana, Kuunyana

Kazhinji inoreva kumanikidzwa kana kuyerera kweglue kwakanyanya. . Izwi rinoshandiswawo mune dzimwe nzvimbo.