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PCB laminated process

1. Autoclave Drockkoker

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Dës fréi MLB Kompressioun mat engem eenzegen Kupfer Haut dënnem Substrat gouf Cap LaminaTIon genannt.

3. Caul Plate

Wann de Multilayer Plack gedréckt ass, tëscht all Ouverture vum Pressbett (Ouverture), dacks vill “Bicher” gestapelt fir gedréckt Plack loose Material (wéi 8 ~ 10 Sätz), tëscht all Set vu “loose Material” (Buch) , muss duerch flaach glat an hart STAINLESS Stol Plack getrennt ginn, Dës Aart vu Spigel Edelstol Plack gëtt Caul Plack oder Separat Plack genannt. AISI 430 oder AISI 630 ginn am Moment allgemeng benotzt.

4. Knascht

Am Laminatpressen, bezitt sech dacks op d’Kupferhaut an der Veraarbechtung vun der Fal. Dënn Kupferhaut manner wéi 0.5 Oz ass méi ufälleg fir dësen Defekt wann se a verschidde Schichten gedréckt gëtt.

5. Dent

Et bezitt sech op déi sanft a souguer Ënnergang op der Kupferoberfläche, déi duerch de Fleckprotrusioun vun der Stahlplack verursaacht gëtt, déi an der Press benotzt gëtt. Wann de Rand vun der Plack ordentlech op eng Feelerähnlech Manéier fällt, gëtt et Dish Down genannt. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Awer wann d’Harz am Film Bulk Material erweicht gëtt duerch Hëtzt a gelatiniséiert, a wäert härten, dat heescht, fir de vollen Drock ze erhéijen (300 ~ 500 PSI), sou datt d’Massmaterial eng enk Kombinatioun an d’Bildung vun engem fest Multi-Layer Verwaltungsrot.

8. Kraft Paper

Kraftpabeier gëtt als Wärmetransferbuffer benotzt fir Multilayer Board oder Substratplat ze laminéieren. Et gëtt tëscht der Hotplack (Platern) vun der Press an der Stahlplack plazéiert fir d’Heizkurve am nootste vum Bulkmaterial ze moderéieren. Tëscht Multiple Substrat oder Multilayer Placke fir gedréckt ze ginn. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Wéinst héijer Temperatur an héijen Drock ass d’Faser am Pabeier gebrach, net méi Zähegkeet a schwéier eng Roll ze spillen, also musse mir probéieren ze ersetzen. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Fir d’Planz ze spueren an d’Ausrüstung ze deelen, wäert d’allgemeng Fabréck méi “iwwerlappen” an “Klappplat” souwuel an eng ëmfaassend Veraarbechtungseenheet fusionéieren, sou datt seng Automatisatiounstechnik zimlech komplex ass.

10. Mass LaminaTIon (laminated)

This is a new construction method of abandoning “alignment tip” and adopting multiple rows of plates on the same surface. Zënter 1986, wann d’Demande fir véier a sechs Laminate eropgaang ass, huet d’Methode fir Multilaminate vill geännert. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. D’Platmethod vun dësem neie Konzept gëtt “grouss Platen” oder “grouss Platen” genannt. An de leschte Joeren, goufen et vill berufflech OEM Drécken Industrien a China.

11. Platen Hot Placke

Et ass eng bewegbar Liftplattform fir Laminatpressmaschinn oder Basisplackfabrikatioun. Déi huel Metal Mesa vun dëser Zort Massiness, am Fong ass et Drock an Hëtzt Quell ze plank ze bidden, Grond muss nach flaach erhalen, parallel Fähegkeet an héich Temperatur ze goen. Normalerweis ass all Hotplack am Damppipe, Hot Tubing oder Resistenzheizelement agebaut, an de baussenzege Rand vun der Ëmgéigend soll och mat Isoléiermaterial gefëllt ginn, fir de Wärmeverloscht ze reduzéieren, an equipéiert mat engem Temperatursensorapparat fir d’Kontroll vun der Temperatur.

12. Press Plate

bezitt sech op de Substrat oder multilayer Verwaltungsrot an der pressen, benotzt all Grupp vun loose Buch ze trennen (bezunn op Koffer, Film an banneschten Layer vun engem Buch, etc.). Dës Héichhärte Stahlplack ass AISI 630 (Härheet bis 420 VPN) oder AISI 440C (600 VPN) Legierungsstahl, d’Uewerfläch ass net nëmmen extrem haart flaach, a suergfälteg poléiert fir ze spigelen, kann an de flaach Substrat oder Circuit Board gedréckt ginn . Therefore, it is also called Mirror Plate, also known as Carrier Plate. D’Ufuerderunge vun dëser Stolplack si ganz strikt, seng Uewerfläch däerf keng Kratzer, Zänn oder Befestigung erschéngen, d’Dicke soll eenheetlech sinn, d’Häert soll genuch sinn, a kann d’chemesch Ätz widderstoen, déi duerch Héichtemperaturpressen produzéiert gëtt. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

D’Drockstäerkt (PSI) benotzt wann d’laminéiert Plack ze grouss ass, sou datt vill Harzen aus der Plack extrudéiert ginn, wat doduerch datt d’Kupferhaut direkt op d’Glas Stoff gedréckt gëtt, a souguer d’Glas Stoff ass flaach a deforméiert, also datt d’Plackdicke net genuch ass, d’Gréisststabilitéit schlecht ass, an d’Bannenlinn ass aus Form an aner Mängel gedréckt. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Tatsächlech ass et just eng Form vu “Draven” fir laminéiert Sperrholz, ouni weider Bedeitung.

15. Resin Recession, Resin retreat

Sandwich Plack an der B – Etapp vun resin Film oder BoJi Verwaltungsrot (firwat) an der fréierer, konnt nach net komplett gehärt no pressen (dat ass, de Mangel vun Grad vun polymerization), fëllt d’Lach op der tin tin Kolonn, wann fir eng Biopsie, fonnt dass d’Koffer Mauer vun Lach hannert de Mangel vun bestëmmte polymerization resin, wäert schéngen aus Koffer Mauer zréck op eidel, “resin subsidence” heescht. Dëse Defekt soll als Gesamtproblem vum Prozess oder der Plack klasséiert ginn, wat méi eescht ass wéi d’technesch Mängel vun der Uewerflächeschratz, an d’Ursaach sollt suergfälteg ënnersicht ginn.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Wann d’Basisplack oder d’Multilayerplack gedréckt ass, ass déi hart Edelstahlplack (410,420, etc.) benotzt fir d’Bicher an all Ouverture (Dagsliicht) vun der Press ze trennen. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Et bezitt sech op d’Verbindung vun de Schichten vun engem Multilayer Board, deen net zur selwechter Zäit geformt ass, awer zur selwechter Zäit an der Form vu blann oder begruewe Lächer. Dës Method kann d’Uewerfläch vun der Verwaltungsrot retten muss aus dem voll Lach gebuert ginn. Zousätzlech Brieder konnten zur Verfügung gestallt ginn fir d’Zuel vun de Kabelen an SMDS ze erhéijen, awer de Fabrikatiounsprozess gouf erheblech verspéit.

19. Starvation glue

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. bezitt sech op d’harzfloss schlecht, oder pressen Konditiounen mat ongerecht, doraus zu der Réalisatioun vun der multilayer Verwaltungsrot, der Plack Kierper vun der lokal Mangel u gekollt.

20. The Swimming line slides away

Schwammen bezitt sech op eng Rutschbewegung vun der banneschter Schicht vun engem Multilayer Board wärend der Kompressioun. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing schwiewend Dréckerei, verstoppt Dréckerei

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Wéi och ëmmer, wann de Film, deen fir d’äusseren Plack benotzt gëtt, relativ dënn ass an d’Kupferfolie nëmmen 0.5 Oz ass, kann de Circuitmuster vun der banneschten Plack op d’Verëffentlechungspabeier ënner héijen Drock transferéiert ginn. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Temperature Profile

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

D’Wuert erschéngt dacks an der PCB-Industrie am Laminat- a Trockenfilmverbindung. D’Vakuumpressen vu Multilayer Board ass ënnerdeelt an de Vakuum baussenzege Frame (Vakuum Frame), dat ass d'”Pumpemethod” mat der ursprénglecher hydraulescher Press, an d’Vakuumkammer (Autoclave), wat d'”Drockmethod” ass mat der Benotzung vun héijer Temperatur an héich Drock Kuelendioxid. Hydralic Vakuum Pressing besetzt méi wéi 90% vum Maart wéinst senger einfacher Ausrüstung, bëllegem Präis a praktescher Operatioun. Déi lescht ass well d’Ausrüstung an d’Operatioun ganz komplex sinn, an de Volume ass ganz grouss, plus d’Käschte vun den erfuerderlechen Ëmgeréits a méi deier, sou datt d’Adoptioun net vill ass.

24. Falten, Falten

Oft bezitt sech op den Drock wann de Floss vum Klebstoff ze grouss ass. 11. Falten Verursaacht de Falten, wat verursaacht datt seng baussenzeg Schicht liicht méi schwaach ass a Kraaft an Härtheet, wéi d’0.5oz Kupferfolie allgemeng bekannt als Falten. The term is also used in other areas.