1. It is the first time that we have been able to do this. 2

PCB laminated process

1. I-Autoclave pressure cooker

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Lokhu kucindezela kwe-MLB kwasekuqaleni kusetshenziswa i-substrate eyodwa encane yesikhumba yethusi kwakubizwa nge-Cap LaminaTIon.

3. Caul Plate

Lapho ipuleti le-multilayer licindezelwa, phakathi kokuvula ngakunye kombhede wokunyathelisa (Ukuvulwa), ngokuvamile kunqwabelaniswa “izincwadi” eziningi ukuze zicindezelwe izinto ezixegayo zepuleti (ezifana namasethi angu-8~10), phakathi kwesethi ngayinye “yezinto ezixekethile “(Incwadi) , kumele ihlukaniswe ipuleti lensimbi elibushelelezi neliqinile, Lolu hlobo lwesibuko sensimbi engenasici lubizwa ngokuthi i-Caul Plate noma i-Separate Plate. I-AISI 430 noma i-AISI 630 isetshenziswa kakhulu njengamanje.

4. Crease

Ekucindezelweni kwe-laminate, ngokuvamile kubhekisela esikhumbeni sethusi ekucubunguleni i-crease. Isikhumba sethusi esizacile esingaphansi kuka-0.5 oz sithambekele kakhulu kulobu bubi lapho sicindezelwa izendlalelo eziningi.

5. Isibonda

Isho ukuthopha nokuzehlisa endaweni yethusi, okungase kubangelwe ukuvela kwamabala kwepuleti lensimbi elisetshenziswe ekucindezeleni. Uma unqenqema lwepuleti luwa kahle ngendlela efana nephutha, lubizwa ngokuthi i-Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Kodwa lapho i-resin ekwifilimu eyinqwaba yezinto ithambekele ekushiseni futhi ifakwe i-gelatinized, futhi izoba lukhuni, okungukuthi, ikhuphuke ibe yingcindezi egcwele (300 ~ 500 PSI), ukuze izinto eziningi zithole inhlanganisela eseduze kanye nokwakheka kwe ibhodi enezingqimba eziningi eqinile.

8. Kraft Paper

Iphepha le-Kraft lisetshenziswa njengebhafa yokudlulisa ukushisa kwebhodi le-multilayer laminating noma ibhodi le-substrate. Ibekwa phakathi kwe-hot plate (Platern) yokunyathelisa kanye ne-steel plate ukuze kulinganiswe ijika lokushisisa eliseduze kakhulu nokokusebenza kwenqwaba. Phakathi kwe-substrate eminingi noma amapuleti amaningi okufanele acindezelwe. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Ngenxa yokushisa okuphezulu nokucindezela okukhulu, i-fiber ephepheni iphukile, ayisekho ukuqina nobunzima bokudlala indima, ngakho-ke kufanele sizame ukufaka esikhundleni. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Ukuze kongiwe izisetshenziswa zemishini nokwabelana, ifekthri evamile izoba “nokugqagqana” kanye “nebhodi eligoqayo” kokubili kuhlanganiswe kube iyunithi yokucubungula ebanzi, ngakho ubunjiniyela bayo bokuzenzakalela buyinkimbinkimbi impela.

10. Mass LaminaTIon (laminated)

Lena indlela entsha yokwakha yokushiya “ithiphu yokuqondanisa” nokusebenzisa imigqa eminingi yamapuleti endaweni efanayo. Kusukela ngo-1986, lapho isidingo sama-laminates amane nesithupha senyukile, indlela ye-laminating multilaminates ishintshile kakhulu. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Indlela ye-platen yalo mqondo omusha ibizwa ngokuthi “i-platen enkulu” noma “i-platen enkulu”. Eminyakeni yamuva nje, kube nezimboni eziningi ezicindezelayo ze-OEM eChina.

11. Amapuleti ashisayo

Kuyinkundla yokuphakamisa ethathekayo yomshini wokucindezela we-laminate noma ukukhiqiza amapuleti esisekelo. I-mesa yensimbi engenalutho yalolu hlobo lobukhulu, ngokuyisisekelo iwukunikeza ingcindezi nomthombo wokushisa epulangweni, isizathu kusafanele silondoloze ikhono eliyisicaba, elihambisanayo ekushiseni okuphezulu ukuhamba. Ngokuvamile ipuleti ngalinye elishisayo lishunyekwa ngaphakathi kwepayipi lesitimu, ishubhu elishisayo noma isici sokushisa esingamelani, futhi unqenqema lwangaphandle lwendawo ezungezile kufanele futhi lugcwaliswe ngezinto ezivikelayo, ukuze kwehliswe ukulahlekelwa ukushisa, futhi kufakwe idivayisi ezwa izinga lokushisa ukuze ulawule ukushisa. izinga lokushisa.

12. Press Plate

Isho i-substrate noma ibhodi lezendlalelo eziningi ekucindezeleni, okusetshenziselwa ukuhlukanisa iqembu ngalinye leBhuku elixegayo (libhekisela ethusi, ifilimu kanye nongqimba lwangaphakathi lweBhuku, njll.). Le plate yensimbi enobulukhuni obuphakeme i-AISI 630(ukuqina kufika ku-420 VPN) noma i-AISI 440C(600 VPN) ingxubevange yensimbi, indawo engaphezulu ayigcini nje ngokuba isicaba eqine ngokwedlulele, futhi ipholishwe ngokucophelela ukuze ibe nesibuko, ingacindezelwa ku-substrate eyisicaba noma ibhodi lesifunda. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Izidingo zaleli puleti lensimbi ziqinile kakhulu, ubuso balo akufanele buvele noma yikuphi ukuklwebheka, amazinyo noma okunamathiselwe, ukujiya kufanele kube okufanayo, ukuqina kufanele kube ngokwanele, futhi bungamelana nokucwiliswa kwamakhemikhali okukhiqizwa ukucindezela okuphezulu kokushisa. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Amandla okucindezela (PSI) asetshenziswa lapho ipuleti elaminethiweyo likhulu kakhulu, ukuze ama-resin amaningi akhishwe ngaphandle kwepuleti, okuholela ekutheni isikhumba sethusi sicindezelwe ngqo endwangu yengilazi, futhi ngisho nendwangu yengilazi isicaba futhi ikhubazekile, ukuthi ukushuba kwepuleti akwanele, ukuqina kosayizi akulungile, futhi umugqa wangaphakathi ucindezelwe ngaphandle kokuma kanye nezinye iziphambeko. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Eqinisweni, iwuhlobo nje elithi “Draven” yeplywood elaminethiwe, engenancazelo eyengeziwe.

15. Resin Recession, Resin retreat

Ipuleti le-sandwich ku-B – isigaba sefilimu ye-resin noma ibhodi le-BoJi (kungani) ngaphambili, belingeke libe lukhuni ngokuphelele ngemva kokucindezela (okungukuthi, ukungabi khona kwezinga le-polymerization), gcwalisa imbobo kukholamu yethini, lapho i-biopsy, ithole ukuthi udonga lwethusi lwembobo ngemuva kokuntuleka kwe-polymerization resin ethile, luzovela odongeni lwethusi lubuyele lungenalutho, “i-resin subsidence” kusho. Lesi sici kufanele sichazwe njengenkinga iyonke yenqubo noma ipuleti, elibi kakhulu kunokulimala kwezobuchwepheshe kokuklwebheka kwendawo, futhi imbangela kufanele iphenywe ngokucophelela.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Uma i-base plate noma i-multilayer plate icindezelwa, ipuleti lensimbi eqinile (410,420, njll.) elisetshenziselwa ukuhlukanisa Amabhuku Ekuvuleni ngakunye (Ukukhanya Kwasemini) komshini. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Ibhekisela ku-Interconnection yezendlalelo zebhodi le-multilayer elakhiwe hhayi ngesikhathi esifanayo kodwa ngesikhathi esifanayo ngendlela yezimbobo eziyizimpumputhe noma ezigqitshiwe. Le ndlela ingagcina ingaphezulu lebhodi kufanele likhishwe emgodini ogcwele. Amabhodi engeziwe angenziwa atholakale ukuze kwandiswe inani lezintambo kanye nama-SMDS, kodwa inqubo yokukhiqiza yabambezeleka kakhulu.

19. Ingcina yendlala

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Ibhekisela ekugelezeni kwe-resin kubi, noma izimo ezicindezelayo ezingalungile, okuholela ekuqedweni kwebhodi le-multilayer, umzimba wepuleti wokuntuleka kwendawo yeglue.

20. The Swimming line slides away

Ukubhukuda kubhekisela ekunyakazeni okuslayidayo kongqimba lwangaphakathi lwebhodi lezendlalelo eziningi ngesikhathi sokuminyanisa. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Ukuphrinta okuntantayo kwe-telegraphing, ukuphrinta okufihliwe

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Kodwa-ke, lapho ifilimu esetshenziselwa ipuleti yangaphandle incane futhi i-foil yethusi ingu-0.5 oz kuphela, iphethini yesifunda yepuleti yangaphakathi ingase idluliselwe ephepheni lokukhulula ngaphansi kwengcindezi ephezulu. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Iphrofayili yezinga lokushisa

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Igama livame ukuvela embonini ye-PCB ekuxhumaneni kwefilimu e-laminate neyomile. I-Vacuum pressing ye-multilayer board ihlukaniswe yaba Uhlaka lwangaphandle lwe-Vacuum (I-Vacuum Frame), “okuyindlela yokumpompa” ngomshini wokunyathelisa we-hydraulic wasekuqaleni, kanye ne-Vacuum chamber (i-Autoclave), “okuyindlela yokucindezela” esetshenziswa phezulu. izinga lokushisa kanye ne-high pressure carbon dioxide. IHydralic Vacuum Pressing ithatha ngaphezu kwe-90% yemakethe ngenxa yemishini yayo elula, intengo eshibhile nokusebenza okulula. Lokhu kokugcina kungenxa yokuthi imishini nokusebenza kuyinkimbinkimbi kakhulu, futhi ivolumu inkulu kakhulu, kanye nezindleko zezimpahla ezidingekayo futhi zibiza kakhulu, ngakho-ke ukutholwa akuningi.

24. Ukushwabana, Ukushwabana

Ngokuvamile kubhekisela ekucindezelweni lapho ukugeleza kweglue kukhulu kakhulu. 11. Ukushwabana Kudala Ukushwabana, okwenza ungqimba lwawo olungaphandle lube buthaka kancane ngamandla nobulukhuni, njengephepha le-copper elingu-0.5oz elivame ukubizwa ngokuthi Ukushwabana. The term is also used in other areas.