Intshayelelo

Ngaphandle kokukhula ngokukhawuleza kwe PCB Itekhnoloji, abavelisi abaninzi be-PCB bajolise kwimveliso yebhodi ye-HDI, ibhodi eguqukayo eqinileyo, umva kunye nezinye iindawo zebhodi ezinzima, kodwa kusekho iiPCBS ezinesekethe elula, ubungakanani beyunithi encinci kunye nemilo entsonkothileyo kwimakethi esele ikho, kwaye ubuncinci ubungakanani bezinye iiPCBS buncinci njenge-3-4mm. Ke ngoko, ubungakanani beyunithi yeepleyiti zeklasi zincinci kakhulu, kwaye imingxunya yokuma ayinakuyilwa ngexesha loyilo lwangaphambili. Kulula ukuvelisa amanqaku omphetho weplate (njengoko kubonisiwe kwi-FIG. 1) ngokusebenzisa indlela yokuma yangaphandle, i-PCB ye-vacuum ngexesha lokuqhubekeka, ukunyamezelana okungalawulekiyo, ukusebenza kakuhle kwemveliso kunye nezinye iingxaki. Kweli phepha, ukuveliswa kwe-PCB yesayizi encinci kuncitshisiwe kwaye kuvavanywa ngokunzulu, indlela yokulungisa imilo ilungiselelwe, kwaye isiphumo siphindwe kabini sisisiqingatha somgudu kwinkqubo yokwenyani yemveliso.

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

1. Uhlalutyo lobume

Ukhetho imo machining imilo enxulumene ulawulo ukumelana ulawulo, iindleko machining imilo, imilo machining ukusebenza njalo njalo. Okwangoku, iindlela eziqhelekileyo processing imilo yokugaya imilo kunye fa.

1.1 yokugaya imilo

Ukuthetha jikelele, umgangatho imbonakalo ipleyiti kusingathwa imilo yokugaya kulungile, kunye nokuchaneka mbini iphezulu. Nangona kunjalo, ngenxa yobungakanani obuncinci beplate, ukuchaneka kwemilinganiselo yokuloba kunzima ukulawula. Xa ubume bokugaya, ngenxa yegong ngaphakathi kwe-arc, i-gong Angle ngaphakathi komda wobungakanani kunye nobubanzi be-groove, ukhetho lobungakanani be-cutter lunemida enkulu, ixesha elininzi linokukhetha kuphela i-1.2 mm kunye ne-1.0 mm, i-0.8 mm okanye i-cutter cutter Ukulungiswa, kuba isixhobo sokusika sincinci kakhulu, isantya sokondla umda, sikhokelela kwimveliso yokusebenza iphantsi, kwaye iindleko zokuvelisa ziphezulu kakhulu, ke zilungele isixa esincinci, Inkangeleko elula, akukho gongs zangaphakathi zePCB ukuvela kwembonakalo.

Ngowe-1.2

Kwinkqubo yobungakanani obukhulu bePCB encinci, ifuthe lokusebenza kwemveliso esezantsi liphezulu kakhulu kunefuthe lokugaya indleko, kule meko, kuphela kwendlela yokwamkela ukufa. Kwangelo xesha, kwii-gongs zangaphakathi kwi-PCB, abanye abathengi bafuna ukuba ziqhubekeke kwii-engile ezilungileyo, kwaye kunzima ukuhlangabezana neemfuno zokomba kunye nokugaya, ngakumbi ezo PCB zineemfuno eziphezulu zokunyamezelana kwemilo kunye nokuma kwemilo, Kuyimfuneko ngakumbi ukwamkela indlela yokunyathela. Sebenzisa inkqubo yokufa kuphela kuyonyusa iindleko zokuvelisa.

Uyilo lovavanyo

Ngokusekwe kumava ethu emveliso yolu hlobo lwe-PCB, siwenzile uphando olunzulu kunye nemifuniselo evela kwimimandla yokugaya imilo yokugaya, ukunyathela isitampu, i-V-cut njalo njalo. Isicwangciso sokulinga esithile sibonisiwe kwiTheyibhile 1 engezantsi:

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

3. Inkqubo yovavanyo

3.1 Inkqubo 1 -ujikelezo lwe-gong yomatshini wokugaya

Olu hlobo lwe-PCB enobukhulu obuncinci ubukhulu becala ngaphandle kokumiswa ngaphakathi, olufuna imingxunya yokuma eyongeziweyo kwiyunithi (umzobo 2). Xa ukuphela kwamacala amathathu eentsimbi, icala lokugqibela leentsimbi, kukho iindawo ezivulekileyo ezijikeleze ibhodi, ukuze indawo yokusika ingabinakucinezelwa, imveliso egqityiweyo iphela ngolwalathiso lokusika into yokusika , Ukuze imveliso egqityiweyo imile kwindawo yokusika yenqaku le-convex ebonakalayo. Ngenxa yokuba onke amacala ebesilele kurhulumente onqunyanyisiweyo, akukho nkxaso, oko ke kuyonyusa ukubakho kwamaqhuma kunye neebrey. Ukuthintela oku kungagqibeki komgangatho, kuyimfuneko ukwandisa ibhande le-gong ngokugaya ipleyiti kabini, ukugaya inxenye yeyunithi nganye kuqala ukuqinisekisa ukuba kusekho uqhagamshelo emva kokuqhubekeka ukudibanisa ifayile yeprofayile iyonke (UMZEKELISO. 3).

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

Impembelelo yolingo lwe-gong machining kwinqanaba le-convex: ezi ntlobo zimbini zingentla zenziwe ngebhanti, iziqwenga ezili-10 zepleyiti egqityiweyo zikhethwe ngokungacwangciswanga phantsi kwemeko nganye, kwaye inqaku le-convex lalinganiswa kusetyenziswa into ye-quadratic. Ubungakanani be-convex yobungakanani bepleyiti egqityiweyo eqhutywe ngebhanti yentsimbi yoqobo inkulu kwaye ifuna ukwenziwa ngesandla. Inqaku le-convex linokuthintelwa ngokufanelekileyo ngokusebenzisa iigongs ezenziwe ngomatshini. 0.1mm, ukuhlangabezana neemfuno zomgangatho (jonga kwiTheyibhile 2), inkangeleko ibonakalisiwe kuMzobo 4, 5.

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

3.2 Isicwangciso 2 – Umatshini wokukrola ococekileyo wemilo

Njengoko izixhobo zokukrola zingenakunqunyanyiswa ngexesha lokulungiswa, ibhanti yegong kuMfanekiso 3 ayinakusetyenziswa. Ngokwimveliso yebhanti ye-gong kuMzobo 2, ngenxa yesayizi encinci yokuqhubekeka, ukuthintela ipleyiti egqityiweyo ukuba ingagutyulwa ngexesha lokuqhubekeka, kufuneka ucime ukucoca ngexesha lokulungisa, kwaye usebenzise ipleyiti uthuthu ukuyilungisa, ukwenzela ukunciphisa ukuveliswa kwamanqaku e-convex.

Iziphumo zokuvavanywa kokulungiswa kokukrola kwinqanaba le-convex: ubungakanani benqaku le-convex bunokuncitshiswa ngokuqhubekeka ngokwendlela yokusebenza engentla. Ubungakanani benqaku le-convex kubonisiwe kwiTheyibhile 3. Inqaku le-convex alinakho ukuhlangabezana neemfuno zomgangatho, ngenxa yoko lifuna ukuqhubekeka ngesandla. Inkangeleko ibonakalisiwe kumzobo 6:

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

3.3 Scheme 3 -Ukuqinisekiswa kwesiphumo seLaser

Khetha iimveliso ezinobungakanani bangaphandle be-1 * 3mm kuvavanyo, yenza iifayile zeprofayili ye-laser ecaleni kwemigca yangaphandle, ngokweeparameter ezikwiTheyibhile 4, cima ukucoca (ukunqanda ipleyiti ukuba ingafunxwa ngexesha lokulungiswa), kwaye uqhube kabini iprofayile ye-laser esecaleni.

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

Iziphumo: ukumila kokulungiswa kwe-laser ebhodini ngaphandle kweemveliso ezinamaqhuqhuva, ubungakanani bokuqhubekeka bunokuhlangabezana neemfuno, kodwa i-laser emva kokumila kwemveliso egqityiweyo yongcoliseko lomphezulu omnyama wekhabhoni, kwaye olu hlobo longcoliseko ngenxa yobungakanani lincinci kakhulu, alunako sebenzisa ukucocwa kweplasma, sebenzisa utywala ukucoca akunakuphatha ngokufanelekileyo (jonga umfanekiso 7), ezo ziphumo zokulungisa zinokuhlangabezana neemfuno zabathengi.

3.4 Scheme 4 -Ukuqinisekiswa kokufa

Ukulungiswa kokufa kuqinisekisa ukuchaneka kobungakanani kunye nokumila kwamalungu okunyathela, kwaye akukho ndawo ye-convex (njengoko kubonisiwe kumzobo we-8). Nangona kunjalo, kwinkqubo yoomatshini, kulula ukuvelisa ukonzakala okungaqhelekanga kokucinezelwa kwekona (njengoko kubonisiwe kwi-FIG. 9). Iziphene ezingaqhelekanga azamkelekanga.

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

3.5 isishwankathelo

Ingxoxo kuyilo lobume bokuchaneka okuphezulu kunye nePCB encinci

4. Isiphelo

Eli phepha lijolise kwiingxaki ezikumgangatho ophezulu wokuchaneka kunye neesayizi ezincinci zePCB ezinobume bokunyamezelana kwemilo +/- 0.1mm. Logama uyilo olusengqiqweni lwenziwe kwinkqubo yedatha yobunjineli kunye nendlela efanelekileyo yokusebenza ikhethwe ngokuhambelana nezinto zePCB kunye neemfuno zabathengi, iingxaki ezininzi ziya kusonjululwa ngokulula.