The PCB Wayar tagulla ta faɗo (wato ana yawan cewa ana zubar da jan ƙarfe), kuma duk kamfanonin PCB za su ce matsala ce ta laminate kuma suna buƙatar shuke-shuken da suke samar da su suyi mummunar asara. Bisa ga shekaru na gwaninta a cikin kula da korafe-korafen abokin ciniki, dalilan gama gari na zubar da PCB sune kamar haka:

1. PCB factory tsari dalilai:

1). Yawan etching na tagulla.

Bakin jan ƙarfe na electrolytic da ake amfani da shi a kasuwa gabaɗaya galvanized ne mai gefe guda (wanda akafi sani da ashing foil) da kuma jan karfe mai gefe guda (wanda akafi sani da jan foil). Fayil na jan ƙarfe na yau da kullun galibi galvanized foil na jan karfe sama da 70um, ja da foil 18um. Fail ɗin toka mai zuwa yana da asali babu wani ƙin yarda da tsari na jan ƙarfe. Lokacin da tsarin kewayawa ya fi layin etching, idan an canza ƙayyadaddun takaddun tagulla ba tare da canza sigogin etching ba, wannan zai sa jakar tagulla ta zauna a cikin maganin etching na dogon lokaci.

Domin zinc asalin ƙarfe ne mai aiki, lokacin da wayar tagulla akan PCB ta jiƙa a cikin maganin etching na dogon lokaci, zai haifar da lalatawar kewayen da’irar, yana haifar da wani bakin ciki da ke goyan bayan zinc Layer gaba ɗaya kuma ya rabu da shi. substrate, wato Wayar tagulla ta faɗo.

Wani yanayi kuma shi ne cewa babu matsala tare da sigogi na etching na PCB, amma wankewa da bushewa ba su da kyau bayan etching, yana sa wayar tagulla ta kewaye da sauran maganin etching a saman PCB. Idan ba a sarrafa ta na dogon lokaci ba, zai kuma haifar da wuce gona da iri na wayar tagulla. jan karfe.

Wannan yanayin gabaɗaya yana mai da hankali kan layukan bakin ciki, ko kuma lokacin da yanayi yake da ɗanshi, lahani iri ɗaya zai bayyana akan PCB gabaɗaya. Cire wayar tagulla don ganin kalar fuskar da ke hulɗa da ita da tushe (abin da ake kira roughened surface) ya canza, wanda ya bambanta da na tagulla na al’ada. Launin foil ɗin ya bambanta, ana ganin asalin launi na tagulla na ƙasa, kuma ƙarfin bawon tagulla a layin mai kauri shima al’ada ne.

2). A cikin tsarin samar da PCB, karo na faruwa a cikin gida, kuma an raba waya ta jan ƙarfe daga maƙallan ta hanyar ƙarfin waje.

Wannan mummunan aikin yana da matsala tare da sakawa, kuma wayar tagulla za ta kasance a fili ta karkace, ko tabo ko alamun tasiri a cikin hanya guda. Idan ka kware wayar tagulla a ɓangaren da ba ta da lahani, ka dubi ƙaƙƙarfan fuskar tagulla, za ka ga cewa launin tagulla na tagulla na al’ada ne, ba za a sami yashwar gefe ba, da ƙarfin bawo. na tagulla foil ne na al’ada.

3). Tsarin kewaye na PCB bai dace ba.

Yin amfani da foil mai kauri mai kauri don zayyana da’ira mai sirara kuma zai haifar da wulakancin da’ira da zubar da tagulla.

2. Dalilai na tsarin samar da laminate:

A karkashin yanayi na al’ada, murfin jan karfe da prepreg za a haɗa su gaba ɗaya idan dai babban ɓangaren zafin jiki na laminate yana da zafi sama da mintuna 30, don haka latsawa gabaɗaya ba zai shafi ƙarfin haɗin gwiwa na bangon jan karfe da substrate a cikin laminate. Duk da haka, a cikin aiwatar da stacking da stacking laminates, idan PP gurbatawa ko jan karfe foil m surface lalacewa, shi kuma zai haifar da kasa bonding da karfi tsakanin jan karfe da substrate bayan lamination, sakamakon sakawa sabawa (kawai ga manyan faranti) ) Ko kuma. wayoyi na jan karfe na lokaci-lokaci suna faɗuwa, amma ƙarfin bawon tagulla kusa da kashe wayoyi ba zai zama na al’ada ba.

3. Dalilan laminate raw kayan:

1). Kamar yadda aka ambata a sama, talakawa electrolytic foils na jan karfe duk kayayyakin da aka yi galvanized ko tagulla-plated. Idan kololuwar darajar ulun ulu ba ta da kyau yayin samarwa, ko kuma lokacin da aka yi da galvanized / jan karfe, rassan kristal plating ba su da kyau, yana haifar da bangon jan ƙarfe da kansa Ƙarfin peeling bai isa ba. Bayan an ƙera kayan da aka matse mara kyau zuwa PCB, wayar tagulla za ta faɗi lokacin da wani ƙarfi na waje ya shafe ta lokacin da aka toshe ta cikin masana’antar lantarki. Irin wannan mummunan rashin amincewa da jan ƙarfe ba zai sami gurɓatawar gefe ba yayin da ake kwasar wayar tagulla don ganin ƙaƙƙarfan farfajiyar tagulla (wato, farfajiyar lamba tare da substrate), amma ƙarfin peeling na gabaɗayan tagulla zai kasance sosai. matalauta.

2). Rashin dacewa da foil na jan karfe da guduro: Wasu laminates da ke da kaddarori na musamman, kamar zanen HTG, ana amfani da su a halin yanzu. Saboda tsarin guduro daban-daban, wakili mai warkarwa da ake amfani da shi gabaɗaya guduro ne na PN, kuma tsarin sarkar guduro mai sauƙi ne. Matsayin haɗin giciye yana da ƙasa, kuma wajibi ne a yi amfani da foil na tagulla tare da tsayi na musamman don daidaita shi. Bakin jan karfe da ake amfani da shi wajen samar da laminai bai yi daidai da tsarin guduro ba, wanda ke haifar da rashin isasshen ƙarfin kwasfa na foil ɗin ƙarfe da aka lulluɓe, da zubar da waya mara kyau na tagulla yayin toshewa.