1. It is the first time that we have been able to do this. 2

Pkb laminated process

1. otoklav pwesyon cuisinier

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Sa a konpresyon bonè MLB lè l sèvi avèk yon sèl po kòb kwiv mete substra mens te rele Cap LaminaTIon.

3. Caul Plate

Lè plak la plizyè kouch bourade, ant chak Ouvèti nan kabann lan pou laprès (Ouvèti), souvan anpile anpil “liv” yo dwe bourade plak materyèl ki lach (tankou 8 ~ 10 ansanm), ant chak seri “materyèl ki lach” (Liv) , dwe separe pa plat lis ak difisil plak asye pur, Sa a kalite glas Nerjaveèi asye Plak yo rele Plak Caul oswa Plak Separe. AISI 430 oswa AISI 630 yo souvan itilize kounye a.

4. Pli

Nan Plastifye peze a, souvan refere a po a kòb kwiv mete nan pwosesis la nan pli a. Po kòb kwiv mete mens mwens pase 0.5 oz gen plis tandans fè defo sa a lè yo peze nan plizyè kouch.

5. Dent

Li refere a dou ak menm sibvansyon sou sifas kwiv la, ki ka koze pa pwotrusion nan tach nan plak la asye yo itilize nan peze la. Si kwen plak la tonbe nètman nan yon fason ki sanble ak fay, yo rele sa Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Men, lè résine a nan materyèl la esansyèl fim adousi pa chalè ak jelatinize, epi li pral di, se sa ki, ogmante presyon an plen (300 ~ 500 PSI), se konsa ke materyèl la esansyèl reyalize konbinezon fèmen ak fòmasyon nan yon fèm tablo milti-kouch.

8. Kraft Paper

Papye kraft yo itilize kòm tanpon transfè chalè pou laminating tablo multikouch oswa tablo substra. Li mete ant plak cho a (Platern) nan laprès la ak plak asye a modere koub chofaj ki pi pre materyèl la esansyèl. Ant miltip substra oswa plak multikouch yo dwe bourade. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Paske nan tanperati ki wo ak presyon ki wo, fib la nan papye a te kase, pa gen okenn ankò severite ak difisil yo jwe yon wòl, kidonk nou dwe eseye ranplase. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Yo nan lòd pou konsève pou plant ak pataje ekipman, faktori jeneral la pral plis “sipèpoze” ak “pliye tablo” tou de fizyone nan yon inite pwosesis konplè, kidonk jeni automatisation li yo se byen konplèks.

10. Mass LaminaTIon (laminated)

Sa a se yon nouvo metòd konstriksyon abandone “pwent aliyman” ak adopte plizyè ranje plak sou menm sifas la. Depi 1986, lè demann lan pou kat ak sis laminates te ogmante, metòd laminasyon multilaminates te chanje anpil. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Metòd platin nouvo konsèp sa a rele “gwo platin” oswa “gwo platin”. Nan dènye ane yo, te gen anpil pwofesyonèl OEM endistri peze nan Lachin.

11. Platen Plak cho

Li se yon platfòm leve mobil pou Plastifye peze machin oswa manifakti plak baz. Mesa an metal kre sa a jan de massiness, fondamantalman se pou l ofri pwesyon ak sous chalè pou planch, rezon dwe toujou kapab kenbe plat, paralèl abilite nan tanperati anwo nan syèl la pou ale. Anjeneral chak plak cho entegre andedan tiyo vapè, tib cho oswa eleman chofaj rezistans, ak kwen ekstèn nan vwazinaj la ta dwe tou ranpli ak materyèl posibilite, diminye pèt chalè a, epi ekipe ak yon aparèy deteksyon tanperati pou kontwole a. tanperati.

12. Press Plate

Refere a substra a oswa tablo multikouch nan peze a, yo itilize separe chak gwoup Liv ki lach (refere a kwiv, fim ak kouch enteryè nan yon Liv, elatriye). Plak asye dite segondè sa a se AISI 630 (dite jiska 420 VPN) oswa AISI 440C (600 VPN) alyaj asye, sifas la se pa sèlman trè difisil plat, ak ak anpil atansyon poli nan glas, yo ka bourade nan substra a plat oswa tablo sikwi. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Kondisyon yo nan plak asye sa a yo trè strik, sifas li yo pa ta dwe parèt okenn reyur, dents oswa atachman, epesè yo ta dwe inifòm, dite yo ta dwe ase, epi yo ka kenbe tèt ak grave chimik ki te pwodwi pa peze tanperati ki wo. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Fòs presyon (PSI) yo itilize lè plak laminated la twò gwo, se konsa ke anpil rezin yo ekstrè soti nan plak la, sa ki lakòz po a kòb kwiv mete dirèkteman bourade sou twal la vè, e menm twal la vè aplati ak defòme, kidonk ke epesè plak la se ensifizan, estabilite nan gwosè se pòv, ak liy enteryè a bourade soti nan fòm ak lòt domaj. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. An reyalite, li se jis yon fòm “Draven” pou plywood laminated, ki pa gen okenn lòt siyifikasyon.

15. Resin Recession, Resin retreat

Plak sandwich nan B – etap nan fim résine oswa BoJi tablo (poukisa) nan ansyen an, pa t ‘kapab ankò konplètman fè tèt di apre peze (ki se, mank nan degre nan polymérisation), ranpli twou a sou kolòn nan fèblan fèblan, lè pou yon byopsi, yo te jwenn ke miray la kòb kwiv mete nan twou dèyè mank de résine polymérisation sèten, ap parèt soti nan miray kòb kwiv mete tounen nan vid, “rezin sibsidance” vle di. Defo sa a ta dwe klase kòm yon pwoblèm jeneral nan pwosesis la oswa plak la, ki se pi grav pase domaj yo teknik nan grate sifas la, ak kòz la ta dwe ak anpil atansyon envestige.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Lè plak la baz oswa plak multikouch bourade, plak la difisil asye pur (410,420, elatriye) itilize separe Liv yo nan chak Ouvèti (Daylight) nan laprès la se. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Li refere a Interconnexion nan kouch yo nan yon tablo multikouch ki fòme pa an menm tan an men an menm tan an menm tan an nan fòm lan nan twou avèg oswa antere l ‘. Metòd sa a ka sove sifas la nan tablo a dwe komanse fouye soti nan twou a plen. Tablo adisyonèl yo ta ka disponib pou ogmante kantite fil elektrik ak SMDS, men pwosesis fabrikasyon an te retade anpil.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Refere a koule nan résine move, oswa kondisyon peze ak move, sa ki lakòz fini an nan tablo a multi, kò a plak nan mank lokal la nan lakòl.

20. The Swimming line slides away

Naje refere a yon mouvman glisman nan kouch enteryè a nan yon tablo multikouch pandan konpresyon. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing k ap flote enprime, enprime kache

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Sepandan, lè fim nan itilize pou plak ekstèn lan se relativman mens ak papye kwiv la se sèlman 0.5 oz, modèl la sikwi nan plak enteryè a ka transfere nan papye a lage anba presyon ki wo. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Tanperati Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Mo a souvan parèt nan endistri PCB nan Plastifye ak lyezon fim sèk. Se Vacuum peze nan tablo multikouch divize an vakyòm ekstèn ankadreman (vakyòm ankadreman), ki se “metòd ponpe” ak laprès idwolik orijinal la, ak chanm vakyòm (otoklav), ki se “metòd presyon” ak itilizasyon segondè. tanperati ak presyon ki wo gaz kabonik. Vacuum Pressing idwolik okipe plis pase 90% nan mache a paske nan ekipman senp li yo, pri bon mache ak operasyon pratik. Lèt la se paske ekipman an ak operasyon yo trè konplèks, ak volim nan se gwo anpil, plis pri a nan founiti yo mande yo ak pi chè, kidonk adopsyon an se pa anpil.

24. rid, rid

Souvan refere a presyon an lè koule nan lakòl twò gwo. 11. Rid la lakòz rid la, ki lakòz kouch ekstèn li yo yon ti kras pi fèb nan fòs ak dite, kòm 0.5oz papye kwiv la souvan ke yo rekonèt kòm rid. The term is also used in other areas.