1. It is the first time that we have been able to do this. 2

PCB laminated process

1. I-autoclave pressure cooker

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Olu xinzelelo lwe-MLB lwangethuba kusetyenziswa i-substrate enye yobhedu ebhityileyo yayibizwa ngokuba yiCap LaminaTIon.

3. Caul Plate

Xa ipleyiti ye-multilayer icinezelwe, phakathi koVulo ngalunye lwebhedi yokushicilela (Ukuvulwa), ihlala ipakishwe “iincwadi” ezininzi ukuze zicinezele izinto ezikhululekileyo zepleyiti (ezifana neeseti ezi-8 ~ 10), phakathi kweseti nganye “yezinto eziphathekayo “(Incwadi) , kufuneka yohlulwe ngepleyiti yentsimbi egudileyo neqinileyo, Olu hlobo lwesipili sentsimbi yePlayiti lubizwa ngokuba yiCaul Plate okanye iPleti eyahlulayo. I-AISI 430 okanye i-AISI 630 isetyenziswa ngokuqhelekileyo ngoku.

4. Ukukrazula

Kwi-laminate pressing, ihlala ibhekisela kwisikhumba sobhedu ekuqhutyweni kwe-crease. Isikhumba esibhityileyo sobhedu esingaphantsi kwe-0.5 oz sithandwa kakhulu kwesi siphene xa sicinezelwe kwiileya ezininzi.

5. Isibonda

Ibhekisa kubumnene kunye nokuthomalalisa kumphezulu wobhedu, onokuthi ubangelwe kukuphuma kwamabala kwepleyiti yentsimbi esetyenziswa ekucinezeleni. Ukuba umda weplate uwela ngokucocekileyo ngendlela efana nesiphoso, ibizwa ngokuba yiDish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Kodwa xa i-resin kwizinto ezininzi zefilimu zithambile ngenxa yobushushu kunye ne-gelatinized, kwaye ziya kuqina, oko kukuthi, ukunyuka kuxinzelelo olupheleleyo (300 ~ 500 PSI), ukwenzela ukuba izinto ezininzi zifezekiseke ngokusondeleyo kunye nokwakhiwa kwe ibhodi eqinile enamaleko amaninzi.

8. Kraft Paper

Iphepha le-Kraft lisetyenziswa njenge-buffer yokudlulisa ubushushu kwibhodi ye-laminating ye-multilayer okanye ibhodi ye-substrate. Ibekwe phakathi kwepleyiti eshushu (iPlatern) yokushicilela kunye nentsimbi yentsimbi ukumodareyitha ijika lokufudumeza elikufutshane kwizinto ezininzi. Phakathi kwe-substrate ezininzi okanye iipleyiti ezininzi eziza kucinezelwa. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Ngenxa yobushushu obuphezulu kunye noxinzelelo oluphezulu, i-fiber ephepheni iye yaphulwa, ayisekho ubunzima kunye nobunzima bokudlala indima, ngoko kufuneka sizame ukutshintsha. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Ukuze kugcinwe izixhobo zeplanti kunye nezabelo, umzi-mveliso jikelele uya kuba “ugqithene” kunye “nebhodi esongwayo” zombini zidityaniswe zibe yiyunithi ebanzi yokusetyenzwa, ngoko ke ubunjineli bayo obuzisebenzelayo buntsokothile.

10. Mass LaminaTIon (laminated)

Le yindlela entsha yokwakha yokushiya “ingcebiso yokulungelelanisa” kunye nokwamkela imiqolo emininzi yeepleyiti kumphezulu ofanayo. Ukususela kwi-1986, xa imfuno ye-laminates ezine kunye nesithandathu inyukile, indlela ye-laminating multilaminates ishintshile kakhulu. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Indlela yeplaten yale ngcamango entsha ibizwa ngokuba yi “platen enkulu” okanye “iplaten enkulu”. Kwiminyaka yakutshanje, bekukho amashishini amaninzi acinezelayo e-OEM eTshayina.

11. Iipleyiti ezishushu zePlate

Liqonga lokuphakamisa elishukumayo lomatshini wokucofa i-laminate okanye ukwenziwa kweplate yesiseko. I-mesa yentsimbi engenanto yolu hlobo lobunzima, ngokusisiseko kukubonelela ngoxinzelelo kunye nomthombo wobushushu kwiplanga, isizathu kufuneka sigcine sithe tyaba, amandla ahambelanayo kubushushu obuphezulu ukuya. Ngokuqhelekileyo ipleyiti nganye eshushu ifakwe ngaphakathi kumbhobho womphunga, iityhubhu eshushu okanye ukuxhathisa ukufudumeza into, kunye nomda wangaphandle wendawo ejikelezileyo kufuneka izaliswe ngezinto zokugquma, ukunciphisa ilahleko yobushushu, kwaye ixhotyiswe ngesixhobo esivavanya ubushushu ukulawula ubushushu. ubushushu.

12. Press Plate

Ibhekisela kwi-substrate okanye ibhodi ye-multilayer ekucinezeleni, esetyenziselwa ukwahlula iqela ngalinye leNcwadi evulekileyo (ibhekisela kubhedu, ifilimu kunye noluhlu lwangaphakathi lweNcwadi, njl.). Le ntsimbi yentsimbi enobunzima obuphezulu yi-AISI 630 (ubunzima ukuya kwi-420 VPN) okanye i-AISI 440C (600 VPN) intsimbi ye-alloy, umphezulu awukho nje ukuba lukhuni ngokugqithiseleyo, kwaye uphuculwe ngononophelo kwisibuko, unokucinezelwa kwi-substrate okanye ibhodi yesekethe. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Iimfuno zale pleyiti yentsimbi zingqongqo kakhulu, umphezulu wayo awufanele ubonakale nayiphi na imikrwelo, izibonda okanye uncamathiselo, ubukhulu bufanele bufane, ubulukhuni bufanele bube ngokwaneleyo, kwaye bunokumelana nekhemikhali ye-etching eveliswa ngokucinezelwa kobushushu obuphezulu. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Amandla oxinzelelo (PSI) asetyenziswa xa ipleyiti elaminethiweyo inkulu kakhulu, ukuze resin ezininzi extruded ngaphandle kwepleyiti, nto leyo ebangela ulusu ubhedu lucinezelwe ngokuthe ngqo kwilaphu leglasi, kwaye nelaphu leglasi lithe tyaba kwaye likhubazekile, ukuba ubukhulu bepleyiti abunelanga, ukuzinza kobungakanani kubi, kwaye umgca wangaphakathi ucinezelwe ngaphandle kokuma kunye nezinye iziphene. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Enyanisweni, luhlobo nje lwe “Draven” yeplywood elaminethiweyo, ngaphandle kwentsingiselo engakumbi.

15. Resin Recession, Resin retreat

Ipleyiti yeSandwich kwi-B – isigaba sefilimu ye-resin okanye ibhodi ye-BoJi (kutheni) ngaphambili, ayikwazanga ukuqina ngokupheleleyo emva kokucinezela (oko kukuthi, ukungabikho kweqondo lepolymerization), gcwalisa umngxuma kwikholamu yetin, xa kwi-biopsy, yafumanisa ukuba udonga lobhedu lomngxuma emva kokunqongophala kwe-polymerization resin ethile, luya kubonakala ukusuka eludongeni lobhedu lubuyela engenanto, “i-resin subsidence” ithetha. Esi siphene kufuneka sihlelwe njengengxaki epheleleyo yenkqubo okanye ipleyiti, eyona nto inzima kakhulu kuneziphene zobuchwepheshe bomkrwelo womphezulu, kwaye isizathu kufuneka siphandwe ngononophelo.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Xa ipleyiti yesiseko okanye ipleyiti ye-multilayer icinezelwe, i-plate yensimbi engenasici enzima (410,420, njl.) Isetyenziselwa ukwahlula iiNcwadi kwi-Opening nganye (i-Daylight) ye-press. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Ibhekisela kwi-Interconnection yemigangatho yebhodi ye-multilayer eyenziwe kungekhona ngexesha elifanayo kodwa ngexesha elifanayo ngendlela yeembobo ezingaboniyo okanye ezingcwatywe. Le ndlela inokugcina umphezulu webhodi kufuneka ikhutshwe kumngxuma ogcweleyo. Iibhodi ezongezelelweyo zinokwenziwa zifumaneke ukwandisa inani le-wiring kunye ne-SMDS, kodwa inkqubo yokuvelisa yalibaziseka kakhulu.

19. Iglu ngendlala

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Ibhekisela kwi-resin ehamba kakubi, okanye iimeko ezicinezelayo ngokungafanelekanga, okukhokelela ekugqityweni kwebhodi ye-multilayer, i-plate body yokungabikho kwendawo yeglue.

20. The Swimming line slides away

Ukuqubha kubhekisa kwintshukumo etyibilikayo yomaleko wangaphakathi webhodi ye-multilayer ngexesha loxinzelelo. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Ushicilelo lweTelegraphing oludadayo, ushicilelo olufihlakeleyo

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Nangona kunjalo, xa ifilimu esetyenziselwa i-plate yangaphandle incinci kwaye i-foil yobhedu i-0.5 oz kuphela, iphethini yesiphaluka yeplate yangaphakathi inokudluliselwa kwiphepha lokukhululwa phantsi koxinzelelo oluphezulu. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Iprofayile yobushushu

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Igama lihlala livela kwishishini le-PCB kwi-laminate neyomileyo yokudibanisa ifilimu. Ukucofa i-vacuum yebhodi ye-multilayer yahlulwe yaba yi-Vacuum yangaphandle yeSakhelo (iSakhelo seVacuum), “indlela yokumpompa” kunye ne-original hydraulic press, kunye ne-Vacuum chamber (i-Autoclave), “indlela yoxinzelelo” ngokusetyenziswa okuphezulu. ubushushu kunye noxinzelelo oluphezulu lwekhabhon diokside. IHydralic Vacuum Pressing ithatha ngaphezulu kwe-90% yemarike ngenxa yezixhobo zayo ezilula, ixabiso eliphantsi kunye nokusebenza ngokulula. Okokugqibela kungenxa yokuba izixhobo kunye nokusebenza kunzima kakhulu, kwaye umthamo mkhulu kakhulu, kunye neendleko zempahla efunekayo kunye neendleko ezingaphezulu, ngoko ke ukwamkelwa akuninzi.

24. Ukushwabana, Ukushwabana

Ihlala ibhekisa kuxinzelelo xa ukuhamba kweglu kukhulu kakhulu. 11. Ukushwabana kubangela uMbimbi, nto leyo ebangela ukuba umaleko wayo wangaphandle ube buthathaka kancinci ngokomelela kunye nokuqina, njengefoyile yobhedu eyi-0.5oz eyaziwa ngokuba nguMbimbi. The term is also used in other areas.