Isizathu:

(1) Umahluko kwicala le-warp kunye ne-weft kubangela ukuba ubungakanani be-substrate butshintshe; ngenxa yokungabikho kwengqalelo kwisikhokelo sefiber ngexesha lokucheba, uxinzelelo lwe-shear luhlala kwi-substrate. Emva kokuba ikhutshwe, iya kuchaphazela ngokuthe ngqo ukucutha kobungakanani be-substrate.

(2) I-foil yobhedu ebusweni be-substrate ikhutshwe, ethintela utshintsho lwe-substrate, kwaye ubungakanani buguquka xa uxinzelelo lukhululekile.

(3) Uxinzelelo olugqithisileyo lusetyenziswa xa kuxutyushwa Ibhodi PCB, okubangela uxinzelelo kunye noxinzelelo kunye nokuguqulwa kwe-substrate.

(4) I-resin kwi-substrate ayinyangeki ngokupheleleyo, okubangela utshintsho lwe-dimensional.

(5) Ngokukodwa ibhodi ye-multi-layer ngaphambi kokuba i-lamination, imeko yokugcina ihlwempuzekile, ukwenzela ukuba i-substrate encinci okanye i-prepreg ithathe ukufuma, okukhokelela ekuzinzeni kwe-dimensional embi.

(6) Xa ibhodi ye-multilayer icinezelwe, ukuhamba ngokugqithiseleyo kweglue kubangela ukuguqulwa kwelaphu leglasi.

isisombululo:

(1) Misela umthetho wokutshintsha kwi-latitude kunye ne-longitude ulwalathiso ukuhlawulela kwi-negative ngokwezinga lokunciphisa (lo msebenzi uqhutyelwa ngaphambi kokudweba ukukhanya). Ngelo xesha, ukusika kucutshungulwa ngokwendlela yefiber, okanye iqhutywe ngokuhambelana nophawu lomlingiswa onikezelwe ngumenzi kwi-substrate (ngokuqhelekileyo ulwalathiso oluthe nkqo lomlingiswa lukhokelo oluthe nkqo lwe-substrate).

(2) Xa uyila isiphaluka, zama ukwenza yonke indawo yebhodi isasazwe ngokulinganayo. Ukuba akunakwenzeka, icandelo lenguqu kufuneka lishiywe kwindawo (ikakhulukazi ngaphandle kokuchaphazela indawo yesiphaluka). Oku kungenxa yomahluko kwi-warp kunye ne-weft yarn ingxinano kwisakhiwo selaphu leglasi yebhodi, nto leyo ephumela kumahluko kumandla ebhodi kwi-warp kunye ne-weft imiyalelo.

3 Kwii-substrates ezincinci, iinkqubo zokucoca iikhemikhali okanye iinkqubo ze-electrolytic kufuneka zisetyenziswe ukucoca.

(4) Thatha indlela yokubhaka ukusombulula. Ngokukodwa, bhaka ngaphambi kokugaya kwiqondo lokushisa kwe-120 ° C kwiiyure ze-4 ukuqinisekisa ukuba i-resin iphilisiwe kwaye inciphisa ubungakanani be-substrate ngenxa yempembelelo yokushisa nokubanda.

(5) Umaleko ongaphakathi we substrate ene-oxidation kufuneka ubhakwe ukususa ukufuma. Kwaye gcina i-substrate esetyenzisiweyo kwibhokisi yokumisa i-vacuum ukunqanda ukufunxa ukufuma kwakhona.

(6) Uvavanyo loxinzelelo lwenkqubo luyafuneka, iiparamitha zenkqubo zihlengahlengiswa kwaye zicinezelwe. Ngexesha elifanayo, ngokweempawu ze-prepreg, inani elifanelekileyo lokuhamba kweglue linokukhethwa.