The PCB ucingo lobhedu luyawa (oko kukuthi, kudla ngokuthiwa ubhedu lulahlwa), kwaye zonke iimpawu zePCB ziya kuthi yingxaki nge-laminate kwaye zifuna izityalo zabo zemveliso ukuba zithwale ilahleko embi. Ngokweminyaka yamava ekusingatheni izikhalazo zabathengi, izizathu eziqhelekileyo zokulahlwa kwePCB zezi zilandelayo:

1. Izinto zenkqubo yomzi-mveliso we-PCB:

1). Ukufakwa ngokugqithisileyo kwefoyile yobhedu.

Ifoyile yobhedu ye-electrolytic esetyenziswa emarikeni idla ngokuba yigalvanized enecala elinye (eyaziwa ngokuba yifoyile yothuthu) kunye necala elinye lecwecwe lobhedu (eyaziwa ngokuba yifoyile ebomvu). Iifoyile zobhedu eziqhelekileyo zidla ngokuba yifoyile yobhedu eyenziwe ngamazi ngaphezulu kwe-70um, ifoyile ebomvu kunye ne-18um. Le foil ilandelayo yothuthu ayinakho ukwaliwa kobhedu lwebhetshi. Xa uyilo lwesekethe lungcono kunomgca we-etching, ukuba iinkcukacha ze-foil yobhedu zitshintshwa ngaphandle kokutshintsha i-parameters etching, oku kuya kubangela ukuba i-foil yobhedu ihlale kwisisombululo se-etching ixesha elide.

Ngenxa yokuba i-zinc ekuqaleni iyintsimbi esebenzayo, xa ucingo lobhedu kwi-PCB lufakwe kwisisombululo se-etching ixesha elide, luya kubangela ukubola kwecala eligqithisileyo lesekethe, okubangela ukuba isekethe enqabileyo exhasa i-zinc layer ukuba isabele ngokupheleleyo kwaye yahlulwe. i-substrate, oko kukuthi, ucingo lobhedu luyawa.

Enye imeko kukuba akukho ngxaki PCB etching parameters, kodwa ukuhlamba kunye nokoma akulunganga emva etching, ebangela ucingo lobhedu ukuba singqongwe isisombululo etching eseleyo kumphezulu PCB. Ukuba ayicutshungulwanga ixesha elide, oko kuya kubangela ukubaleka okugqithisileyo kwecala locingo lobhedu. ubhedu.

Le meko idla ngokugxila kwimigca ebhityileyo, okanye xa imozulu ifumile, iziphene ezifanayo ziya kuvela kwiPCB yonke. Hlubula ucingo lobhedu ukuze ubone ukuba umbala wendawo yokudibanisa kunye nomgangatho wesiseko (into ebizwa ngokuba yi-roughened surface) itshintshile, eyahlukileyo kuleyo yobhedu oluqhelekileyo. Umbala we-foil uhlukile, umbala wobhedu wokuqala womgangatho ongezantsi ubonwa, kwaye amandla okukhupha i-foil yobhedu kumgca obunzima nawo aqhelekileyo.

2). Kwinkqubo yokuvelisa i-PCB, ukungqubana kwenzeka kwindawo, kwaye ucingo lobhedu luhlukaniswe kwi-substrate ngamandla angaphandle omatshini.

Lo msebenzi ombi unengxaki yokubeka, kwaye ucingo lobhedu luya kuphonswa ngokucacileyo, okanye ukukrazula okanye iimpawu zempembelelo kwicala elifanayo. Ukuba uxobula ucingo lobhedu kwindawo enesiphene kwaye ujonge kwindawo erhabaxa yefoyile yobhedu, unokubona ukuba umbala wobuso oburhabaxa befoyile yobhedu uyinto eqhelekileyo, akuyi kubakho ukukhukuliseka kwecala, kunye namandla okuxobula. yefoyile yobhedu iqhelekile.

3). Uyilo lwesekethe yePCB alunangqiqo.

Ukusebenzisa ifoyile yobhedu engqindilili ukuyila isekethe ebhityileyo kakhulu kuya kubangela ukubaleka okugqithisileyo kwesekethe kunye nokulahla ubhedu.

2. Izizathu zenkqubo yokwenziwa kwelaminate:

Kwiimeko eziqhelekileyo, i-foil yobhedu kunye ne-prepreg iya kudibaniswa ngokupheleleyo nje kuphela icandelo lobushushu obuphezulu be-laminate lishushu licinezelwe ngaphezu kwemizuzu engama-30, ngoko ke ukucinezela akuyi kuchaphazela amandla okubambisana kwefoyile yobhedu kunye i-substrate kwi-laminate. Nangona kunjalo, kwinkqubo yokupakisha kunye nokupakisha i-laminates, ukuba ungcoliseko lwePP okanye ifoyile yobhedu umonakalo orhabaxa womphezulu, iya kubangela ukungonelanga kwamandla okudibanisa phakathi kwefoyile yobhedu kunye ne-substrate emva kokulaliswa, okukhokelela ekuphambukeni kokubeka (kuphela kumacwecwe amakhulu) iingcingo zobhedu ezixhaphakileyo ziyawa, kodwa amandla axobukayo wefoyile yobhedu kufuphi neengcingo ezivaliweyo akasayi kuba yinto engaqhelekanga.

3. Izizathu ze-laminate ekrwada:

1). Njengoko kukhankanyiwe ngasentla, iifoyile zobhedu eziqhelekileyo ze-electrolytic zizo zonke iimveliso ezifakwe igalvanized okanye i-copper-plated. Ukuba ixabiso lencopho yefoyile yoboya ayiqhelekanga ngexesha lemveliso, okanye xa i-galvanized/copper-plated, i-plating crystal amasebe amabi, ebangela ukuba i-foil yobhedu ngokwayo Amandla okuxobula akwanele. Emva kokuba icwecwe elibi elicinezelweyo lenziwe kwiPCB, ucingo lobhedu luya kuwa xa luchatshazelwa ngamandla angaphandle xa lufakwe kumzi-mveliso wombane. Olu hlobo lokwaliwa kobhedu olubi aluyi kuba nomhlwa ocacileyo wecala xa uxobula ucingo lobhedu ukuze ubone indawo erhabaxa yefoyile yobhedu (oko kukuthi, umphezulu wokudibana kunye ne-substrate), kodwa amandla okuxobula yonke ifoyile yobhedu iya kuba kakhulu. ihlwempu.

2). Ukulungelelaniswa okungalunganga kwefoyile yobhedu kunye ne-resin: Ezinye iilaminates ezineempawu ezikhethekileyo, ezifana namaphepha e-HTG, asetyenziswa ngoku. Ngenxa yeenkqubo ezahlukeneyo ze-resin, i-ejenti yokunyanga esetyenziswayo ngokuqhelekileyo i-PN resin, kwaye i-resin ye-molecular chain structure ilula. Iqondo lokudibanisa i-cross-link liphantsi, kwaye kuyimfuneko ukusebenzisa i-foil yobhedu kunye ne-peak ekhethekileyo ukuyifanisa. I-foil yobhedu esetyenziselwa ukuveliswa kwee-laminates ayihambelani nenkqubo ye-resin, okubangela ukungonelanga kwamandla e-peel ye-sheet metal-clad metal foil, kunye nokuchithwa kocingo lobhedu olubi ngexesha le-plug-in.