Isizathu:

(1) Umehluko ohlangothini lwe-warp ne-weft ubangela ukuthi usayizi we-substrate ushintshe; ngenxa yokuntuleka kokunaka isiqondiso se-fiber ngesikhathi sokugunda, ukucindezeleka kwe-shear kuhlala ku-substrate. Uma isikhishiwe, izothinta ngokuqondile ukuncipha kosayizi we-substrate.

(2) I-foil yethusi ebusweni be-substrate iqoshwe, ebeka umkhawulo ekushintsheni kwe-substrate, futhi usayizi uyashintsha lapho ukucindezeleka kukhishwa.

(3) Ukucindezela okwedlulele kusetshenziswa lapho uxubha PCB ibhodi, okuholela ekucindezelekeni okucindezelayo nokuqina kanye nokuguqulwa kwe-substrate.

(4) I-resin ku-substrate ayelapheki ngokugcwele, okuholela ekushintsheni kobukhulu.

(5) Ikakhulukazi ibhodi le-multi-layer ngaphambi kwe-lamination, isimo sokugcina asilungile, ukuze i-substrate encane noma i-prepreg izomunca umswakama, okuholela ekuzinzeni kwe-dimensional embi.

(6) Uma ibhodi le-multilayer licindezelwa, ukugeleza ngokweqile kweglue kubangela ukuguqulwa kwendwangu yengilazi.

Isixazululo:

(1) Nquma umthetho woshintsho ekuqondeni kwe-latitude ne-longitude ukunxephezela okubi ngokwezinga lokuncipha (lo msebenzi wenziwa ngaphambi kokudweba okukhanyayo). Ngesikhathi esifanayo, ukusika kucutshungulwa ngokulandela isiqondiso se-fiber, noma kucutshungulwe ngokusho kophawu lomlingiswa olunikezwa umenzi ku-substrate (ngokuvamile ukuqondisa okuqondile komlingiswa kuyisiqondiso esiqondile se-substrate).

(2) Lapho uklama isifunda, zama ukwenza yonke indawo yebhodi isatshalaliswe ngokulinganayo. Uma kungenakwenzeka, isigaba soguquko kufanele sishiywe endaweni (ikakhulukazi ngaphandle kokuthinta isikhundla sesifunda). Lokhu kungenxa yomehluko ku-warp ne-weft ntambo ukuminyana esakhiweni sendwangu yengilazi yebhodi, okuphumela kumehluko emandleni ebhodi eziqondisweni ze-warp ne-weft.

(3) Ukuxubha kwesivivinyo kufanele kusetshenziselwe ukwenza imingcele yenqubo ibe sesimweni esihle kakhulu, bese kuba yibhodi eliqinile. Kuma-substrates amancane, izinqubo zokuhlanza amakhemikhali noma izinqubo ze-electrolytic kufanele zisetshenziselwe ukuhlanza.

(4) Thatha indlela yokubhaka ukuxazulula. Ikakhulukazi, bhaka ngaphambi kokubhoboza ekushiseni kwe-120 ° C amahora angu-4 ukuqinisekisa ukuthi i-resin iphulukisiwe futhi inciphisa ubukhulu be-substrate ngenxa yethonya lokushisa nokubanda.

(5) Ungqimba lwangaphakathi lwe-substrate ene-oxidation kufanele lubhakwe ukuze kukhishwe umswakama. Futhi gcina i-substrate ecutshunguliwe ebhokisini lokumisa i-vacuum ukuze ugweme ukumuncwa komswakama futhi.

(6) Ukuhlolwa kwengcindezi yenqubo kuyadingeka, imingcele yenqubo iyalungiswa bese icindezelwa. Ngesikhathi esifanayo, ngokusho kwezici ze-prepreg, inani elifanele lokugeleza kweglue lingakhethwa.