Shanduko muhukuru hwe substrate panguva yekugadzira PCB

Reason:

(1) Musiyano munzira yewarp uye weft inoita kuti saizi ye substrate ichinje; nekuda kwekushayikwa kwekutarisa kune fiber kutungamira panguva yekuveura, shear stress inoramba iri mu substrate. Kana ichinge yaburitswa, inokanganisa zvakananga shrinkage ye substrate saizi.

(2) Iyo foil yemhangura iri pamusoro peiyo substrate yakadzimirwa kure, iyo inomisa shanduko ye substrate, uye saizi inoshanduka kana kushushikana kwadzikiswa.

(3) Kudzvinyirira kwakanyanya kunoshandiswa pakukwesha Pcb bhodhi, zvichikonzera kudzvinyirira uye kunetseka kunetseka uye deformation ye substrate.

(4) Iyo resin mu substrate haina kupora zvakakwana, zvichikonzera shanduko yedimensional.

(5) Kunyanya iyo yakawanda-layer board isati yave nelamination, iyo yekuchengetedza mamiriro haina kunaka, kuitira kuti iyo yakaonda substrate kana prepreg inotora unyoro, zvichikonzera kusagadzikana kwechimiro.

(6) Kana iyo multilayer board ichidzvanywa, kuyerera kwakanyanya kweglue kunokonzera deformation yejira regirazi.

ipcb

Solution:

(1) Sarudza mutemo wekuchinja mune latitude uye longitude kutungamira kuti utsivise pane zvisina kunaka maererano ne shrinkage rate (iri basa rinoitwa pamberi pechiedza kupenda). Panguva imwecheteyo, kuchekwa kunogadziriswa maererano nefiber direction, kana kugadziriswa maererano nechiratidzo chechimiro chinopihwa nemugadziri pane substrate (kazhinji iyo yakatwasuka nzira yehunhu ndiyo yakatwasuka nzira ye substrate).

(2) Paunenge uchigadzira dunhu, edza kuita kuti bhodhi rose rigovane zvakaenzana. Kana zvisingabviri, chikamu chekushandura chinofanira kusara munzvimbo (kunyanya pasina kukanganisa nzvimbo yedunhu). Izvi zvinokonzerwa nemusiyano wewap uye weft yeshinda density mune yegirazi jira chimiro chebhodhi, izvo zvinoguma nemusiyano musimba rebhodhi mune warp uye weft nzira.

(3) Kuedza brushing kunofanira kushandiswa kugadzira maparamendi ekugadzirisa mune yakanakisa mamiriro, uye ipapo yakasimba bhodhi. Kune matete substrates, makemikari ekuchenesa maitiro kana electrolytic maitiro anofanirwa kushandiswa kuchenesa.

(4) Tora nzira yekubika kugadzirisa. Kunyanya, bika usati wachera pakupisa kwe120 ° C kwemaawa mana kuti uone kuti resin inoporeswa uye kuderedza ukuru hwe substrate nekuda kwesimba rekupisa uye kutonhora.

(5) Iro mukati meiyo oxidation-yakagadziriswa substrate inofanira kubikwa kuti ibvise unyoro. Uye chengetedza iyo yakagadziridzwa substrate muvacuum yekuomesa bhokisi kuti udzivise kunwa hunyoro zvakare.

(6) Maitiro ekumanikidza bvunzo inodiwa, maitiro paramita anogadziriswa uye obva adzvanywa. Panguva imwecheteyo, maererano nemaitiro e prepreg, huwandu hwakakodzera hwekuyerera kweglue hunogona kusarudzwa.