PCB isingeniso sokucubungula ukubukeka

Ukukhishwa kwe-PCB, umgodi nokuma kokuma kungasebenzisa indlela yokufa yokufa, yokucubungula i-PCB elula noma i-PCB enezidingo ezingekho kakhulu kakhulu ingasebenzisa indlela yokuvala. Ifanele ukukhiqizwa kwezinga eliphansi kanye nenani le-PCB elinemfuneko engekho kakhulu futhi hhayi imfuneko ephezulu kakhulu yomumo, ngezindleko eziphansi.

Punch:

Ukukhiqizwa kwenqwaba enkulu, uhlobo nenombolo yezimbobo kanye nokuma okuyinkimbinkimbi kwe-substrate yamaphepha ohlangothini olulodwa ne-double-emaceleni emgodini we-epoxy glass substrate, ngokuvamile esebenzisa isibhakela esisodwa noma eziningana zokufa.

Ukulungiswa komumo:

Ephrintiwe ukukhiqizwa ibhodi ivolumu enkulu panel olulodwa futhi double panel ukuma, ngokuvamile die. Ngokuya ngosayizi webhodi eliphrintiwe, lingahlukaniswa libe yifa elingaphezulu nelokuwa.

Ukucubungula okuyinhlanganisela:

In order to shorten the manufacturing cycle and improve productivity, composite die is used to process the holes and shapes of single panel at the same time.

To process printed board with mold, the key is the design and processing of mold, which requires professional technical knowledge. In addition, the installation and debugging of mold are also very important. At present, most of the mold of PCB manufacturers are processed by external factories.

Izinyathelo zokuphepha zokufakwa kwesikhunta:

1. Ngokwesibalo sedizayini yokubalwa kwamandla angenalutho, usayizi wedayidi, ukuphakama kokuvalwa kokukhethwa komshini (kufaka phakathi uhlobo, ithani).

2. Start the punch, check the clutch, brake, slider and other parts are normal, the operating mechanism is reliable, there must be no continuous impact phenomenon.

3. The pad iron under the die, generally 2 pieces, must be ground on the grinder at the same time, to ensure that the die is installed parallel and vertical. Pad iron placement of the leap position that does not prevent material falling at the same time as close to the mold center.

4. Lungisa amasethi amaningana wepuleti yokucindezela kanye nezikulufo ze-T-head zokucindezela ipuleti ukuze zisetshenziswe ngokuhambisana nesikhunta. Ingaphambili lepuleti lokucindezela akumele lithinte udonga oluqondile lwensimbi ephansi. Emery cloth should be placed between the contact surfaces and the screws must be tightened.

5. Lapho ufaka isikhunta, naka izikulufo namantongomane kulokho okungaphansi ungathinti okokufa okuphezulu (amathonsi aphezulu afe bese evala).

6. Lapho ulungisa isikhunta, zama ukusebenzisa ibhukwana hhayi imoto.

7. In order to improve the blanking performance of the substrate, the paper substrate should be heated. Izinga lokushisa layo lize kuma-70 ~ 90 ℃ lingcono kakhulu.

Umgodi nokuma kwebhodi eliphrintiwe lokufa elinamapulangwe kunezici ezilandelayo zekhwalithi:

Iphakanyiswe yazungeza imbobo noma ucwecwe lwethusi lusontekile noma lukalayini; Kukhona imifantu phakathi kwezimbobo; Hole position deviation or hole itself is not vertical; Burr; Isigaba esibi; The printed board is warped into the bottom of the pot; Scrap jumping up; Ujeme wemfucuza.

Izinyathelo zokuhlola nokuhlaziya zimi ngale ndlela elandelayo:

Hlola ukuthi amandla okushaya kanye nokuqina komshini wokushaya akwanele yini; Umklamo we-Die unengqondo, uqinile ngokwanele; I-convex, i-concave die kanye nekholomu yokuqondisa, ukunemba kwemikhono yemikhono kutholakala, ukufakwa kugxile, kumile mpo. Ukuthi imvume efanelekile iyalingana yini. Igebe phakathi kwe-convex ne-concave lincane kakhulu noma likhulu kakhulu ukukhiqiza ukukhubazeka kwekhwalithi, okuyinkinga ebaluleke kakhulu ekwakhiweni kwesikhunta, ukucubungula, ukulungisa amaphutha nokusetshenziswa. Imiphetho yokufa ye-convex ne-concave ayivunyelwe ukugoqwa futhi ihlungwe. I-punch ayivunyelwe ukuba ne-taper, ikakhulukazi lapho ukubhoboza izigaxa ezijwayelekile neziguquliwe akuvunyelwe. Ekukhiqizweni, kufanele njalo sinake ukuthi emaphethelweni e-convex ne-concave die ifakiwe. Ukukhipha umlomo kunengqondo, ukumelana okuncane. Push the material board, the material rod is reasonable, enough force. Ubukhulu bepuleti namandla okubopha we-substrate, inani le-glue, namandla okubopha we-foil yethusi, ukushisa nomswakama nesikhathi nakho nakho kufanele kubhekwe ekuhlaziyweni kwamaphutha ekhwalithi angenalutho.