1. It is the first time that we have been able to do this. 2

PCB laminated process

1. Fandrahoan-tsakafo autoclave

Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its “resistance to lamination” characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of “cabin pressure method” carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.

2. Cap Lamination

The “outer layer” of MLB was laminated and pressed on thin single-sided copper-skinned substrates. It was not until the end of 1984, when MLB production increased significantly, that the current copper-skinned large or bulk lamination method (Mss Lam) was adopted. Ity famatrarana MLB tany am-boalohany mampiasa substrate manify hoditra varahina tokana ity dia nantsoina hoe Cap LaminaTIon.

3. Caul Plate

Rehefa voatsindry ny lovia multilayer, eo anelanelan’ny fanokafana ny fandriana fanaovan-gazety (Opening), matetika no natsangany “boky” maro mba ho voatsindry lovia malalaka fitaovana (toy ny 8 ~ 10 sets), eo anelanelan’ny andian-“mahavaha fitaovana” (Boky) , dia tsy maintsy misaraka amin’ny takelaka vy matevina sy malefaka, Ity karazana fitaratra stainless vy Plate ity dia antsoina hoe Caul Plate na Separate Plate. AISI 430 na AISI 630 no matetika ampiasaina amin’izao fotoana izao.

4. Miforitra

Ao amin’ny fanerena laminate, matetika dia manondro ny hoditra varahina amin’ny fanodinana ny crease. Ny hoditra varahina manify latsaky ny 0.5 oz dia mora voan’io kilema io rehefa tsindriana amin’ny sosona maromaro.

5. Dent

Izany dia manondro ny malefaka sy midina mihitsy aza eo amin’ny varahina ambonin’ny, izay mety ho vokatry ny pentina protrusion ny takelaka vy ampiasaina amin’ny fanerena. Raha toa ka milatsaka tsara ny sisin’ny takelaka amin’ny endrika tsy mety, dia antsoina hoe Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.

6. Foil LaminaTIon

It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.

7. Kiss Pressure

When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called “kiss pressure”. Fa rehefa ny resin ao amin’ny sarimihetsika ampahany betsaka fitaovana dia nanalefaka ny hafanana sy ny gelatinized, ary ho mafy orina, izany hoe, mba hampitombo ny fanerena feno (300 ~ 500 PSI), ka ny ampahany be dia be ny fitaovana mba hanatratrarana akaiky mitambatra sy ny fananganana ny board maro sosona mafy.

8. Kraft Paper

Ny taratasy kraft dia ampiasaina ho buffer famindrana hafanana ho an’ny laminating multilayer board na substrate board. Izy io dia apetraka eo anelanelan’ny takelaka mafana (Platern) amin’ny milina fanaovan-gazety sy ny takelaka vy mba hanamafisana ny curve fanafanana akaiky indrindra amin’ny fitaovana betsaka. Eo anelanelan’ny substrate maromaro na takelaka multilayer hotsindriana. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Noho ny mari-pana ambony sy ny tsindry ambony, ny fibre ao amin’ny taratasy dia tapaka, tsy manana henjana intsony ary sarotra ny mitana anjara toerana, noho izany dia tsy maintsy miezaka manolo. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.

9. Lay it Up

Before the laminate or substrate is pressed, it is necessary to align, fall, or set the inner layer, film, copper and other bulk materials with steel plates, kraft paper padding materials, etc., so that it can be carefully fed into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this “overlap” work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the “automatic” overlap way, in order to reduce human errors and losses. Mba hamonjena ny orinasa sy ny fizarana fitaovana, ny orinasa amin’ny ankapobeny dia ho “mifanindry” kokoa sy “birao miforitra” samy mitambatra ho vondrona fanodinana feno, noho izany dia sarotra be ny injeniera automatique.

10. Mass LaminaTIon (laminated)

Ity dia fomba fanamboarana vaovao amin’ny fialana amin’ny “tendron’ny alignment” ary ny fametrahana takelaka maromaro amin’ny lafiny iray. Nanomboka tamin’ny 1986, rehefa nitombo ny fangatahana laminate efatra sy enina, dia niova be ny fomba laminating multilaminates. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the “target” is pre-made on the inner layer plate, which is “swept” to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of “High” and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. Ny fomba fiasa amin’ity hevitra vaovao ity dia antsoina hoe “plate lehibe” na “plate lehibe”. Tao anatin’ny taona vitsivitsy, dia maro ny matihanina OEM fanerena indostria any Shina.

11. takelaka mafana

Izy io dia sehatra fanandratana mihetsika ho an’ny milina fanerena laminate na famokarana takelaka fototra. Ny mesa metaly poakaty amin’ity karazana massiness ity, amin’ny ankapobeny dia ny manolotra fanerena sy loharano hafanana amin’ny plank, ny antony dia tsy maintsy mbola afaka mitazona ny fahaiza-manao mitovy amin’ny hafanana avo mba handehanana. Matetika ny takelaka mafana tsirairay dia tafiditra ao anatin’ny sodina etona, fantsona mafana na singa fanafanana fanoherana, ary ny sisiny ivelany amin’ny manodidina dia tokony ho feno fitaovana insulating, mba hampihenana ny fahaverezan’ny hafanana, ary fitaovana amin’ny fitaovana fandrefesana ny mari-pana mba hifehezana ny maripana.

12. Press Plate

Enti-milaza ny substrate na multilayer board ao amin’ny fanerena, ampiasaina hanasarahana ny vondrona tsirairay boky malalaka (manondro varahina, sarimihetsika sy ny sosona anatiny ny Boky, sns). Ity takelaka vy mafy mafy ity dia AISI 630 (hamafisina hatramin’ny 420 VPN) na AISI 440C (600 VPN) firaka vy, ny etỳ ambonin’ny dia tsy tena mafy fisaka, ary tsara voaporitra amin’ny fitaratra, dia azo tsindriana ao amin’ny fisaka substrate na ny faritra birao. . Therefore, it is also called Mirror Plate, also known as Carrier Plate. Ny fepetra takian’ity takelaka vy ity dia tena henjana, tsy tokony hisy scratches, dents na attaché ny eny amboniny, tokony hitovy ny hateviny, tokony ho ampy ny hamafin’ny, ary mahatanty ny etching simika vokarin’ny fanerena ny hafanana. The price of this kind of steel plate is very expensive because it is able to withstand strong mechanical brushes after each pressing.

13. Print Through

Ny hery fanerena (PSI) ampiasaina rehefa lehibe loatra ny laminated lovia, ka maro resins extruded avy amin’ny lovia, ka ny hoditra varahina dia voatsindry mivantana amin’ny fitaratra lamba, ary na dia ny fitaratra lamba fisaka sy deformed, ka fa ny hatevin’ny takelaka dia tsy ampy, ny fahamarinan-toerana dia mahantra, ary ny tsipika anatiny dia voatsindry avy amin’ny endrika sy ny kilema hafa. In serious cases, the wire foundation often has direct contact with the glass fiber cloth, burying a “ConducTIve glass fiber” leakage concern. CAF). The basic solution is according to the principle of Scaled Flow, large area pressing should use large pressure intensity, small plate surface use small pressure intensity; The Pressure and Force of field operation are calculated using 1.16PSI/in2 or 1.16Lb/in4 as a baseline.

14. Relamination(RE-LAM) laminated plate

The inner layer of thin substrate, is made of substrate suppliers using film and copper pressed together, circuit board factory bought thin substrate made of inner circuit board, but also with the film to press synthetic multilayer board, some occasions often special emphasis and called “re-pressed together”, referred to as re-LAM. Raha ny marina dia endrika “Draven” fotsiny izy io ho an’ny plywood misy lamosina, tsy misy dikany intsony.

15. Resin Recession, Resin retreat

Sandwich lovia ao amin’ny B – dingan’ny resin film na BoJi board (nahoana) ao amin’ny teo aloha, dia tsy mbola nihamafy tanteraka taorian’ny fanerena (izany hoe ny tsy fisian’ny polymerization), fenoy ny lavaka eo amin’ny tsanganana vifotsy, rehefa ho an’ny biopsy, dia hita fa ny rindrina varahina lavaka ao ambadiky ny tsy fisian’ny resin polymerization sasany, dia hiseho avy amin’ny rindrin’ny varahina hiverina ho foana, “resina subsidence” midika hoe. Ity kilema ity dia tokony ho sokajiana ho olana ankapobeny amin’ny dingana na ny takelaka, izay lehibe kokoa noho ny lesoka ara-teknika amin’ny scratch surface, ary tokony hodinihina tsara ny antony.

16. Scaled Flow Test

It is a method of detecting the amount of glue in the film (Prepreg) when the laminate is pressed.It is also a test method for Resin Flow under high temperature and high pressure. See section 2.3.18 of IPC-TM-650 for detailed practice, and see PCB Information Journal, No. 14, P.42 for a description of theory and content

17. Separator Plate, mirror Plate

Rehefa tsindriana ny takelaka fototra na ny takelaka multilayer, ny takelaka vy tsy misy pentina mafy (410,420, sns.) ampiasaina hanasarahana ny Boky isaky ny fanokafana (Daylight) amin’ny gazety dia. In order to prevent adhesion, the surface is specially treated to be very flat and bright, so it is also called Mirror Plate.

18. Sequential Lamination

Izy io dia manondro ny Fifandraisana amin’ny sosona amin’ny solaitrabe multilayer izay tsy miforona amin’ny fotoana iray fa amin’ny fotoana mitovy amin’ny endrika jamba na lavaka nalevina. Ity fomba ity dia afaka mamonjy ny ambonin`ny solaitrabe dia tsy maintsy avoaka avy ao amin`ny lavaka feno. Mety hisy boards fanampiny hampitombo ny isan’ny wiring sy SMDS, saingy nahemotra be ny fizotran’ny famokarana.

19. lakaoly mosary

The word in the circuit board industry, has been commonly used in multilayer board bonding “lack of glue” Starvation problem expression. Manondro ny resin mikoriana ratsy, na manindry fepetra amin`ny tsy mety, ka nahatonga ny fahavitan`ny multilayer birao, ny lovia vatana ny eo an-toerana tsy fisian`ny lakaoly.

20. The Swimming line slides away

Ny lomano dia fihetsehana mikisaka amin’ny sosona anatiny amin’ny solaitrabe marolafy mandritra ny fanerena. This is closely related to the length of the “Gel Time” of the film used. At present, the industry has tended to use shorter Gel Time, so the problem has been reduced a lot.

21. Telegraphing mitsingevana fanontam-pirinty, miafina fanontana

In order to prevent the trouble of glue overflow, a heat-resistant film (such as Tedlar) is added to the copper foil or thin base plate of the scattered material which has been stacked, so as to facilitate the use of stripping or deforming after pressing. Na izany aza, rehefa somary manify ny sarimihetsika ampiasaina amin’ny takelaka ivelany ary ny foil varahina dia 0.5 oz ihany, dia azo afindra any amin’ny taratasy famotsorana amin’ny fanerena avo ny lamina ao amin’ny takelaka anatiny. When the demoulding paper is reused on a set of boards, it is likely to float the original pattern on the copper surface of the new board, this phenomenon is called Telegraphing.

22. Profile maripana

In the circuit board industry in the pressing process, or downstream assembly of infrared or hot air welding (Reflow) process, all need to seek the temperature (vertical axis) and time (horizontal axis) matching composition of the best “temperature curve”, in order to improve the solder quality in mass production rate.

23. Vacuum Lamination

Ny teny matetika dia hita ao amin’ny indostrian’ny PCB amin’ny fatorana sarimihetsika laminate sy maina. Ny vacuum fanerena ny multilayer board dia mizara ho Vacuum ivelany Frame (Vacuum Frame), izay ny “paompy fomba” miaraka amin’ny tany am-boalohany hydraulic milina fanontam-pirinty, ary ny Vacuum efitra (Autoclave), izay ny “tsindry fomba” amin’ny fampiasana avo. hafanana sy gazy karbonika avo lenta. Hydralic Vacuum Pressing dia mitana mihoatra ny 90% amin’ny tsena noho ny fitaovana tsotra, ny vidiny mora ary ny fiasa mety. Ity farany dia satria be pitsiny ny fitaovana sy ny fampandehanana azy, ary be dia be ny volume, miampy ny saran’ny kojakoja ilaina sy lafo kokoa, ka tsy dia be loatra ny fandraisana.

24. Mikentrona, Mikentrona

Matetika dia manondro ny tsindry rehefa lehibe loatra ny fikorianan’ny lakaoly. 11. Ny ketrona dia miteraka ny fiketronana, izay mahatonga ny sosona ivelany ho malemy kokoa amin’ny tanjaka sy ny hamafin’ny, toy ny foil varahina 0.5oz fantatra amin’ny anarana hoe Wrinkle. The term is also used in other areas.